MTFC32GASAONS-IT

IC FLASH 256GBIT UFS2.1 153TFBGA
Part Description

IC FLASH 256GBIT UFS2.1 153TFBGA

Quantity 196 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package153-TFBGA (11.5x13)Memory FormatFLASHTechnologyFLASH - NAND
Memory Size256 GbitAccess TimeN/AGradeAutomotive
Clock Frequency52 MHzVoltage2.7V ~ 3.6VMemory TypeNon-Volatile
Operating Temperature-40°C ~ 95°C (TC)Write Cycle Time Word PageN/APackaging153-TFBGA
Mounting MethodNon-VolatileMemory InterfaceUFS2.1Memory Organization32G x 8
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCN3A991B1AHTS Code8542.32.0071

Overview of MTFC32GASAONS-IT – IC FLASH 256GBIT UFS2.1 153TFBGA

The MTFC32GASAONS-IT is a non-volatile NAND flash memory device from Micron Technology Inc. offering 256 Gbit of storage in a 32G × 8 organization with a UFS 2.1 memory interface.

Packaged in a 153-TFBGA (11.5 × 13 mm) and designed for operation across a wide voltage range (2.7 V–3.6 V) and temperature range (−40°C to 95°C TC), the device addresses designs that require high-density flash memory with a standardized UFS 2.1 interface and compact BGA packaging.

Key Features

  • Memory Type & Technology Non-volatile FLASH (NAND) memory with a memory format listed as FLASH.
  • Capacity & Organization 256 Gbit capacity organized as 32G × 8.
  • Interface Universal Flash Storage (UFS) 2.1 interface for serial flash connectivity.
  • Clock Frequency Clock frequency specified at 52 MHz.
  • Power Voltage supply range of 2.7 V to 3.6 V.
  • Package 153-TFBGA supplier device package with dimensions 11.5 × 13 mm.
  • Temperature Range Operating temperature: −40°C to 95°C (TC).
  • Manufacturer & Series Micron Technology Inc.; listed series: e•MMC™.

Unique Advantages

  • High-density storage: 256 Gbit capacity supports large on-board data storage needs without external memory devices.
  • Standard UFS 2.1 interface: Provides a defined serial storage interface for systems that require UFS connectivity.
  • Wide operating temperature: Specified −40°C to 95°C TC for deployment across broader environmental conditions.
  • Flexible power envelope: 2.7 V–3.6 V supply range enables compatibility with common system power rails.
  • Compact BGA package: 153-TFBGA (11.5 × 13 mm) package supports space-constrained board layouts.
  • Clear memory organization: 32G × 8 organization simplifies capacity planning and BOM definition.

Why Choose IC FLASH 256GBIT UFS2.1 153TFBGA?

The MTFC32GASAONS-IT is positioned for designs that require a 256 Gbit non-volatile NAND flash device with a UFS 2.1 interface, compact BGA packaging, and operation across a wide temperature and voltage range. Its specifications make it appropriate for system architectures that need a standardized serial flash interface combined with high-density on-board storage.

Engineers and procurement teams seeking a Micron-sourced FLASH NAND component with explicit capacity, package, interface, and environmental specifications will find this device suitable for integration into projects that mandate those concrete attributes.

Request a quote or submit an inquiry to discuss availability and pricing for the MTFC32GASAONS-IT.

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