MTFC32GJWEF-4M AIT Z TR
| Part Description |
IC FLASH 256GBIT MMC 169TFBGA |
|---|---|
| Quantity | 457 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 169-TFBGA (14x18) | Memory Format | FLASH | Technology | FLASH - NAND | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 256 Gbit | Access Time | N/A | Grade | Industrial | ||
| Clock Frequency | N/A | Voltage | 2.7V ~ 3.6V | Memory Type | Non-Volatile | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 169-TFBGA | ||
| Mounting Method | Non-Volatile | Memory Interface | MMC | Memory Organization | 32G x 8 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | 3A991B1A | HTS Code | 8542.32.0071 |
Overview of MTFC32GJWEF-4M AIT Z TR – IC FLASH 256GBIT MMC 169TFBGA
The MTFC32GJWEF-4M AIT Z TR is a 256 Gbit non-volatile flash memory device using NAND FLASH technology and organized as 32G × 8. It implements an MMC memory interface and is packaged in a 169‑TFBGA (14x18) form factor.
Designed for systems that require MMC-interface non-volatile storage, this device offers high-density flash capacity with a broad operating voltage range and industrial temperature support.
Key Features
- Memory Type & Technology Non-volatile FLASH memory using NAND technology for persistent data storage.
- Capacity & Organization 256 Gbit total capacity organized as 32G × 8 to provide high-density storage.
- Interface MMC memory interface for integration into MMC-compatible host systems.
- Power Wide supply range of 2.7 V to 3.6 V to accommodate common system power rails.
- Package 169‑TFBGA package (14x18) suitable for surface-mount applications requiring compact, ball-grid package style.
- Operating Temperature Specified operating temperature range of −40°C to 85°C (TA) for temperature-variable environments.
Typical Applications
- Embedded MMC storage — Used as onboard non-volatile NAND flash storage in systems that implement an MMC interface.
- High-density flash storage — Provides 256 Gbit capacity where dense flash memory is required in a compact 169‑TFBGA package.
- Temperature-variable systems — Suited to environments operating between −40°C and 85°C where a wide temperature range is needed.
Unique Advantages
- Large 256 Gbit capacity: Supports storage-intensive applications with a 32G × 8 memory organization.
- MMC interface compatibility: Simplifies integration into MMC-capable host designs without additional interface translation.
- Wide supply voltage range: Operates across 2.7 V to 3.6 V to match common system power rails.
- Compact TFBGA package: 169‑TFBGA (14x18) footprint enables dense board layouts and surface-mount assembly.
- Extended operating temperature: −40°C to 85°C rating supports deployments in temperature-variable environments.
Why Choose IC FLASH 256GBIT MMC 169TFBGA?
The IC FLASH 256GBIT MMC 169TFBGA from Micron Technology Inc. delivers high-density NAND flash storage in an MMC-interface device, combining substantial capacity with a compact 169‑TFBGA package and a broad operating voltage and temperature range. Its specification set addresses designs that need persistent, high-capacity memory with straightforward MMC integration.
This device is suited for developers and procurement teams focused on systems that require reliable non-volatile MMC storage, compact packaging, and operation across −40°C to 85°C. Its capacity and electrical specs make it a pragmatic choice for scaling storage needs while maintaining compatibility with MMC-based host architectures.
Request a quote or contact sales to discuss availability, lead times, and pricing for the MTFC32GJWEF-4M AIT Z TR.
