MTFC8GLVEA-4M IT TR

IC FLASH 64GBIT MMC 153WFBGA
Part Description

IC FLASH 64GBIT MMC 153WFBGA

Quantity 514 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package153-WFBGA (11.5x13)Memory FormatFLASHTechnologyFLASH - NAND
Memory Size64 GbitAccess TimeN/AGradeIndustrial
Clock FrequencyN/AVoltage2.7V ~ 3.6VMemory TypeNon-Volatile
Operating Temperature-40°C ~ 85°C (TA)Write Cycle Time Word PageN/APackaging153-WFBGA
Mounting MethodNon-VolatileMemory InterfaceMMCMemory Organization8G x 8
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unknown
QualificationN/AECCN3A991B1AHTS Code8542.32.0071

Overview of MTFC8GLVEA-4M IT TR – IC FLASH 64GBIT MMC 153WFBGA

The MTFC8GLVEA-4M IT TR is a Micron e•MMC series non-volatile flash memory device implemented with NAND FLASH technology. It delivers 64 Gbit of organized storage (8G × 8) in an MMC interface format for embedded storage applications that require a compact, single-package solution.

Designed for systems operating from 2.7 V to 3.6 V and across an ambient temperature range of −40°C to 85°C, this 153-WFBGA (11.5 × 13 mm) packaged device targets designs where board space, standard MMC connectivity and broad environmental range are key considerations.

Key Features

  • Memory Core Non-volatile FLASH - NAND technology providing 64 Gbit raw capacity.
  • Organization 8G × 8 memory organization for byte-oriented access and addressing.
  • Interface MMC memory interface for integration into MMC-based host controllers and subsystems.
  • Voltage Supply Wide supply range of 2.7 V to 3.6 V to support typical embedded system power rails.
  • Operating Temperature Qualified for use from −40°C to 85°C (TA), supporting extended ambient conditions.
  • Package 153-WFBGA package, 11.5 × 13 mm footprint, enabling compact PCB integration.
  • Product Series e•MMC™ series device offering a standardized MMC flash form factor for embedded designs.

Typical Applications

  • Embedded Storage Provides on-board non-volatile storage in systems that use an MMC interface for firmware, filesystem or data storage.
  • Space-Constrained Designs The 153-WFBGA (11.5 × 13 mm) package suits compact PCBs where board area is limited.
  • Extended-Temperature Systems Suitable for applications that must operate across −40°C to 85°C ambient temperatures.

Unique Advantages

  • High Capacity in a Small Package: 64 Gbit density delivered in a 153-WFBGA (11.5 × 13 mm) footprint reduces PCB area for storage.
  • Standard MMC Interface: MMC interface enables straightforward integration with MMC-compatible host controllers.
  • Wide Voltage Range: 2.7 V to 3.6 V supply flexibility supports common embedded power rails.
  • Broad Operating Temperature: −40°C to 85°C rating supports use in varied environmental conditions.
  • e•MMC Series Form Factor: e•MMC packaging and format simplify replacement or platform reuse within MMC-based designs.

Why Choose IC FLASH 64GBIT MMC 153WFBGA?

The MTFC8GLVEA-4M IT TR positions itself as a compact, MMC-interface non-volatile memory option delivering 64 Gbit NAND FLASH in a 153-WFBGA package. Its combination of capacity, standard MMC connectivity, 2.7 V–3.6 V supply range and −40°C to 85°C operating window makes it suitable for embedded systems that require a reliable, high-density storage component in a small footprint.

This device is appropriate for designs focused on integrating MMC-format flash with constrained board area and extended ambient requirements, providing a straightforward storage solution based on documented memory organization and package specifications.

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