W74M25JVZEIQ
| Part Description |
IC FLASH 256MBIT SPI/QUAD 8WSON |
|---|---|
| Quantity | 368 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Winbond Electronics |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 24 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 8-WSON (8x6) | Memory Format | FLASH | Technology | FLASH - NAND | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 256 Mbit | Access Time | N/A | Grade | Industrial | ||
| Clock Frequency | 80 MHz | Voltage | 2.7V ~ 3.6V | Memory Type | Non-Volatile | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 8-WDFN Exposed Pad | ||
| Mounting Method | Non-Volatile | Memory Interface | SPI - Quad I/O, QPI, DTR | Memory Organization | 32M x 8 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | 3A991B1A | HTS Code | 8542.32.0071 |
Overview of W74M25JVZEIQ – IC FLASH 256Mbit SPI/Quad 8WSON
The W74M25JVZEIQ is a 256 Mbit serial flash memory device in Winbond's SpiFlash® family. It is a 3V NAND Flash-based non-volatile memory organized as 32M x 8 and designed for compact systems requiring code storage, execute-in-place (XIP) and data retention.
This device supports standard SPI plus Dual/Quad I/O SPI, QPI and DTR interfaces, includes secure authentication features, and is offered in a space-saving 8-WSON (8×6 mm) package for size-constrained applications.
Key Features
- Memory Density & Organization — 256 Mbit capacity organized as 32M × 8 for code and data storage.
- Memory Technology — Non-volatile FLASH (NAND) memory suitable for persistent storage.
- Serial Interfaces — SPI with Dual/Quad I/O, QPI and DTR support to enable higher-bandwidth serial transfers when used with compatible controllers.
- Clock — Documented clock frequency: 80 MHz.
- Execute-in-Place (XIP) — Supports executing code directly from Dual/Quad SPI as described in the product documentation.
- Security & Authentication — Built-in secure authentication features including a Hash-based Message Authentication Code (HMAC) SHA-256 crypto accelerator, dedicated authentication command set, and authentication flash operations.
- Device Identification & Security Registers — JEDEC standard manufacturer/device ID and SFDP, a 64-bit unique serial number, and three 256-byte security registers.
- Power & Voltage — Operates from 2.7 V to 3.6 V, matching common 3V system rails.
- Temperature Range — Specified operating ambient range of −40 °C to 85 °C.
- Package — 8-pad WSON (8-WSON, 8 × 6 mm) with exposed pad (8-WDFN) for a compact board footprint and thermal conduction.
Typical Applications
- Embedded systems and firmware storage — Code shadowing to RAM and execute-in-place (XIP) from Dual/Quad SPI for systems with limited pin count and board area.
- Consumer and multimedia storage — Storage of voice, text and other data where a 256 Mbit serial flash is required.
- Secure authentication and key storage — On-chip HMAC SHA-256 and authentication flash operations for secure device authentication and monotonic counter support.
Unique Advantages
- Secure authentication built-in — Integrated HMAC SHA-256 accelerator and dedicated authentication commands provide on-device cryptographic capabilities for integrity and authentication use cases.
- Flexible high-speed serial interfaces — Dual/Quad I/O, QPI and DTR modes allow higher effective data rates when paired with compatible hosts.
- Compact thermal-friendly package — 8-WSON (8 × 6 mm) with exposed pad minimizes PCB area while providing a thermal path for reliable operation.
- Wide operating conditions — 2.7 V–3.6 V supply and −40 °C to 85 °C operating range support common 3V systems and extended ambient temperatures.
- Device identification and security registers — JEDEC ID, SFDP, a 64-bit unique serial number and dedicated security registers simplify inventorying and secure storage tasks.
Why Choose W74M25JVZEIQ?
The W74M25JVZEIQ combines 256 Mbit non-volatile NAND Flash density with flexible SPI-based interfaces and on-chip secure authentication capabilities, making it suitable for embedded designs that require compact code/data storage plus built-in cryptographic operations. Its support for Dual/Quad I/O, QPI and DTR modes and execute-in-place usage addresses systems that need higher effective serial throughput without increasing pin count.
As part of Winbond's SpiFlash® lineup, this device is targeted at designers seeking a compact, authenticated serial flash solution with a standard voltage range and extended operating temperature window for robust operation in space-constrained designs.
Request a quote or submit an inquiry for pricing and lead-time information, and refer to the product datasheet for detailed electrical characteristics, instruction set tables and package specifications.