MT53D4G16D8AL-062 WT:E TR

IC DRAM 64GBIT 1.6GHZ SMD
Part Description

IC DRAM 64GBIT 1.6GHZ SMD

Quantity 379 Available (as of May 6, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device PackageN/AMemory FormatDRAMTechnologySDRAM - Mobile LPDDR4
Memory Size64 GbitAccess TimeN/AGradeIndustrial
Clock Frequency1.6 GHzVoltage1.1VMemory TypeVolatile
Operating Temperature-30°C ~ 85°C (TC)Write Cycle Time Word PageN/APackagingN/A
Mounting MethodVolatileMemory InterfaceN/AMemory Organization4G x 16
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unknown
QualificationN/AECCNOBSOLETEHTS CodeN/A

Overview of MT53D4G16D8AL-062 WT:E TR – IC DRAM 64GBIT 1.6GHZ SMD

The MT53D4G16D8AL-062 WT:E TR is a volatile DRAM device implementing mobile LPDDR4 SDRAM architecture with a 64 Gbit capacity. It is organized as 4G × 16 and operates at a clock frequency of 1.6 GHz with a 1.1 V supply.

This device is intended for designs that require high-density, high-speed mobile LPDDR4 memory and offers a specified operating temperature range of -30°C to 85°C for temperature-sensitive applications.

Key Features

  • Memory Core – Mobile LPDDR4 SDRAM Implements mobile LPDDR4 SDRAM technology suitable for systems requiring LPDDR4 architecture.
  • Capacity and Organization 64 Gbit total capacity organized as 4G × 16 to support high-density memory configurations.
  • High-Speed Operation Designed for a clock frequency of 1.6 GHz to support fast memory throughput requirements.
  • Low Voltage Supply Operates at a 1.1 V supply voltage, aligning with low-voltage mobile memory power domains.
  • Volatile DRAM Classified as volatile memory and provided in DRAM format for temporary data storage in active systems.
  • Extended Operating Temperature Specified to operate from -30°C to 85°C (TC), supporting use across a range of environmental conditions.

Typical Applications

  • Mobile Devices — High-density LPDDR4 memory for mobile platforms that require 64 Gbit capacity and 1.6 GHz operation.
  • Memory Modules and Subsystems — Component for high-density memory arrays using 4G × 16 organization to meet capacity targets.
  • Embedded and Portable Electronics — Low-voltage (1.1 V) DRAM for designs where power efficiency and compact memory are required.
  • Industrial Electronics — Applicable in applications needing memory components that operate across -30°C to 85°C.

Unique Advantages

  • Significant Density: 64 Gbit capacity enables consolidation of memory needs into fewer devices.
  • LPDDR4 Architecture: Mobile LPDDR4 implementation provides architecture-aligned behavior for mobile memory designs.
  • High Clock Rate: 1.6 GHz clock frequency supports higher-speed memory transactions where required.
  • Low Voltage Operation: 1.1 V supply reduces power domain requirements and supports low-power system design.
  • Wide Temperature Range: Specified -30°C to 85°C operation suited to a variety of environmental conditions.
  • Clear Component Identity: Manufactured by Micron Technology Inc., providing traceable sourcing information.

Why Choose MT53D4G16D8AL-062 WT:E TR?

The MT53D4G16D8AL-062 WT:E TR positions itself as a high-density, high-speed mobile LPDDR4 DRAM option providing 64 Gbit capacity in a 4G × 16 organization. Its 1.6 GHz clock rate and 1.1 V supply make it suitable for designs that balance performance and low-voltage operation within LPDDR4 architectures.

This device is appropriate for engineers and procurement teams targeting compact, high-capacity memory implementations in mobile, embedded, or industrial systems that require operation across -30°C to 85°C and prefer components from an established manufacturer, Micron Technology Inc.

Request a quote or contact sales to discuss availability, lead times, and pricing for the MT53D4G16D8AL-062 WT:E TR.

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