MTFC64GAZAQHD-AAT TR
| Part Description |
IC FLASH 512GBIT MMC |
|---|---|
| Quantity | 1,043 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 6 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 153-VFBGA (11.5x13) | Memory Format | FLASH | Technology | FLASH - NAND | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 512 Gbit | Access Time | N/A | Grade | Automotive | ||
| Clock Frequency | N/A | Voltage | 2.7V ~ 3.6V | Memory Type | Non-Volatile | ||
| Operating Temperature | -40°C ~ 105°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 153-VFBGA | ||
| Mounting Method | Non-Volatile | Memory Interface | eMMC | Memory Organization | 64G x 8 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | N/A | HTS Code | N/A |
Overview of MTFC64GAZAQHD-AAT TR – IC FLASH 512GBIT MMC
The MTFC64GAZAQHD-AAT TR is a 512 Gbit non-volatile NAND flash memory device in an e.MMC format. It integrates a MultiMediaCard (MMC) controller with NAND flash memory organized as 64G × 8, delivering high-density embedded storage in a compact 153-ball VFBGA package (11.5 × 13 mm).
Designed for systems that require onboard flash with a standard e.MMC interface, the device offers a broad operating voltage window and extended temperature support, making it suitable for a range of embedded storage applications where integration, density and interface compatibility are priorities.
Key Features
- Memory Core 512 Gbit NAND flash organized as 64G × 8, provided in an e.MMC memory format.
- Standards & Interface JEDEC/MMC standard version 5.1-compliant e.MMC implementation with an advanced 12-signal interface supporting ×1, ×4 and ×8 I/Os selectable by the host.
- High-speed Modes e.MMC interface supports boot frequencies to 52 MHz and clock frequencies to 200 MHz, including HS200/HS400 modes for higher throughput.
- Power Single-supply operation with VCC: 2.7–3.6 V and VCCQ: 1.70–1.95 V (dual-voltage VCCQ options noted for specific packages in datasheet).
- Data Management & Security Features include command queue, RPMB (replay-protected memory block), permanent and power-on write protection, temporary write protection, and reliable write support.
- Maintenance & Reliability Background operation, BKOPS control, ECC and block management, device health report, and field firmware update (FFU) capabilities are implemented.
- System Integration Multiple partitions with enhanced attributes, hardware reset signal, high-priority interrupt (HPI), data strobe pin, and boot operation (including high-speed boot) for flexible system boot and partitioning schemes.
- Package & Temperature 153-ball VFBGA (11.5 × 13 mm) package; specified operating temperature range of −40°C to +105°C (TA) for the AAT variant.
Typical Applications
- Embedded systems — Onboard e.MMC storage for firmware, OS images, and application data in compact embedded designs.
- Industrial controllers — High-density non-volatile storage for data logging, configuration, and firmware storage within industrial equipment.
- Secure storage — Use of RPMB and write-protection features for storing keys, credentials, or tamper-resistant data.
- Boot and system partitions — High-speed boot operation and multiple partition support enable dedicated boot and application partitions.
Unique Advantages
- High-density NAND in a compact package: 512 Gbit capacity (64G × 8) in a 153-VFBGA 11.5 × 13 mm footprint, reducing board area for large-capacity embedded storage.
- Standards-based interface: JEDEC/MMC 5.1 compliance and selectable ×1/×4/×8 I/Os simplify host integration and interoperability with standard e.MMC hosts.
- Flexible performance modes: Support for HS200/HS400 and up to 200 MHz e.MMC clocking provides headroom for higher throughput use cases.
- On-device data management: Built-in ECC, block management, command queue, and background operations reduce host overhead for NAND maintenance.
- Security and protection features: RPMB, multiple write-protection mechanisms and reliable write capabilities enhance data integrity and secure storage options.
- Robust operating range: Wide supply voltage range (2.7–3.6 V) and −40°C to +105°C operating temperature accommodate diverse deployment environments.
Why Choose IC FLASH 512GBIT MMC?
The MTFC64GAZAQHD-AAT TR combines high-density NAND storage with a standards-compliant e.MMC controller and a compact VFBGA package to deliver an integrated embedded storage solution. Its on-device features for data management, protection and secure storage simplify system design and offload maintenance tasks from the host processor.
This device is well suited to designs that require large-capacity non-volatile storage with flexible partitioning, secure regions (RPMB), and high-speed boot options. The combination of interface options, on-device management and extended temperature support provides long-term value for embedded product lines and systems requiring compact, integrated flash memory.
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