MTFC8GLUDM-AIT

The MTFC8GLUDM-AIT is a 64 Gbit non-volatile flash memory device based on NAND flash technology with an MMC memory interface. It provides high-density storage in a 153-TFBGA package and is intended for designs that require onboard flash in a compact BGA form factor.

Core attributes include an 8G × 8 memory organization, a 2.7V–3.6V supply range, and an operating temperature range of -40°C to 85°C (TA), making it suitable for systems that require solid-state MMC storage across a broad voltage and temperature window.

Key Features

• Memory Type & Technology 64 Gbit non-volatile flash using NAND flash technology for high-density solid-state storage.
• Memory Organization Organized as 8G × 8 to match byte-oriented MMC interfaces and system memory maps.
• Interface MMC memory interface for integration into host controllers that support MMC protocols.
• Power Wide supply voltage range from 2.7V to 3.6V to support common system power rails.
• Package 153-TFBGA package (153-TFBGA (11.5x13)) providing a compact BGA footprint for board-level mounting.
• Temperature Range Rated for operation from -40°C to 85°C (TA) to accommodate applications with wide ambient temperature requirements.
• Grade Grade listed as Automotive in the product data.

Typical Applications

• Embedded Storage Onboard MMC storage for embedded systems that require non-volatile NAND flash in a compact package.
• Consumer Electronics Solid-state storage for consumer devices that use MMC interfaces and benefit from high-density flash.
• Industrial Equipment Data storage in industrial controllers and instrumentation where the -40°C to 85°C operating range is required.

Unique Advantages

• High-density flash: 64 Gbit capacity provides ample non-volatile storage for firmware, data logging, and media assets.
• Standard MMC interface: MMC interface simplifies integration with host controllers that support MMC protocols.
• Wide supply voltage: 2.7V–3.6V operation accommodates common 3V system power rails and improves design flexibility.
• Wide temperature window: -40°C to 85°C (TA) operation supports deployment in environments with broad ambient temperature ranges.
• Compact BGA footprint: 153-TFBGA (11.5x13) package enables high-density PCB layouts and board-level mounting.

Why Choose IC FLASH 64GBIT MMC 153TFBGA?

The MTFC8GLUDM-AIT delivers a straightforward, high-density NAND flash option with an MMC interface, a broad operating temperature range, and a compact 153-TFBGA package. Its combination of 64 Gbit capacity, 8G × 8 organization, and 2.7V–3.6V power range makes it a practical choice for designs that require solid-state MMC storage in a small footprint.

This device is well suited to engineers and procurement teams integrating onboard flash where standard MMC connectivity, compact BGA packaging, and operation across a wide ambient temperature range are priorities. The clear, specification-driven feature set simplifies component selection and board-level integration.

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