MTFC64GAZAQHD-WT

IC FLASH 512GBIT EMMC 153VFBGA
Part Description

IC FLASH 512GBIT EMMC 153VFBGA

Quantity 258 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package153-VFBGA (11.5x13)Memory FormatFLASHTechnologyFLASH - NAND (SLC)
Memory Size512 GbitAccess TimeN/AGradeIndustrial
Clock Frequency200 MHzVoltage2.7V ~ 3.6VMemory TypeNon-Volatile
Operating Temperature-25°C ~ 85°C (TA)Write Cycle Time Word PageN/APackaging153-VFBGA
Mounting MethodNon-VolatileMemory InterfaceeMMC_5.1Memory Organization64G x 8
Moisture Sensitivity LevelN/ARoHS ComplianceN/AREACH ComplianceREACH Unaffected
QualificationN/AECCNN/AHTS CodeN/A

Overview of MTFC64GAZAQHD-WT – IC FLASH 512GBIT EMMC 153VFBGA

The MTFC64GAZAQHD-WT is an integrated e.MMC memory device from Micron Technology Inc. combining MMC controller functionality with NAND flash to provide 512 Gbit of non-volatile storage (64G × 8). It implements the JEDEC e.MMC 5.1 interface and is targeted at industrial and embedded applications requiring board-level, managed flash storage with boot and secure partition capabilities.

Designed for system-level integration, this device offers high-speed e.MMC interface options, multiple I/O widths, onboard reliability features and a compact 153-ball VFBGA package (11.5 mm × 13 mm), enabling compact system designs that need robust, managed NAND storage.

Key Features

  • Core Architecture  Integrated MultiMediaCard (MMC) controller paired with NAND flash in a single device, delivering managed e.MMC storage.
  • Memory  512 Gbit capacity organized as 64G × 8 using FLASH NAND (SLC) technology.
  • Interface and Performance  JEDEC e.MMC 5.1-compliant interface with e.MMC I/F clock up to 200 MHz and boot frequency up to 52 MHz. Supports HS200 and HS400 modes and selectable ×1, ×4, and ×8 I/Os.
  • Power  VCC operating range 2.7 V to 3.6 V; VCCQ 1.70 V to 1.95 V as specified for the device.
  • System Reliability & Security  On-device ECC and block management, reliable write, RPMB (replay-protected memory block), temporary and permanent write protection, and device health reporting.
  • Boot & Firmware  High-speed boot operation, field firmware update (FFU), command queue, and background operation support to simplify system boot and maintenance.
  • Data Management Features  Command classes including block read/write/erase, write protection, discard and sanitize, BKOPS control, power-off notification, and sleep mode.
  • Retention & Endurance  Specified retention: 1 year @ 55°C at maximum programmed/erase (PE) and 10 years @ 55°C at 10% of PE.
  • Package & Mechanical  153-ball VFBGA package (11.5 mm × 13 mm); JEDEC-standard package marking and footprint for compact, tray-shipped supply.
  • Operating Temperature  Case surface temperature (center/top) operating range from –25°C to +85°C for the WT variant.

Typical Applications

  • Industrial control systems  Local managed storage for firmware, logging and system images where industrial temperature operation and retention characteristics are required.
  • Embedded consumer/enterprise devices  On-board storage for operating systems, application data and secure partitions using the e.MMC boot and RPMB capabilities.
  • Boot and firmware storage  High-speed boot operation and field firmware update support for reliable system startup and in-field updates.

Unique Advantages

  • Integrated controller plus NAND  Reduces system design complexity by combining MMC controller and NAND in one e.MMC package.
  • High-speed, flexible interface  Up to 200 MHz clock with HS200/HS400 modes and selectable ×1/×4/×8 I/O widths to match host requirements.
  • Robust data integrity features  On-device ECC, block management, reliable write, write protection and RPMB improve data reliability and security.
  • Industrial temperature option  WT variant rated for –25°C to +85°C case temperature to support a wide range of embedded environments.
  • Compact, standardized package  153-ball VFBGA (11.5 mm × 13 mm) provides a small footprint for space-constrained board designs.
  • Long-term data retention  Specified retention figures (1 year @55°C at maximum PE; 10 years @55°C at 10% PE) support archival and update scenarios.

Why Choose MTFC64GAZAQHD-WT?

The MTFC64GAZAQHD-WT positions itself as a compact, managed e.MMC storage solution that balances capacity, interface performance and embedded reliability. With a JEDEC e.MMC 5.1-compliant interface, high-speed modes, and on-device management features, it suits designs that require integrated flash storage with boot, security and health-reporting capabilities.

This device is appropriate for OEMs and system designers building industrial or embedded products that need consolidated storage with defined retention behavior, firmware update support and a small 153-ball VFBGA footprint from a single-source memory supplier.

For pricing, availability and to request a quote for MTFC64GAZAQHD-WT, submit a quote request or sales inquiry with your project requirements and quantity needs.

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