MTFC8GLUDM-AIT TR
| Part Description |
IC FLASH 64GBIT MMC 153TFBGA |
|---|---|
| Quantity | 514 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 153-TFBGA (11.5x13) | Memory Format | FLASH | Technology | FLASH - NAND | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 64 Gbit | Access Time | N/A | Grade | Automotive | ||
| Clock Frequency | N/A | Voltage | 2.7V ~ 3.6V | Memory Type | Non-Volatile | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 153-TFBGA | ||
| Mounting Method | Non-Volatile | Memory Interface | MMC | Memory Organization | 8G x 8 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unknown | ||
| Qualification | N/A | ECCN | 3A991B1A | HTS Code | 8542.32.0071 |
Overview of MTFC8GLUDM-AIT TR – IC FLASH 64GBIT MMC 153TFBGA
The MTFC8GLUDM-AIT TR is a 64 Gbit non-volatile NAND flash memory device provided in a 153-TFBGA (11.5×13 mm) package. It implements NAND FLASH technology with an MMC memory interface and an 8G × 8 memory organization.
Key electrical and environmental parameters from the product data include a 2.7 V to 3.6 V supply range and an ambient operating temperature range of -40°C to 85°C, making the device suitable for designs that require this combination of density, interface, voltage range, and temperature capability.
Key Features
- Memory Technology NAND FLASH non-volatile memory providing persistent storage without power.
- Capacity & Organization 64 Gbit capacity with an 8G × 8 memory organization for high-density on-board storage.
- Interface MMC memory interface for connection to MMC-compatible hosts and controllers.
- Voltage Supply Operates from 2.7 V to 3.6 V, matching common system supply rails.
- Operating Temperature Rated for ambient operation from -40°C to 85°C (TA).
- Package 153-TFBGA package (11.5 × 13 mm) in a ball grid array footprint for compact board integration.
- Grade Listed grade: Automotive (as specified in the product data).
Unique Advantages
- High-density storage: 64 Gbit capacity in a single device provides substantial on-board flash without multiple components.
- Standard MMC interface: Enables integration into systems and controllers that support MMC connectivity.
- Flexible supply range: 2.7 V–3.6 V operation accommodates a variety of system power architectures.
- Extended ambient temperature window: -40°C to 85°C supports designs operating across a wide temperature range.
- Compact BGA footprint: 153-TFBGA (11.5×13 mm) package helps save PCB area in space-constrained designs.
Why Choose MTFC8GLUDM-AIT TR?
The MTFC8GLUDM-AIT TR delivers 64 Gbit of NAND flash in a compact 153-TFBGA package with an MMC interface and a broad supply voltage and temperature range. These documented characteristics make it suitable for designs that require substantial non-volatile storage packaged for space-efficient integration.
Engineers specifying this device can rely on the explicit device attributes—capacity, memory organization, interface type, supply range, package, and operating temperature—to determine fit for their system requirements and to plan PCB layout and power domains accordingly.
Request a quote or submit an inquiry for pricing and availability of the MTFC8GLUDM-AIT TR.
