MT53D1024M32D4DT-053 AIT:D TR
| Part Description |
IC DRAM 32GBIT 1.866GHZ 200VFBGA |
|---|---|
| Quantity | 476 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 200-VFBGA (10x14.5) | Memory Format | DRAM | Technology | SDRAM - Mobile LPDDR4 | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 32 Gbit | Access Time | N/A | Grade | Automotive | ||
| Clock Frequency | 1.866 GHz | Voltage | 1.1V | Memory Type | Volatile | ||
| Operating Temperature | -40°C ~ 95°C (TC) | Write Cycle Time Word Page | N/A | Packaging | 200-VFBGA | ||
| Mounting Method | Volatile | Memory Interface | N/A | Memory Organization | 1G x 32 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | AEC-Q100 | ECCN | EAR99 | HTS Code | 8542.32.0036 |
Overview of MT53D1024M32D4DT-053 AIT:D TR – IC DRAM 32Gbit 1.866GHz 200-VFBGA
The MT53D1024M32D4DT-053 AIT:D TR is a volatile SDRAM device implemented in Mobile LPDDR4 technology with a 32 Gbit density organized as 1G × 32. It operates at a clock frequency of 1.866 GHz and uses a 1.1 V supply.
Designed for integration where compact, high-density LPDDR4 memory is required, the device is provided in a 200-VFBGA package (10 × 14.5) and carries AEC-Q100 qualification with an operating temperature range of −40 °C to 95 °C.
Key Features
- Memory Core Mobile LPDDR4 SDRAM architecture with a total capacity of 32 Gbit organized as 1G × 32.
- Clock Performance Rated clock frequency of 1.866 GHz to meet timing requirements for LPDDR4-class designs.
- Supply Voltage Low-voltage operation at 1.1 V to support power-sensitive applications.
- Package 200-VFBGA package with a 10 × 14.5 mm footprint for compact board integration.
- Temperature Range Qualified for operation from −40 °C to 95 °C (TC) to support extended-temperature deployments.
- Automotive Qualification AEC-Q100 qualification and an Automotive grade designation are provided in the device specification.
- Memory Type Volatile DRAM suitable for system memory and high-speed buffering roles.
Typical Applications
- Automotive Systems AEC-Q100 qualification and wide temperature range make the device suitable for automotive electronic modules that require LPDDR4 memory.
- Mobile and Handheld Devices Mobile LPDDR4 technology and 1.1 V operation provide a compact, low-voltage memory option for space-constrained mobile designs.
- Embedded Systems High-density 32 Gbit storage in a small 200-VFBGA package supports embedded platforms requiring large memory capacity in tight board spaces.
Unique Advantages
- High memory density: 32 Gbit capacity in a single device reduces board-level component count for large-memory designs.
- Compact packaging: 200-VFBGA (10 × 14.5 mm) package enables integration in size-constrained assemblies.
- Low-voltage operation: 1.1 V supply reduces system power draw compared to higher-voltage alternatives.
- Automotive-ready qualification: AEC-Q100 qualification and Automotive grade listing support use in regulated automotive environments.
- Extended temperature range: −40 °C to 95 °C (TC) supports deployment across a wide range of operating conditions.
- LPDDR4 performance class: 1.866 GHz clock rating aligns with LPDDR4 timing expectations for high-speed memory interfaces.
Why Choose IC DRAM 32GBIT 1.866GHZ 200VFBGA?
This LPDDR4 32 Gbit DRAM device balances high density, compact packaging, and low-voltage operation for designs that require significant memory capacity in constrained spaces. Its 1.866 GHz clock capability and 1.1 V supply make it suitable for systems targeting LPDDR4-class performance while minimizing power draw.
With AEC-Q100 qualification and an extended −40 °C to 95 °C operating range, the device is positioned for applications where reliability across temperature and industry qualification are important, including automotive and embedded systems that demand validated components and compact integration.
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