MTFC64GAZAQHD-WT TR

IC FLASH 512GBIT EMMC 153VFBGA
Part Description

IC FLASH 512GBIT EMMC 153VFBGA

Quantity 757 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package153-VFBGA (11.5x13)Memory FormatFLASHTechnologyFLASH - NAND (SLC)
Memory Size512 GbitAccess TimeN/AGradeIndustrial
Clock Frequency200 MHzVoltage2.7V ~ 3.6VMemory TypeNon-Volatile
Operating Temperature-25°C ~ 85°C (TA)Write Cycle Time Word PageN/APackaging153-VFBGA
Mounting MethodNon-VolatileMemory InterfaceeMMC_5.1Memory Organization64G x 8
Moisture Sensitivity LevelN/ARoHS ComplianceUnknownREACH ComplianceREACH Unaffected
QualificationN/AECCNN/AHTS CodeN/A

Overview of MTFC64GAZAQHD-WT TR – IC FLASH 512GBIT EMMC 153VFBGA

The MTFC64GAZAQHD-WT is a 512 Gbit non-volatile NAND flash memory device with an integrated MMC controller, delivered in a 153-ball VFBGA package. It implements the e.MMC 5.1 interface and is offered as an industrial e.MMC product family member for embedded storage applications.

Designed for embedded and industrial systems, the device provides high-density removable storage, on-board management features and an industrial operating temperature range, offering a compact storage option that integrates NAND flash and controller functionality.

Key Features

  • Memory Type & Density 512 Gbit FLASH NAND (SLC) organized as 64G × 8 for high-capacity embedded storage.
  • e.MMC 5.1 Interface JEDEC/MMC standard version 5.1-compliant implementation with an advanced 12-signal interface and selectable ×1, ×4, and ×8 I/Os.
  • Performance e.MMC interface clock up to 200 MHz and a boot-frequency range to support high-speed boot operation and HS200/HS400 modes.
  • Power VCC supply range 2.7–3.6 V (VCCQ operation documented at 1.70–1.95 V in device specifications).
  • System Reliability & Management On-device ECC and block management, command queue, BKOPS control, reliable write, discard and sanitize, power-off notification, and device health reporting.
  • Security & Partitioning Replay-protected memory block (RPMB), multiple partitions with enhanced attributes, temporary and permanent write protection, and high-priority interrupt (HPI).
  • Boot & Maintainability Boot operation with high-speed boot support, hardware reset signal, field firmware update (FFU), and background operation features.
  • Package & Mechanical 153-ball VFBGA package (11.5 mm × 13 mm; package height shown in ordering information) for compact board-level integration.
  • Temperature Range Operating case temperature for the WT variant: −25°C to +85°C (TOPER measured at the case surface center/top).
  • Data Retention Documented retention: 1 year @ 55°C at maximum program/erase (PE); 10 years @ 55°C at 10% of PE.

Typical Applications

  • Industrial Embedded Systems Provides high-density persistent storage and on-board management functions for industrial controllers and automation platforms operating in the −25°C to +85°C range.
  • Boot and Firmware Storage Supports high-speed boot operation and field firmware update (FFU) for devices that require reliable boot media and in-field firmware maintenance.
  • Networking and Communication Equipment Acts as compact, managed non-volatile storage for system software, configuration, and logs where an integrated e.MMC solution simplifies board design.
  • Instrumentation and Test Equipment Delivers large local storage capacity with device health reporting and power-off notification for test systems and data loggers.

Unique Advantages

  • Integrated NAND + Controller: Combines Micron NAND flash with an MMC controller to simplify host integration and reduce external management requirements.
  • Standards-Based Interface: JEDEC e.MMC 5.1 compliance and support for HS200/HS400 modes and up to 200 MHz clocking enable predictable host interoperability.
  • High Capacity in Compact Package: 512 Gbit in a 153-ball VFBGA (11.5 mm × 13 mm) footprint supports space-constrained designs needing large local storage.
  • Industrial Temperature Support: WT variant rated for −25°C to +85°C, addressing many industrial deployment environments.
  • Robust Data Management: On-device ECC, block management, reliable write, RPMB and multiple partition support provide enhanced data integrity and security options.
  • Field Maintainability: Field firmware update, device health report and background operations help reduce service overhead and simplify maintenance.

Why Choose IC FLASH 512GBIT EMMC 153VFBGA?

The MTFC64GAZAQHD-WT integrates high-density NAND flash and an e.MMC 5.1-compliant controller into a compact 153-ball VFBGA package, offering a self-managed storage solution suitable for embedded and industrial applications. Its combination of capacity, standardized high-speed interface and on-device management features supports designs that require large local storage with simplified host interaction.

With documented operating and retention characteristics and features for boot, security and field updates, this e.MMC device is positioned for customers building industrial-grade embedded systems, networking equipment and instrumentation that need scalable, managed non-volatile storage.

Request a quote or submit an inquiry for pricing and availability for the MTFC64GAZAQHD-WT 512 Gbit e.MMC device.

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