MTFC32GAKAEEF-AIT TR
| Part Description |
IC FLASH 256GBIT MMC 169TFBGA |
|---|---|
| Quantity | 1,116 Available (as of May 26, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
Specifications & Environmental
| Device Package | 169-TFBGA (14x18) | Memory Format | FLASH | Technology | FLASH - NAND | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 256 Gbit | Access Time | N/A | Grade | Industrial | ||
| Clock Frequency | N/A | Voltage | 2.7V ~ 3.6V | Memory Type | Non-Volatile | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 169-TFBGA | ||
| Mounting Method | Non-Volatile | Memory Interface | MMC | Memory Organization | 32G x 8 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | OBSOLETE | HTS Code | 8542.32.0071 |
Overview of MTFC32GAKAEEF-AIT TR – IC FLASH 256GBIT MMC 169TFBGA
The MTFC32GAKAEEF-AIT TR is a 256 Gbit non-volatile FLASH memory device from Micron Technology Inc., part of the e•MMC™ series. It uses NAND FLASH technology with a 32G × 8 memory organization and a standard MMC memory interface.
Designed for systems that require high-density, removable-standard MMC storage in a compact BGA package, this device provides a wide operating voltage range and an extended ambient temperature range for broad deployment scenarios.
Key Features
- Memory Density & Organization — 256 Gbit capacity organized as 32G × 8, delivering high-density non-volatile storage in a single device.
- Technology — FLASH - NAND memory in FLASH format suitable for MMC storage implementations.
- Interface — MMC memory interface; part of the e•MMC™ series for standard MMC-based integration.
- Power — Voltage supply range of 2.7 V to 3.6 V to accommodate common system power rails.
- Package — 169-TFBGA package (supplier device package: 169-TFBGA (14×18)), providing a compact board footprint.
- Operating Temperature — Specified ambient range of -40°C to 85°C (TA) for extended temperature operation.
Typical Applications
- MMC-based storage systems — Use as high-capacity non-volatile storage where an MMC interface is required.
- Embedded systems — Integrate the device for firmware, user data, or application storage demanding 256 Gbit capacity.
- Compact board-level solutions — Employ the 169-TFBGA (14×18) package to save PCB area in space-constrained designs.
Unique Advantages
- High-density storage: 256 Gbit capacity in a single device reduces the need for multiple memory components.
- Standard MMC interface: e•MMC™ MMC interface simplifies integration into systems that support MMC protocols.
- Wide voltage compatibility: 2.7 V to 3.6 V supply range supports common system power domains.
- Compact BGA package: 169-TFBGA (14×18) minimizes board space while accommodating high capacity.
- Extended ambient temperature: -40°C to 85°C (TA) enables operation across a broad temperature window.
Why Choose MTFC32GAKAEEF-AIT TR?
The MTFC32GAKAEEF-AIT TR combines high-density NAND FLASH storage with a standard MMC interface and a compact 169-TFBGA package, offering a straightforward integration path for designs that require 256 Gbit of non-volatile memory. Its specified voltage range and ambient temperature rating make it suitable for designs that need reliable MMC-based storage within those electrical and thermal limits.
Manufactured by Micron Technology Inc. and provided as part of the e•MMC™ series, this device is aimed at developers and procurement teams evaluating high-capacity MMC FLASH components for board-level integration where package size, capacity, and interface standardization are primary selection criteria.
Request a quote or submit an inquiry to discuss pricing, availability, and lead times for the MTFC32GAKAEEF-AIT TR.
