MTFC64GJDDN-3M WT
| Part Description |
IC FLASH 512GBIT MMC 169LFBGA |
|---|---|
| Quantity | 190 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 169-LFBGA (14x18) | Memory Format | FLASH | Technology | FLASH - NAND | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 512 Gbit | Access Time | N/A | Grade | Industrial | ||
| Clock Frequency | N/A | Voltage | 1.65V ~ 3.6V | Memory Type | Non-Volatile | ||
| Operating Temperature | -25°C ~ 85°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 169-LFBGA | ||
| Mounting Method | Non-Volatile | Memory Interface | MMC | Memory Organization | 64G x 8 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | 3A991B1A | HTS Code | 8523.51.0000 |
Overview of MTFC64GJDDN-3M WT – IC FLASH 512GBIT MMC 169LFBGA
The MTFC64GJDDN-3M WT is a 512 Gbit non-volatile NAND flash memory organized as 64G × 8 with an MMC memory interface. This e•MMC™ series device provides high-density embedded flash storage in a compact 169-LFBGA (14 × 18) package.
Designed for systems that require large-capacity flash storage within a defined operating range, the device delivers integration through a standard MMC interface, wide supply-voltage tolerance, and a specified operating temperature window.
Key Features
- Memory Core 512 Gbit NAND flash organized as 64G × 8, delivering high-density non-volatile storage.
- Memory Interface MMC interface for embedded memory integration in MMC-compatible systems.
- Voltage Range Wide supply-voltage support from 1.65 V to 3.6 V to accommodate varied system power rails.
- Package 169-LFBGA (14 × 18) package for compact board-level integration.
- Operating Temperature Specified ambient operating range of −25 °C to 85 °C (TA) for use in temperature-constrained environments.
- Memory Type & Format Non-volatile FLASH (NAND) memory format suited for persistent data storage.
Typical Applications
- Embedded storage subsystems Use as MMC-based onboard flash for systems requiring up to 512 Gbit of persistent storage.
- Compact consumer and industrial devices Integration where a 169-LFBGA package and wide supply-voltage range support small form-factor designs.
- Systems operating in controlled temperature ranges Devices and equipment that operate within −25 °C to 85 °C and require reliable non-volatile memory.
Unique Advantages
- High-density non-volatile storage: 512 Gbit capacity enables large onboard data storage without external memory stacks.
- Standard MMC interface: Simplifies integration into MMC-compatible host designs.
- Flexible power support: 1.65 V to 3.6 V supply range accommodates multiple system power configurations.
- Compact LFBGA package: 169-LFBGA (14 × 18) minimizes PCB area for space-constrained designs.
- Specified operating temperature: −25 °C to 85 °C rating provides clarity on environmental use limits.
- NAND flash technology: Non-volatile FLASH format suitable for persistent data retention in embedded applications.
Why Choose IC FLASH 512GBIT MMC 169LFBGA?
The MTFC64GJDDN-3M WT positions itself as a high-capacity e•MMC™ NAND flash device that balances density, interface compatibility, and compact packaging. Its 512 Gbit organization, MMC interface, and 169-LFBGA package offer a straightforward path for designers needing onboard persistent storage within the specified voltage and temperature ranges.
This device is suited for designs and customers targeting MMC-based embedded storage solutions where board space, power flexibility, and a defined operating temperature range are key selection criteria.
Request a quote or contact sales to discuss pricing, availability, and lead times for the MTFC64GJDDN-3M WT.
