THGBMHG6C1LBAIL

The THGBMHG6C1LBAIL is a 64 Gbit non-volatile NAND flash memory in an e·MMC form factor with an integrated controller and managed memory functions. It implements FLASH-NAND technology and a JEDEC-compliant eMMC interface to provide cost-effective mass storage for embedded systems.

Targeted for industrial and consumer segments, the device supports applications such as multimedia, smart metering, and intelligent lighting, offering a balance of density, integration and standard interface compatibility for straightforward design-in.

Key Features

• Memory Technology 15 nm NAND flash (MLC) implemented as 8G × 8 organization for a total capacity of 64 Gbit.
• Interface & Standards eMMC memory interface with JEDEC 5.1 compliance and support for high-speed operation (HS400).
• Integrated Management On-device controller provides integrated memory management including error correction code (ECC), bad block management, wear-leveling and garbage collection.
• Performance 52 MHz clock frequency support for host interface timing.
• Power Single supply operation across a 2.7 V to 3.6 V range.
• Package 153-WFBGA package (11.5 × 13 mm) optimized for compact embedded designs.
• Operating Range Specified operating temperature range of −25 °C to +85 °C (TA).

Typical Applications

• Industrial Equipment Local non-volatile storage for firmware, logs and configuration data in industrial controllers and monitoring devices.
• Consumer Electronics On-board flash storage for multimedia players, set-top devices and other consumer applications requiring managed mass storage.
• Multimedia Devices Storage for audio/video content and application data where compact, managed flash is required.
• Smart Metering & Intelligent Lighting Reliable embedded storage for metering data, firmware updates and system configuration in smart infrastructure devices.

Unique Advantages

• Standards-based integration: JEDEC-compliant eMMC interface simplifies host integration and command compatibility.
• Managed memory reduces host overhead: On-board controller and features such as ECC, bad block management, wear-leveling and garbage collection minimize the software burden on the host.
• High interface speed: HS400 support provides higher throughput where required by application workloads.
• Wide power range: 2.7 V to 3.6 V supply range supports common embedded power rails.
• Compact FBGA package: 153-WFBGA (11.5 × 13 mm) offers a small footprint for space-constrained designs.
• Family scalability: Available across multiple densities in the e·MMC product line to match capacity requirements.

Why Choose IC FLASH 64GBIT EMMC 153WFBGA?

The THGBMHG6C1LBAIL delivers managed NAND flash storage with an integrated controller and JEDEC-compliant eMMC interface, making it suitable for embedded designs that require straightforward integration of non-volatile mass storage. Its combination of ECC, wear-leveling and standard interface support helps reduce host complexity while providing reliable storage behavior.

This device is appropriate for designers of industrial and consumer systems that need a compact, standards-based storage component across a broad operating temperature and supply range, and for programs that benefit from the scalability of the e·MMC product family.

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