MT48LC4M32B2P-7 IT:G

IC DRAM 128MBIT PAR 86TSOP II
Part Description

IC DRAM 128MBIT PAR 86TSOP II

Quantity 1,582 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package86-TSOP IIMemory FormatDRAMTechnologySDRAM
Memory Size128 MbitAccess Time5.5 nsGradeIndustrial
Clock Frequency143 MHzVoltage3V ~ 3.6VMemory TypeVolatile
Operating Temperature-40°C ~ 85°C (TA)Write Cycle Time Word Page14 nsPackaging86-TFSOP (0.400", 10.16mm Width)
Mounting MethodVolatileMemory InterfaceParallelMemory Organization4M x 32
Moisture Sensitivity Level2 (1 Year)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0002

Overview of MT48LC4M32B2P-7 IT:G – IC DRAM 128MBIT PAR 86TSOP II

The MT48LC4M32B2P-7 IT:G is a 128 Mbit SDRAM organized as 4M × 32 with a parallel memory interface. It provides a 32-bit data path in an 86-TSOP II package and is designed for systems that require fast volatile DRAM storage.

Key performance attributes include a 143 MHz clock frequency, 5.5 ns access time and a 14 ns write cycle time, with operation across a 3.0 V to 3.6 V supply and an ambient temperature range of -40°C to 85°C.

Key Features

  • Core / Memory 128 Mbit SDRAM organized as 4M × 32 for a 32-bit data bus.
  • Performance 143 MHz clock frequency with 5.5 ns access time and 14 ns write cycle time for responsive memory operations.
  • Memory Interface Parallel DRAM interface suitable for designs requiring parallel data transfers.
  • Power Operates from a 3.0 V to 3.6 V supply range.
  • Package 86-TSOP II / 86-TFSOP package (0.400", 10.16 mm width) for compact board-level integration.
  • Temperature Range Rated for operation from -40°C to 85°C (TA).
  • Memory Type / Format Volatile DRAM suitable for temporary storage and buffering.

Typical Applications

  • Embedded systems — Provides parallel SDRAM storage where a 32-bit data path and moderate capacity are required for runtime data and buffering.
  • Board-level memory expansion — Used to add 128 Mbit of volatile memory in compact systems that require TSOP II packaging.
  • Industrial and commercial electronics — Supports operation across -40°C to 85°C for temperature-challenged environments.

Unique Advantages

  • 32-bit wide organization: 4M × 32 arrangement enables parallel data transfers and straightforward integration with 32-bit memory buses.
  • Fast access and cycle times: 5.5 ns access time and 14 ns write cycle time minimize latency for memory operations.
  • High clock capability: 143 MHz clock frequency supports higher throughput in parallel SDRAM configurations.
  • Compact TSOP II package: 86-TSOP II (10.16 mm width) reduces board footprint while maintaining pinout density.
  • Wide operating voltage: 3.0 V to 3.6 V supply compatibility for 3 V-class system designs.
  • Extended ambient temperature: Rated for -40°C to 85°C to suit a range of environmental conditions.

Why Choose IC DRAM 128MBIT PAR 86TSOP II?

The MT48LC4M32B2P-7 IT:G delivers a balanced combination of capacity, parallel bandwidth and low-latency access in a compact 86-TSOP II footprint. Its 4M × 32 organization, 143 MHz clock rate and sub-6 ns access time make it suitable for designs that require responsive, volatile SDRAM storage at a 32-bit data width.

With a 3.0–3.6 V supply range and -40°C to 85°C ambient rating, this Micron Technology Inc. device targets applications where board-level integration, predictable timing and extended temperature operation are priorities.

Request a quote or submit an inquiry to receive pricing and availability information for the MT48LC4M32B2P-7 IT:G.

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