MTFC64GJVDN-3F WT
| Part Description |
IC FLASH 512GBIT MMC 169LFBGA |
|---|---|
| Quantity | 1,465 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 169-LFBGA (14x18) | Memory Format | FLASH | Technology | FLASH - NAND | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 512 Gbit | Access Time | N/A | Grade | Industrial | ||
| Clock Frequency | N/A | Voltage | 2.7V ~ 3.6V | Memory Type | Non-Volatile | ||
| Operating Temperature | -25°C ~ 85°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 169-LFBGA | ||
| Mounting Method | Non-Volatile | Memory Interface | MMC | Memory Organization | 64G x 8 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unknown | ||
| Qualification | N/A | ECCN | 3A991B1A | HTS Code | 8542.32.0071 |
Overview of MTFC64GJVDN-3F WT – IC FLASH 512GBIT MMC 169LFBGA
The MTFC64GJVDN-3F WT is a 512 Gbit non-volatile NAND flash memory device in Micron's e•MMC™ series, delivered in a 169‑LFBGA (14×18) package. It implements a MMC memory interface and a 64G × 8 memory organization.
This device is intended for systems requiring high-density embedded flash storage with operation across a 2.7 V to 3.6 V supply range and an ambient temperature rating of −25°C to 85°C.
Key Features
- Memory Type & Technology Non-volatile FLASH NAND memory offering persistent storage in an e•MMC™ form factor.
- Density & Organization 512 Gbit capacity organized as 64G × 8 to provide high storage density in a single device.
- Interface MMC memory interface for embedded storage integration.
- Supply Voltage Operates from 2.7 V to 3.6 V, supporting common embedded system power rails.
- Operating Temperature Rated for −25°C to 85°C ambient operation.
- Package 169‑LFBGA package (14×18) suitable for compact PCB integration.
- Memory Format & Mounting FLASH memory format with non-volatile mounting type.
Unique Advantages
- High storage capacity: 512 Gbit density supports large embedded data or file systems without multiple devices.
- Compact package: 169‑LFBGA (14×18) package enables dense PCB layouts and space-constrained designs.
- Standard MMC interface: MMC interface simplifies integration into systems designed for e•MMC™ memory connectivity.
- Wide supply range: 2.7 V–3.6 V operation accommodates common 3.3 V embedded power domains.
- Extended ambient operation: −25°C to 85°C rating supports a broad range of non-extreme environmental conditions.
- Known memory organization: 64G × 8 arrangement provides a clear mapping for system memory management.
Why Choose IC FLASH 512GBIT MMC 169LFBGA?
The MTFC64GJVDN-3F WT combines high-density 512 Gbit NAND flash with an MMC interface and a compact 169‑LFBGA package, offering a straightforward embedded storage option for designs that require significant non-volatile capacity within constrained board space and standard 3.3 V power domains. Its specified operating temperature range and supply voltage make it suitable for a variety of general-purpose embedded applications.
As part of Micron Technology Inc.'s e•MMC™ series, this device provides a defined memory organization and package footprint for engineers specifying embedded FLASH storage where clear, verifiable device characteristics are required.
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