MTFC32GAMAKAM-WT ES TR

The MTFC32GAMAKAM-WT ES TR is a 256 Gbit non-volatile NAND flash memory device in the Micron e•MMC™ family. It provides 32G × 8 memory organization and a standard MMC memory interface.

Designed for systems that require a high-capacity NAND flash storage element with an MMC interface, the device is specified for operation from -25°C to 85°C (TA).

Key Features

• Memory Technology  Non-volatile FLASH - NAND technology suitable for persistent data storage.
• Capacity  256 Gbit total memory capacity for high-density storage requirements.
• Organization  32G × 8 memory organization allowing straightforward byte-wide access.
• Interface  MMC memory interface for integration into MMC-compatible host systems.
• Operating Temperature  Specified operating range of -25°C to 85°C (TA) for use in temperature-varied environments.
• Series  Part of the e•MMC™ series for systems designed around e•MMC memory modules.

Typical Applications

• MMC-based storage systems  Provides high-density non-volatile storage where an MMC interface is required.
• Firmware and system image storage  Stores firmware, boot images or large system images using NAND flash organized as 32G × 8.
• Data logging and large-file storage  Enables storage of sizable datasets or log archives in systems that use MMC memory connectivity.

Unique Advantages

• High-capacity storage: 256 Gbit density addresses applications that require substantial non-volatile memory space.
• Standard MMC interface: MMC compatibility simplifies host integration where MMC is the chosen memory interface.
• Byte-wide organization: 32G × 8 arrangement supports straightforward data mapping and access.
• NAND flash technology: FLASH - NAND provides persistent storage suitable for a variety of non-volatile storage needs.
• Extended operating range: Rated for -25°C to 85°C (TA), supporting deployment in temperature-varied environments.

Why Choose MTFC32GAMAKAM-WT ES TR?

The MTFC32GAMAKAM-WT ES TR positions itself as a high-density e•MMC™ NAND flash option, delivering 256 Gbit of non-volatile storage with a standard MMC interface and a 32G × 8 organization. Its specified operating temperature range supports deployment in systems exposed to a broad range of ambient conditions.

This device is suited for designs that require a large-capacity MMC memory element—such as system image storage, firmware hosting, and extensive data logging—providing a straightforward integration path where MMC is the chosen interface.

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