MTFC32GLXDM-WT
| Part Description |
IC FLASH 256GBIT MMC 153TFBGA |
|---|---|
| Quantity | 176 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | N/A | Memory Format | FLASH | Technology | FLASH - NAND | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 256 Gbit | Access Time | N/A | Grade | Industrial | ||
| Clock Frequency | N/A | Voltage | 2.7V ~ 3.6V | Memory Type | Non-Volatile | ||
| Operating Temperature | -25°C ~ 85°C (TA) | Write Cycle Time Word Page | N/A | Packaging | N/A | ||
| Mounting Method | Non-Volatile | Memory Interface | MMC | Memory Organization | 32G x 8 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS Compliant | REACH Compliance | REACH Unknown | ||
| Qualification | N/A | ECCN | 3A991B1A | HTS Code | 8542.32.0071 |
Overview of MTFC32GLXDM-WT – IC FLASH 256GBIT MMC 153TFBGA
The MTFC32GLXDM-WT from Micron Technology Inc. is a 256 Gbit non-volatile flash memory device using NAND technology and organized as 32G × 8. It is part of the e•MMC™ series and implements an MMC memory interface.
Key electrical and environmental parameters include an operating voltage range of 2.7 V to 3.6 V and an ambient operating temperature range of −25°C to 85°C, supporting designs that require high-density embedded storage with defined supply and temperature limits.
Key Features
- Memory Type & Technology Non‑volatile NAND flash memory providing persistent storage.
- Memory Size 256 Gbit capacity for high-density data storage.
- Memory Organization Organized as 32G × 8 to describe internal device arrangement.
- Interface MMC memory interface for integration with MMC-capable host systems.
- Voltage Supply Operates from 2.7 V to 3.6 V to match common embedded power rails.
- Operating Temperature Specified ambient range of −25°C to 85°C (TA) for broader environmental conditions.
- Series Member of Micron's e•MMC™ series.
Typical Applications
- Embedded storage (MMC systems) Onboard non-volatile storage for systems that implement an MMC memory interface.
- High-density data storage Applications requiring a 256 Gbit flash device to store large amounts of data on a single component.
- Equipment with extended ambient range Designs that need operation across −25°C to 85°C can utilize this device for storage in varied environments.
Unique Advantages
- High-density non-volatile capacity: 256 Gbit provides substantial onboard storage in a single device.
- Standard MMC interface: Simplifies integration into systems that support MMC memory connectivity.
- Wide operating voltage range: 2.7 V to 3.6 V supports common embedded power supply rails.
- Defined ambient temperature range: −25°C to 85°C supports use in applications with extended temperature requirements.
- Clear memory organization: 32G × 8 arrangement provides explicit internal data structure information.
Why Choose MTFC32GLXDM-WT?
The MTFC32GLXDM-WT delivers 256 Gbit of NAND-based, non-volatile storage with an MMC interface and clearly specified electrical and environmental limits. As part of Micron's e•MMC™ series, it addresses requirements for compact, high-density embedded memory where MMC connectivity, supply voltage range, and ambient temperature specifications are defining factors.
This device is suited to designs and customers that require a single-component, high-capacity flash memory solution with a documented memory organization and operating envelope, enabling predictable integration into MMC-supporting platforms.
Request a quote or contact sales for pricing, availability, and lead-time information for the MTFC32GLXDM-WT.
