MTFC8GAKAJCN-4M IT
| Part Description |
IC FLASH 64GBIT MMC 153VFBGA |
|---|---|
| Quantity | 343 Available (as of May 6, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 153-VFBGA (11.5x13) | Memory Format | FLASH | Technology | FLASH - NAND | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 64 Gbit | Access Time | N/A | Grade | Industrial | ||
| Clock Frequency | N/A | Voltage | 2.7V ~ 3.6V | Memory Type | Non-Volatile | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 153-VFBGA | ||
| Mounting Method | Non-Volatile | Memory Interface | MMC | Memory Organization | 8G x 8 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | 3A991B1A | HTS Code | 8542.32.0071 |
Overview of MTFC8GAKAJCN-4M IT – 64 Gbit e•MMC NAND Flash (153‑VFBGA)
The MTFC8GAKAJCN-4M IT is a 64 Gbit non-volatile NAND flash memory device in Micron's e•MMC™ series. It provides organized 8G × 8 memory in a standard MMC interface, suitable for embedded storage applications requiring compact packaged flash.
Designed for systems that operate from a 2.7 V to 3.6 V supply and across an extended ambient temperature range of -40 °C to 85 °C, the device targets designs that need high-density, board-mounted non-volatile storage in a 153‑VFBGA package (11.5 × 13 mm).
Key Features
- Memory Type and Technology Non-volatile NAND flash memory offering persistent storage for embedded systems.
- Capacity and Organization 64 Gbit total capacity organized as 8G × 8, providing high-density on-board storage.
- Interface MMC memory interface for integration with host controllers that support e•MMC series devices.
- Voltage Supply Operates from 2.7 V to 3.6 V, compatible with common embedded system power rails.
- Operating Temperature Rated for -40 °C to 85 °C (TA), supporting extended-temperature applications.
- Package Supplied in a 153‑VFBGA package (11.5 × 13 mm), enabling compact PCB footprints and high-density board mounting.
- Manufacturer and Series Micron Technology Inc. e•MMC™ series device, identified by part number MTFC8GAKAJCN-4M IT.
Typical Applications
- Embedded Storage System-level non-volatile storage where a standard MMC interface is required for firmware and data retention.
- Consumer Electronics Compact devices that need high-density onboard flash in a small package and standard MMC connectivity.
- Industrial Equipment Systems operating across wide ambient temperatures that require board-mounted NAND flash storage.
Unique Advantages
- High-density 64 Gbit capacity: Provides substantial on-board storage in a single device to simplify BOM and layout considerations.
- Standard MMC interface: Facilitates integration with host controllers that support e•MMC series memory, reducing interface complexity.
- Wide operating voltage range: 2.7 V to 3.6 V operation accommodates common embedded power rails and simplifies power design.
- Extended temperature rating: -40 °C to 85 °C specification supports deployment in environments with broader temperature variation.
- Compact 153‑VFBGA package: 11.5 × 13 mm footprint enables space-constrained PCB designs while providing robust board-mounted flash.
Why Choose IC FLASH 64GBIT MMC 153VFBGA?
The MTFC8GAKAJCN-4M IT positions itself as a high-density, board-mounted e•MMC NAND flash solution that balances capacity, compact packaging, and broad operating conditions. Its 64 Gbit organization, standard MMC interface, and 153‑VFBGA package make it suitable for designers seeking integrated non-volatile storage in space-constrained or thermally demanding applications.
Manufactured by Micron Technology Inc., this device is appropriate for projects that require straightforward MMC integration, robust voltage interoperability, and an extended ambient temperature range—delivering a scalable storage option for embedded, consumer, and industrial designs.
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