MTFC64GAZAQHD-WT
| Part Description |
IC FLASH 512GBIT EMMC 153VFBGA |
|---|---|
| Quantity | 258 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 153-VFBGA (11.5x13) | Memory Format | FLASH | Technology | FLASH - NAND (SLC) | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 512 Gbit | Access Time | N/A | Grade | Industrial | ||
| Clock Frequency | 200 MHz | Voltage | 2.7V ~ 3.6V | Memory Type | Non-Volatile | ||
| Operating Temperature | -25°C ~ 85°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 153-VFBGA | ||
| Mounting Method | Non-Volatile | Memory Interface | eMMC_5.1 | Memory Organization | 64G x 8 | ||
| Moisture Sensitivity Level | N/A | RoHS Compliance | N/A | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | N/A | HTS Code | N/A |
Overview of MTFC64GAZAQHD-WT – IC FLASH 512GBIT EMMC 153VFBGA
The MTFC64GAZAQHD-WT is an integrated e.MMC memory device from Micron Technology Inc. combining MMC controller functionality with NAND flash to provide 512 Gbit of non-volatile storage (64G × 8). It implements the JEDEC e.MMC 5.1 interface and is targeted at industrial and embedded applications requiring board-level, managed flash storage with boot and secure partition capabilities.
Designed for system-level integration, this device offers high-speed e.MMC interface options, multiple I/O widths, onboard reliability features and a compact 153-ball VFBGA package (11.5 mm × 13 mm), enabling compact system designs that need robust, managed NAND storage.
Key Features
- Core Architecture Integrated MultiMediaCard (MMC) controller paired with NAND flash in a single device, delivering managed e.MMC storage.
- Memory 512 Gbit capacity organized as 64G × 8 using FLASH NAND (SLC) technology.
- Interface and Performance JEDEC e.MMC 5.1-compliant interface with e.MMC I/F clock up to 200 MHz and boot frequency up to 52 MHz. Supports HS200 and HS400 modes and selectable ×1, ×4, and ×8 I/Os.
- Power VCC operating range 2.7 V to 3.6 V; VCCQ 1.70 V to 1.95 V as specified for the device.
- System Reliability & Security On-device ECC and block management, reliable write, RPMB (replay-protected memory block), temporary and permanent write protection, and device health reporting.
- Boot & Firmware High-speed boot operation, field firmware update (FFU), command queue, and background operation support to simplify system boot and maintenance.
- Data Management Features Command classes including block read/write/erase, write protection, discard and sanitize, BKOPS control, power-off notification, and sleep mode.
- Retention & Endurance Specified retention: 1 year @ 55°C at maximum programmed/erase (PE) and 10 years @ 55°C at 10% of PE.
- Package & Mechanical 153-ball VFBGA package (11.5 mm × 13 mm); JEDEC-standard package marking and footprint for compact, tray-shipped supply.
- Operating Temperature Case surface temperature (center/top) operating range from –25°C to +85°C for the WT variant.
Typical Applications
- Industrial control systems Local managed storage for firmware, logging and system images where industrial temperature operation and retention characteristics are required.
- Embedded consumer/enterprise devices On-board storage for operating systems, application data and secure partitions using the e.MMC boot and RPMB capabilities.
- Boot and firmware storage High-speed boot operation and field firmware update support for reliable system startup and in-field updates.
Unique Advantages
- Integrated controller plus NAND Reduces system design complexity by combining MMC controller and NAND in one e.MMC package.
- High-speed, flexible interface Up to 200 MHz clock with HS200/HS400 modes and selectable ×1/×4/×8 I/O widths to match host requirements.
- Robust data integrity features On-device ECC, block management, reliable write, write protection and RPMB improve data reliability and security.
- Industrial temperature option WT variant rated for –25°C to +85°C case temperature to support a wide range of embedded environments.
- Compact, standardized package 153-ball VFBGA (11.5 mm × 13 mm) provides a small footprint for space-constrained board designs.
- Long-term data retention Specified retention figures (1 year @55°C at maximum PE; 10 years @55°C at 10% PE) support archival and update scenarios.
Why Choose MTFC64GAZAQHD-WT?
The MTFC64GAZAQHD-WT positions itself as a compact, managed e.MMC storage solution that balances capacity, interface performance and embedded reliability. With a JEDEC e.MMC 5.1-compliant interface, high-speed modes, and on-device management features, it suits designs that require integrated flash storage with boot, security and health-reporting capabilities.
This device is appropriate for OEMs and system designers building industrial or embedded products that need consolidated storage with defined retention behavior, firmware update support and a small 153-ball VFBGA footprint from a single-source memory supplier.
For pricing, availability and to request a quote for MTFC64GAZAQHD-WT, submit a quote request or sales inquiry with your project requirements and quantity needs.