MT48LC2M32B2B5-7 IT:G

IC DRAM 64MBIT PAR 90VFBGA
Part Description

IC DRAM 64MBIT PAR 90VFBGA

Quantity 813 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package90-VFBGA (8x13)Memory FormatDRAMTechnologySDRAM
Memory Size64 MbitAccess Time5.5 nsGradeIndustrial
Clock Frequency143 MHzVoltage3V ~ 3.6VMemory TypeVolatile
Operating Temperature-40°C ~ 85°C (TA)Write Cycle Time Word Page14 nsPackaging90-VFBGA
Mounting MethodVolatileMemory InterfaceParallelMemory Organization2M x 32
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0002

Overview of MT48LC2M32B2B5-7 IT:G – IC DRAM 64MBIT PAR 90VFBGA

The MT48LC2M32B2B5-7 IT:G is a 64 Mbit SDR SDRAM organized as 2M × 32 with a parallel memory interface in a 90-ball VFBGA (8 mm × 13 mm) package. It provides fully synchronous DRAM operation with internal banking and pipelined access for systems requiring a compact, parallel SDRAM solution.

Key attributes include a 143 MHz clock frequency, 3.0–3.6 V supply range (single 3.3 V ±0.3 V), an industrial operating temperature range of −40°C to +85°C, and timing options that support programmable burst lengths and selectable CAS latencies.

Key Features

  • Memory Architecture 64 Mbit capacity organized as 2M × 32 with 4 internal banks (512K × 32 × 4 banks).
  • SDR SDRAM Core Fully synchronous operation with all signals registered on the positive edge of the system clock and internal pipelined operation for column-address changes every clock cycle.
  • Performance & Timing Clock frequency listed at 143 MHz with an access time of 5.5 ns; supports CAS latencies (CL) of 1, 2, and 3 and programmable burst lengths of 1, 2, 4, 8 or full page.
  • Refresh and Power Modes Auto refresh and self-refresh modes (self refresh not available on AT devices); 64 ms/4096-cycle refresh supported for commercial and industrial grades.
  • Interface & I/O Parallel memory interface with LVTTL-compatible inputs and outputs (per datasheet feature listing).
  • Supply Voltage Single supply operation at 3.0 V to 3.6 V (3.3 V ±0.3 V specified).
  • Package 90-ball VFBGA, 8 mm × 13 mm footprint (Supplier device package: 90-VFBGA (8×13)).
  • Temperature Range Industrial operating temperature: −40°C to +85°C (TA).

Unique Advantages

  • Compact BGA footprint: 90-ball VFBGA (8×13) enables space-constrained board designs while delivering parallel SDRAM capacity.
  • Flexible timing and burst control: Programmable burst lengths and support for multiple CAS latencies allow tuning for system timing and throughput requirements.
  • Industrial temperature tolerance: Specified operation from −40°C to +85°C supports deployment in industrial environments.
  • Single 3.3 V supply: Operates across a 3.0–3.6 V range (3.3 V ±0.3 V), simplifying power-rail design in legacy 3.3 V systems.
  • Synchronous, pipelined access with internal banks: Internal bank architecture and pipelined operation help optimize row/column access sequencing within parallel SDRAM systems.

Why Choose MT48LC2M32B2B5-7 IT:G?

The MT48LC2M32B2B5-7 IT:G positions itself as a compact, industrial-temperature SDR SDRAM option for designs that require 64 Mbit of parallel DRAM in a small VFBGA package. Its combination of synchronous pipelined architecture, selectable CAS latency, and programmable burst lengths provides timing flexibility for a range of system requirements.

Engineers specifying this device benefit from straightforward 3.3 V supply integration, a defined industrial temperature window, and an established SDRAM feature set (auto refresh, self-refresh, internal banks) that supports reliable memory operation in embedded applications where a parallel SDRAM interface is required.

Request a quote or submit an inquiry to receive pricing and lead-time information for the MT48LC2M32B2B5-7 IT:G.

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