MTFC32GAKAEEF-AAT TR

IC FLASH 256GBIT MMC 169TFBGA
Part Description

IC FLASH 256GBIT MMC 169TFBGA

Quantity 418 Available (as of May 26, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package169-TFBGA (14x18)Memory FormatFLASHTechnologyFLASH - NAND
Memory Size256 GbitAccess TimeN/AGradeAutomotive
Clock FrequencyN/AVoltageN/AMemory TypeNon-Volatile
Operating Temperature-40°C ~ 105°C (TA)Write Cycle Time Word PageN/APackaging169-TFBGA
Mounting MethodNon-VolatileMemory InterfaceMMCMemory Organization32G x 8
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCN3A991B1AHTS Code8542.32.0071

Overview of MTFC32GAKAEEF-AAT TR – IC FLASH 256GBIT MMC 169TFBGA

The MTFC32GAKAEEF-AAT TR is a 256 Gbit non-volatile NAND flash memory device in Micron's e•MMC series. It implements a 32G × 8 memory organization and uses an MMC memory interface.

This device targets systems that require high-density on-board storage with a small-ball-grid package (169-TFBGA). It supports an extended ambient operating temperature range of -40°C to 105°C for applications needing broader temperature tolerance.

Key Features

  • Memory Type Non-volatile FLASH (NAND) memory format providing persistent data retention without power.
  • Capacity & Organization 256 Gbit total capacity organized as 32G × 8 for high-density storage.
  • Interface MMC memory interface provided by the e•MMC series for standard MMC connectivity.
  • Package 169-TFBGA package (14 × 18) offering a compact, ball-grid array footprint for space-constrained PCBs.
  • Operating Temperature Rated for ambient operation from -40°C to 105°C (TA), supporting applications with extended temperature requirements.
  • Series e•MMC™ series device, representing Micron's MMC-based embedded memory offering.

Typical Applications

  • Embedded Storage — Provides 256 Gbit of non-volatile NAND flash using an MMC interface for systems that need on-board persistent storage.
  • Industrial Equipment — The -40°C to 105°C operating range suits industrial applications requiring wider temperature tolerance.
  • Consumer Electronics — High-density 256 Gbit capacity in a 169-TFBGA package supports compact device designs with significant local storage needs.

Unique Advantages

  • High-density onboard storage: 256 Gbit capacity (32G × 8) enables substantial local data retention without external memory modules.
  • Compact package: 169-TFBGA (14 × 18) provides a small-footprint solution for space-constrained PCB layouts.
  • Standard MMC interface: e•MMC MMC interface simplifies integration into platforms that support MMC memory connectivity.
  • Extended temperature support: Rated -40°C to 105°C (TA) to accommodate applications operating across a wide ambient temperature range.
  • Non-volatile FLASH technology: NAND flash format ensures retained data without power, suitable for persistent storage requirements.

Why Choose MTFC32GAKAEEF-AAT TR?

The MTFC32GAKAEEF-AAT TR combines a high 256 Gbit NAND flash capacity with an MMC interface in a compact 169-TFBGA package, making it suitable for designs that need substantial persistent storage in a small footprint. Its specified -40°C to 105°C ambient operating range makes it applicable to systems that require broader temperature tolerance.

This device is well suited for engineers and procurement teams specifying embedded memory where capacity, package size, and MMC interface compatibility are primary selection criteria. The clear, verifiable specifications support straightforward evaluation for designs that require non-volatile flash storage.

Request a quote or contact sales to inquire about pricing, lead times, and availability for MTFC32GAKAEEF-AAT TR.

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