MTFC64GJVDN-4M IT
| Part Description |
IC FLASH 512GBIT MMC 169LFBGA |
|---|---|
| Quantity | 417 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 169-LFBGA (14x18) | Memory Format | FLASH | Technology | FLASH - NAND | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 512 Gbit | Access Time | N/A | Grade | Industrial | ||
| Clock Frequency | N/A | Voltage | 2.7V ~ 3.6V | Memory Type | Non-Volatile | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 169-LFBGA | ||
| Mounting Method | Non-Volatile | Memory Interface | MMC | Memory Organization | 64G x 8 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unknown | ||
| Qualification | N/A | ECCN | 3A991B1A | HTS Code | 8523.51.0000 |
Overview of MTFC64GJVDN-4M IT – 512 Gbit e•MMC™ NAND Flash, 169-LFBGA
The MTFC64GJVDN-4M IT is a non-volatile NAND flash memory device in Micron Technology Inc.'s e•MMC™ series. It provides 512 Gbit of FLASH memory organized as 64G × 8 and interfaces via an MMC protocol.
Designed for embedded systems that require MMC-interface storage, the device combines high-density NAND flash in a compact 169-LFBGA (14×18) package and operates across a supply range of 2.7 V to 3.6 V and an ambient temperature range of −40°C to 85°C.
Key Features
- Memory Core NAND flash non-volatile memory with a total capacity of 512 Gbit, organized as 64G × 8 for byte-wide access.
- Interface MMC memory interface suitable for e•MMC™ system integration.
- Power Single-supply voltage operation from 2.7 V to 3.6 V.
- Package 169-LFBGA package (14×18 mm) for compact board-level integration.
- Operating Temperature Specified ambient operating range from −40°C to 85°C.
- Manufacturer and Series Micron Technology Inc., e•MMC™ series.
Typical Applications
- Embedded systems — Provides non-volatile MMC-interface storage for embedded devices that require high-capacity FLASH in a compact package.
- Consumer electronics — Suitable for consumer products requiring on-board MMC storage at densities up to 512 Gbit.
- Industrial equipment — Operates across −40°C to 85°C, supporting industrial designs that need stable non-volatile storage within that temperature range.
Unique Advantages
- High-density storage: 512 Gbit capacity delivers large embedded storage in a single device.
- Standard MMC interface: e•MMC™/MMC interface simplifies integration with host controllers that use the MMC protocol.
- Wide voltage range: 2.7 V to 3.6 V supply range supports common system power rails.
- Compact LFBGA package: 169-LFBGA (14×18) minimizes board area while providing a surface-mount profile.
- Extended operating temperature: −40°C to 85°C ambient rating supports temperature-tolerant designs.
- Micron e•MMC™ series: Part of Micron's e•MMC™ lineup for consistent form-factor and interface expectations.
Why Choose IC FLASH 512GBIT MMC 169LFBGA?
The MTFC64GJVDN-4M IT positions a high-capacity NAND flash solution within a standard MMC interface and compact LFBGA footprint, aimed at designs that need large on-board non-volatile storage while adhering to common supply voltages and extended ambient temperatures. Its 512 Gbit organization and MMC connectivity make it suitable for engineers specifying dense embedded storage where board area and operating temperature range are key constraints.
As a member of Micron Technology Inc.'s e•MMC™ series, the device offers a consistent interface and packaging approach for system integrators seeking a high-density flash option backed by a recognized memory manufacturer.
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