MTFC32GAZAQHD-WT

IC FLASH 256GBIT MMC 153VFBGA
Part Description

IC FLASH 256GBIT MMC 153VFBGA

Quantity 1,120 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package153-VFBGA (11.5x13)Memory FormatFLASHTechnologyFLASH - NAND
Memory Size256 GbitAccess TimeN/AGradeIndustrial
Clock Frequency200 MHzVoltage2.7V ~ 3.6VMemory TypeNon-Volatile
Operating Temperature-25°C ~ 85°C (TC)Write Cycle Time Word PageN/APackaging153-VFBGA
Mounting MethodNon-VolatileMemory InterfaceMMCMemory Organization32G x 8
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCN3A991B1AHTS Code8542.32.0071

Overview of MTFC32GAZAQHD-WT – IC FLASH 256GBIT MMC 153VFBGA

The MTFC32GAZAQHD-WT is a Micron e•MMC™ managed NAND flash device providing 256 Gbit of non-volatile storage in a 153‑VFBGA package (11.5 × 13 mm). It implements NAND flash memory organized as 32G × 8 with an MMC memory interface and a 200 MHz clock frequency.

This device is intended for system designs that require onboard MMC-compatible non‑volatile storage with a defined operating range (2.7 V to 3.6 V and −25 °C to 85 °C). Its package and electrical specifications support compact board-level integration where a managed flash solution is required.

Key Features

  • Memory Type Non-volatile FLASH – NAND memory organized as 32G × 8 for a total of 256 Gbit.
  • Memory Interface MMC interface for managed flash operation using standard e•MMC protocols.
  • Performance 200 MHz clock frequency enabling the device’s supported MMC transfer rates.
  • Power Supply Operating voltage range of 2.7 V to 3.6 V to match common system power rails.
  • Package 153‑VFBGA package (11.5 × 13 mm) for compact surface‑mount integration.
  • Operating Temperature Commercial temperature range from −25 °C to 85 °C for typical embedded environments.
  • Memory Format Managed e•MMC flash format providing integrated NAND management functions.

Typical Applications

  • Embedded storage — Onboard non‑volatile storage for systems that use an MMC interface to store firmware, OS images, or application data.
  • Compact electronics — Device integration where the 153‑VFBGA (11.5 × 13 mm) package supports space-constrained PCBs.
  • Industrial equipment — Systems operating within −25 °C to 85 °C that require managed NAND flash storage.

Unique Advantages

  • High storage capacity: 256 Gbit NAND organized as 32G × 8 provides large onboard storage in a single device.
  • Managed MMC interface: e•MMC memory interface simplifies integration with MMC-compatible host controllers.
  • Compact package: 153‑VFBGA (11.5 × 13 mm) enables dense board layouts and small form-factor designs.
  • Wide supply range: 2.7 V to 3.6 V operation aligns with common 3 V system rails.
  • Defined operating range: −25 °C to 85 °C rating supports deployment in a range of commercial embedded environments.
  • Standardized clock support: 200 MHz clock frequency to meet required MMC timing and transfer needs.

Why Choose MTFC32GAZAQHD-WT?

The MTFC32GAZAQHD-WT positions itself as a high-capacity e•MMC managed NAND device that balances storage density, package compactness, and standard MMC interfacing. Its electrical and thermal specifications make it suitable for embedded designs that require a managed non‑volatile memory solution with a clear supply and temperature envelope.

This part is appropriate for designs where 256 Gbit of onboard flash, a standard MMC interface, and a small VFBGA footprint are priorities. The device provides a straightforward storage option for systems needing integrated NAND management without adding external controllers.

Request a quote or contact sales to discuss MTFC32GAZAQHD-WT for your design requirements and volume needs.

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