MT48LC2M32B2B5-7 IT:G
| Part Description |
IC DRAM 64MBIT PAR 90VFBGA |
|---|---|
| Quantity | 813 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 90-VFBGA (8x13) | Memory Format | DRAM | Technology | SDRAM | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 64 Mbit | Access Time | 5.5 ns | Grade | Industrial | ||
| Clock Frequency | 143 MHz | Voltage | 3V ~ 3.6V | Memory Type | Volatile | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Write Cycle Time Word Page | 14 ns | Packaging | 90-VFBGA | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 2M x 32 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.0002 |
Overview of MT48LC2M32B2B5-7 IT:G – IC DRAM 64MBIT PAR 90VFBGA
The MT48LC2M32B2B5-7 IT:G is a 64 Mbit SDR SDRAM organized as 2M × 32 with a parallel memory interface in a 90-ball VFBGA (8 mm × 13 mm) package. It provides fully synchronous DRAM operation with internal banking and pipelined access for systems requiring a compact, parallel SDRAM solution.
Key attributes include a 143 MHz clock frequency, 3.0–3.6 V supply range (single 3.3 V ±0.3 V), an industrial operating temperature range of −40°C to +85°C, and timing options that support programmable burst lengths and selectable CAS latencies.
Key Features
- Memory Architecture 64 Mbit capacity organized as 2M × 32 with 4 internal banks (512K × 32 × 4 banks).
- SDR SDRAM Core Fully synchronous operation with all signals registered on the positive edge of the system clock and internal pipelined operation for column-address changes every clock cycle.
- Performance & Timing Clock frequency listed at 143 MHz with an access time of 5.5 ns; supports CAS latencies (CL) of 1, 2, and 3 and programmable burst lengths of 1, 2, 4, 8 or full page.
- Refresh and Power Modes Auto refresh and self-refresh modes (self refresh not available on AT devices); 64 ms/4096-cycle refresh supported for commercial and industrial grades.
- Interface & I/O Parallel memory interface with LVTTL-compatible inputs and outputs (per datasheet feature listing).
- Supply Voltage Single supply operation at 3.0 V to 3.6 V (3.3 V ±0.3 V specified).
- Package 90-ball VFBGA, 8 mm × 13 mm footprint (Supplier device package: 90-VFBGA (8×13)).
- Temperature Range Industrial operating temperature: −40°C to +85°C (TA).
Unique Advantages
- Compact BGA footprint: 90-ball VFBGA (8×13) enables space-constrained board designs while delivering parallel SDRAM capacity.
- Flexible timing and burst control: Programmable burst lengths and support for multiple CAS latencies allow tuning for system timing and throughput requirements.
- Industrial temperature tolerance: Specified operation from −40°C to +85°C supports deployment in industrial environments.
- Single 3.3 V supply: Operates across a 3.0–3.6 V range (3.3 V ±0.3 V), simplifying power-rail design in legacy 3.3 V systems.
- Synchronous, pipelined access with internal banks: Internal bank architecture and pipelined operation help optimize row/column access sequencing within parallel SDRAM systems.
Why Choose MT48LC2M32B2B5-7 IT:G?
The MT48LC2M32B2B5-7 IT:G positions itself as a compact, industrial-temperature SDR SDRAM option for designs that require 64 Mbit of parallel DRAM in a small VFBGA package. Its combination of synchronous pipelined architecture, selectable CAS latency, and programmable burst lengths provides timing flexibility for a range of system requirements.
Engineers specifying this device benefit from straightforward 3.3 V supply integration, a defined industrial temperature window, and an established SDRAM feature set (auto refresh, self-refresh, internal banks) that supports reliable memory operation in embedded applications where a parallel SDRAM interface is required.
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