MT48LC8M16A2B4-75 IT:G

The MT48LC8M16A2B4-75 IT:G is a 128 Mbit synchronous DRAM (SDRAM) device organized as 8M × 16 with a parallel memory interface. It implements fully synchronous, pipelined SDRAM architecture with internal banks, programmable burst lengths and standard SDRAM control features.

Designed for systems requiring PC100/PC133‑compliant SDRAM behavior at a 133 MHz clock rate and a single 3.3 V supply, this device targets applications and designs that need compact, industrial‑temperature SDRAM in a 54‑VFBGA (8×8 mm) package.

Key Features

• Memory Architecture — 128 Mbit SDRAM organized as 8M × 16 with four internal banks for pipelined operation and improved row access management.
• Performance — PC133‑compliant timing for 133 MHz operation; -75 speed grade targets 3‑3‑3 timing (RCD/RP/CL = 20 ns each) for predictable latency.
• Synchronous Operation — Fully synchronous device with all signals registered on the positive edge of the system clock and internal pipelining allowing column address changes every clock cycle.
• Burst and Refresh Controls — Programmable burst lengths (1, 2, 4, 8 or full page); auto refresh (64 ms / 4096 cycles for commercial/industrial) and self‑refresh modes including a low‑power option per datasheet.
• Interface and I/O — Parallel memory interface with LVTTL‑compatible inputs and outputs for standard SDRAM signal levels.
• Power — Single 3.3 V nominal supply with specified operating range 3.0 V to 3.6 V.
• Package and Temperature — 54‑ball VFBGA package (8 mm × 8 mm) in an industrial temperature grade rated for −40 °C to +85 °C (TA).

Typical Applications

• PC and legacy system memory — Suitable for implementations requiring PC100/PC133‑compliant SDRAM behavior at 133 MHz clock rates.
• Industrial embedded systems — Industrial temperature rating (−40 °C to +85 °C) supports memory use in temperature‑sensitive embedded equipment.
• Compact board designs — 54‑VFBGA (8×8 mm) package enables high‑density placement where board real estate is constrained.

Unique Advantages

• Industry‑standard timing compatibility — PC100/PC133 compliance and defined CL/RCD/RP timings simplify integration with existing SDRAM controllers.
• Flexible burst and refresh options — Programmable burst lengths and multiple refresh/self‑refresh modes provide adaptability for varied memory access patterns and power conditions.
• Compact BGA package — 54‑ball VFBGA (8×8 mm) package offers a small footprint for space‑constrained PCBs.
• Industrial temperature support — Specified operation from −40 °C to +85 °C for use in industrial environments.
• Single 3.3 V supply — Standard 3.3 V ±0.3 V supply range aligns with common SDRAM power rails for straightforward system power design.

Why Choose IC DRAM 128MBIT PAR 54VFBGA?

The MT48LC8M16A2B4-75 IT:G delivers a compact, industrial‑grade SDRAM option with PC133‑level timing, standard LVTTL I/O, and flexible burst/refresh controls—making it a practical choice for systems that require proven SDRAM behavior in a small VFBGA package. Its 8M × 16 organization and 3.3 V supply simplify integration into designs that expect classic SDRAM timing and control.

This Micron SDRAM device is suited to engineers specifying memory for industrial embedded applications, legacy PC‑compatible subsystems, and compact boards where footprint and temperature range are critical considerations. The device’s documented timing and refresh options support predictable system performance and long‑term design stability.

Request a quote or submit a product availability inquiry to obtain pricing and lead‑time information for the MT48LC8M16A2B4-75 IT:G.