MTFC32GAPALGT-S1 AAT TR
| Part Description |
IC FLASH 256GBIT MMC 153WFBGA |
|---|---|
| Quantity | 975 Available (as of May 6, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 6 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 153-WFBGA (11.5x13) | Memory Format | FLASH | Technology | FLASH - NAND (SLC) | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 256 Gbit | Access Time | N/A | Grade | Automotive | ||
| Clock Frequency | 200 MHz | Voltage | 2.7V ~ 3.6V | Memory Type | Non-Volatile | ||
| Operating Temperature | -40°C ~ 105°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 153-WFBGA | ||
| Mounting Method | Non-Volatile | Memory Interface | eMMC_5.1 | Memory Organization | 32G x 8 | ||
| Moisture Sensitivity Level | N/A | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | N/A | HTS Code | N/A |
Overview of MTFC32GAPALGT-S1 AAT TR – 256 Gbit e•MMC™ Flash Memory, 153-WFBGA
The MTFC32GAPALGT-S1 AAT TR is a 256 Gbit non-volatile flash memory device in an e•MMC™ form factor. It implements NAND SLC flash organized as 32G × 8 and provides an eMMC_5.1 interface for MMC-based storage integration.
Packaged in a compact 153-WFBGA (11.5 × 13 mm) and supporting a wide operating temperature range, the device targets systems that require high-density embedded flash with standardized e•MMC connectivity.
Key Features
- Memory Type and Technology Non-volatile NAND SLC flash memory providing reliable storage retention as specified.
- Capacity & Organization 256 Gbit total capacity organized as 32G × 8 for straightforward address and data mapping.
- Interface e•MMC™ interface compliant with eMMC_5.1 for MMC-style embedded storage integration.
- Clock Frequency Rated clock frequency of 200 MHz for the device’s data interface timing.
- Voltage Supply Supports a supply range of 2.7 V to 3.6 V to accommodate common system power rails.
- Operating Temperature Specified operating range from −40°C to 105°C (TA) for extended thermal environments.
- Package 153-WFBGA package, dimensions 11.5 × 13 mm, suitable for compact board-level integration.
Typical Applications
- Embedded storage systems Use as on-board MMC storage where a 256 Gbit e•MMC™ solution is required for firmware, file systems, or large data sets.
- Industrial control and instrumentation Operates across −40°C to 105°C, supporting deployment in industrial equipment that requires wide-temperature non-volatile memory.
- Portable and handheld devices Compact 153-WFBGA package and e•MMC_5.1 interface enable integration into space-constrained consumer or professional handheld designs.
- Networking and edge devices Provides high-density embedded flash for local storage in network appliances and edge compute modules.
Unique Advantages
- High-density on-board storage: 256 Gbit capacity addresses applications needing large local non-volatile memory.
- Standardized e•MMC™ interface: eMMC_5.1 compatibility simplifies integration with MMC host controllers and existing board designs.
- Wide operating temperature: −40°C to 105°C rating supports deployment in thermally demanding environments.
- Flexible power range: 2.7 V to 3.6 V supply range allows compatibility with common system power rails.
- Compact package: 153-WFBGA (11.5 × 13 mm) conserves PCB area while providing high capacity.
- SLC NAND technology: SLC NAND flash technology as specified offers characteristics associated with single-level cell NAND.
Why Choose IC FLASH 256GBIT MMC 153WFBGA?
The IC FLASH 256GBIT MMC 153WFBGA combines a high 256 Gbit capacity with an e•MMC_5.1 interface and SLC NAND technology in a compact 153-WFBGA package. Its electrical and thermal specifications—200 MHz clock rating, 2.7 V–3.6 V supply range, and −40°C to 105°C operating window—position it for embedded designs that require sizable on-board flash in constrained form factors and varied thermal environments.
This device is suited for design teams specifying e•MMC™ storage solutions for embedded systems, industrial equipment, portable devices, and networked appliances where standardized interface, capacity, and robust thermal performance are key selection criteria.
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