MTFC64GAZAQHD-AIT TR

IC FLASH 512GBIT MMC
Part Description

IC FLASH 512GBIT MMC

Quantity 337 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package153-VFBGA (11.5x13)Memory FormatFLASHTechnologyFLASH - NAND
Memory Size512 GbitAccess TimeN/AGradeIndustrial
Clock FrequencyN/AVoltage2.7V ~ 3.6VMemory TypeNon-Volatile
Operating Temperature-40°C ~ 85°C (TA)Write Cycle Time Word PageN/APackaging153-VFBGA
Mounting MethodNon-VolatileMemory InterfaceeMMCMemory Organization64G x 8
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNN/AHTS CodeN/A

Overview of MTFC64GAZAQHD-AIT TR – IC FLASH 512GBIT MMC

The MTFC64GAZAQHD-AIT TR is a 512 Gbit non-volatile NAND flash memory device delivered in an e.MMC form factor. The device integrates a MultiMediaCard (MMC) controller with NAND flash to provide a turnkey embedded storage solution.

Designed for embedded systems that require onboard flash and boot capability, the device offers JEDEC e.MMC v5.1 compliance, multi-width I/O, and a compact 153-ball VFBGA package for space-constrained designs.

Key Features

  • Memory  512 Gbit total capacity organized as 64G × 8 in NAND flash memory; non-volatile FLASH storage formatted as e.MMC.
  • Integrated Controller and NAND  MultiMediaCard (MMC) controller integrated with NAND flash to provide a single-chip embedded storage solution.
  • Standards and Interface  JEDEC/MMC standard version 5.1-compliant; advanced 12-signal interface supporting ×1, ×4, and ×8 I/Os (selectable), with e.MMC I/F boot frequency 0–52 MHz and clock frequency 0–200 MHz. Supports HS200 and HS400 modes.
  • Power and Voltages  VCC supply range 2.7–3.6V and VCCQ 1.70–1.95V, with dual-voltage VCCQ options noted for certain packages in the datasheet.
  • Data Management and Reliability  On-device ECC and block management are implemented. Features listed in the datasheet include command queue, BKOPS control, reliable write, temporary/permanent write protection, RPMB (replay-protected memory block), device health report, and field firmware update (FFU).
  • Security and Maintenance  Boot operation (high-speed boot), hardware reset, permanent and power-on write protection, discard and sanitize, and power-off notification are included to support secure boot and maintainability.
  • Package and Temperature  Supplied in a 153-ball VFBGA package (11.5 mm × 13 mm, 0.9 mm height) with an operating temperature range of −40°C to +85°C (TA) for the AIT option listed in the datasheet.
  • Options and Functional Safety  The datasheet lists options for automotive and functional safety, including an AEC designation (AEC-Q104) and related documentation for functional-safety variants.

Typical Applications

  • Automotive systems  Embedded storage and boot media in automotive electronics where e.MMC-based solutions and functional-safety options are required as listed in the datasheet.
  • Bootable embedded platforms  High-capacity onboard flash for system boot and firmware storage using the device’s high-speed boot capability and integrated MMC controller.
  • Telematics and infotainment  Local storage for media, logs, and system images in compact packages, leveraging the device’s capacity and multi-width I/O support.
  • Industrial embedded storage  Non-volatile storage for embedded controllers and data logging that benefit from the −40°C to +85°C operating range and onboard data-management features.

Unique Advantages

  • Integrated controller + NAND: Reduces system design complexity by combining the MMC controller and NAND flash in a single device.
  • JEDEC e.MMC v5.1 compliance: Ensures compatibility with hosts and software stacks designed for the JESD84-B51 standard.
  • Flexible interface widths and high-speed modes: ×1/×4/×8 I/O options and support for HS200/HS400 enable designers to balance throughput and pin count.
  • Robust data-management features: On-device ECC, reliable write, command queue, RPMB and device health reporting aid data integrity and maintainability.
  • Compact package with wide temperature range: 153-ball VFBGA (11.5×13 mm) package and −40°C to +85°C rating accommodate space- and environment-constrained designs.
  • Functional-safety and update support: Field firmware update and functional-safety-related options (including AEC designation listed in the datasheet) support long-term maintainability and safety-focused deployments.

Why Choose MTFC64GAZAQHD-AIT TR?

The MTFC64GAZAQHD-AIT TR delivers high-density, integrated e.MMC flash storage in a compact VFBGA package, combining NAND and an MMC controller to simplify BOM and board integration. Its e.MMC v5.1 compliance, selectable I/O widths, and high-speed interface modes make it suitable for designs that need onboard boot capability and high-capacity local storage.

With on-device ECC, advanced data-management features, and options for functional-safety implementation noted in the datasheet, the device is positioned for embedded platforms that require maintainable, secure, and space-efficient storage solutions.

If you would like pricing, availability, or a formal quote for the MTFC64GAZAQHD-AIT TR, request a quote or contact sales to discuss your requirements and ordering options.

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