MTFC8GLVEA-4M IT TR
| Part Description |
IC FLASH 64GBIT MMC 153WFBGA |
|---|---|
| Quantity | 514 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 153-WFBGA (11.5x13) | Memory Format | FLASH | Technology | FLASH - NAND | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 64 Gbit | Access Time | N/A | Grade | Industrial | ||
| Clock Frequency | N/A | Voltage | 2.7V ~ 3.6V | Memory Type | Non-Volatile | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 153-WFBGA | ||
| Mounting Method | Non-Volatile | Memory Interface | MMC | Memory Organization | 8G x 8 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unknown | ||
| Qualification | N/A | ECCN | 3A991B1A | HTS Code | 8542.32.0071 |
Overview of MTFC8GLVEA-4M IT TR – IC FLASH 64GBIT MMC 153WFBGA
The MTFC8GLVEA-4M IT TR is a Micron e•MMC series non-volatile flash memory device implemented with NAND FLASH technology. It delivers 64 Gbit of organized storage (8G × 8) in an MMC interface format for embedded storage applications that require a compact, single-package solution.
Designed for systems operating from 2.7 V to 3.6 V and across an ambient temperature range of −40°C to 85°C, this 153-WFBGA (11.5 × 13 mm) packaged device targets designs where board space, standard MMC connectivity and broad environmental range are key considerations.
Key Features
- Memory Core Non-volatile FLASH - NAND technology providing 64 Gbit raw capacity.
- Organization 8G × 8 memory organization for byte-oriented access and addressing.
- Interface MMC memory interface for integration into MMC-based host controllers and subsystems.
- Voltage Supply Wide supply range of 2.7 V to 3.6 V to support typical embedded system power rails.
- Operating Temperature Qualified for use from −40°C to 85°C (TA), supporting extended ambient conditions.
- Package 153-WFBGA package, 11.5 × 13 mm footprint, enabling compact PCB integration.
- Product Series e•MMC™ series device offering a standardized MMC flash form factor for embedded designs.
Typical Applications
- Embedded Storage Provides on-board non-volatile storage in systems that use an MMC interface for firmware, filesystem or data storage.
- Space-Constrained Designs The 153-WFBGA (11.5 × 13 mm) package suits compact PCBs where board area is limited.
- Extended-Temperature Systems Suitable for applications that must operate across −40°C to 85°C ambient temperatures.
Unique Advantages
- High Capacity in a Small Package: 64 Gbit density delivered in a 153-WFBGA (11.5 × 13 mm) footprint reduces PCB area for storage.
- Standard MMC Interface: MMC interface enables straightforward integration with MMC-compatible host controllers.
- Wide Voltage Range: 2.7 V to 3.6 V supply flexibility supports common embedded power rails.
- Broad Operating Temperature: −40°C to 85°C rating supports use in varied environmental conditions.
- e•MMC Series Form Factor: e•MMC packaging and format simplify replacement or platform reuse within MMC-based designs.
Why Choose IC FLASH 64GBIT MMC 153WFBGA?
The MTFC8GLVEA-4M IT TR positions itself as a compact, MMC-interface non-volatile memory option delivering 64 Gbit NAND FLASH in a 153-WFBGA package. Its combination of capacity, standard MMC connectivity, 2.7 V–3.6 V supply range and −40°C to 85°C operating window makes it suitable for embedded systems that require a reliable, high-density storage component in a small footprint.
This device is appropriate for designs focused on integrating MMC-format flash with constrained board area and extended ambient requirements, providing a straightforward storage solution based on documented memory organization and package specifications.
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