MTFC32GASAONS-IT TR

IC FLASH 256GBIT UFS2.1 153TFBGA
Part Description

IC FLASH 256GBIT UFS2.1 153TFBGA

Quantity 675 Available (as of May 26, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package153-TFBGA (11.5x13)Memory FormatFLASHTechnologyFLASH - NAND (SLC)
Memory Size256 GbitAccess TimeN/AGradeAutomotive
Clock Frequency52 MHzVoltage2.7V ~ 3.6VMemory TypeNon-Volatile
Operating Temperature-40°C ~ 95°C (TC)Write Cycle Time Word PageN/APackaging153-TFBGA
Mounting MethodNon-VolatileMemory InterfaceUFS2.1Memory Organization32G x 8
Moisture Sensitivity LevelN/ARoHS ComplianceUnknownREACH ComplianceREACH Unaffected
QualificationN/AECCNN/AHTS CodeN/A

Overview of MTFC32GASAONS-IT TR – IC FLASH 256GBIT UFS2.1 153TFBGA

The MTFC32GASAONS-IT TR is a non-volatile NAND flash memory device from Micron Technology Inc. It is organized as 32G × 8 for a total density of 256 Gbit and implements a UFS 2.1 memory interface.

Key device attributes include SLC NAND flash technology, a 153-TFBGA (11.5 × 13 mm) package, a 52 MHz clock frequency, a supply voltage range of 2.7 V to 3.6 V, and an operating temperature range of −40 °C to 95 °C. These specifications support integration where on-board UFS 2.1 storage and defined environmental tolerances are required.

Key Features

  • Core / Memory Non-volatile FLASH NAND (SLC) technology with a memory organization of 32G × 8 for a total memory size of 256 Gbit.
  • Interface UFS 2.1 memory interface compatible with UFS 2.1 host controllers; device specifies a 52 MHz clock frequency.
  • Power Operates from a 2.7 V to 3.6 V supply range.
  • Package 153-TFBGA package (11.5 × 13 mm) for board-level integration.
  • Temperature Range Rated for operation from −40 °C to 95 °C (TC).
  • Memory Format / Mounting Memory format listed as FLASH; mounting type recorded as Non-Volatile.
  • Manufacturer / Series Manufactured by Micron Technology Inc.; series listed as e•MMC™.

Unique Advantages

  • 256 Gbit density: Provides large on-board flash capacity in a single-device 32G × 8 organization.
  • UFS 2.1 connectivity: Standard UFS 2.1 interface enables integration with UFS 2.1 host systems that require this protocol.
  • Industrial temperature support: Specified −40 °C to 95 °C operating range for extended environmental tolerance.
  • Wide supply tolerance: 2.7 V to 3.6 V supply range accommodates common system power rails.
  • Compact BGA package: 153-TFBGA (11.5 × 13 mm) minimizes PCB footprint for high-density system designs.

Why Choose MTFC32GASAONS-IT TR?

The MTFC32GASAONS-IT TR combines SLC NAND flash technology with a UFS 2.1 interface to deliver a straightforward, high-density storage component in a compact 153-TFBGA package. Its specified supply voltage range and −40 °C to 95 °C operating temperature make the device suitable for designs that require defined electrical and thermal tolerances.

Backed by Micron Technology Inc., the device provides a clear, specification-driven option for systems requiring 256 Gbit of UFS 2.1 flash memory in a board-mountable package.

Request a quote or contact sales to discuss availability, lead times, and pricing for MTFC32GASAONS-IT TR.

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