W9812G6JB-6 TR

IC DRAM 128MBIT PAR 54TFBGA
Part Description

IC DRAM 128MBIT PAR 54TFBGA

Quantity 227 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerWinbond Electronics
Manufacturing StatusActive
Manufacturer Standard Lead Time24 Weeks
Datasheet

Specifications & Environmental

Device Package54-TFBGA (8x8)Memory FormatDRAMTechnologySDRAM
Memory Size128 MbitAccess Time5 nsGradeCommercial
Clock Frequency166 MHzVoltage3V ~ 3.6VMemory TypeVolatile
Operating Temperature0°C ~ 70°C (TA)Write Cycle Time Word PageN/APackaging54-TFBGA
Mounting MethodVolatileMemory InterfaceParallelMemory Organization8M x 16
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0002

Overview of W9812G6JB-6 TR – IC DRAM 128MBIT PAR 54TFBGA

The W9812G6JB-6 TR is a 128 Mbit synchronous DRAM (SDRAM) device organized as 2M × 4 banks × 16 bits (8M × 16). It implements parallel SDRAM architecture and is specified for operation up to 166 MHz (‑6 speed grade) with a CAS latency class referenced in the datasheet.

Designed for high-speed synchronous memory applications, this part provides standard SDRAM functional modes such as burst read/write, auto-precharge, self-refresh and power-down, packaged in a 54‑TFBGA (8×8) footprint with a 3.0 V to 3.6 V supply range and an operating temperature range of 0°C to 70°C (TA).

Key Features

  • Core Memory Organization  Organized as 2M × 4 banks × 16 bits (8M × 16) to deliver a total density of 128 Mbit.
  • SDRAM Technology  Synchronous DRAM architecture with standard SDRAM command set and burst operation modes for sequential data transfers.
  • Performance  Rated for up to 166 MHz operation for the -6 speed grade with an access time of 5 ns as indicated in the specifications.
  • Supported Functional Modes  Includes power-up and initialization, mode register set, bank activate, burst read/write, auto-precharge, precharge, self-refresh and power-down modes (per datasheet functional descriptions).
  • Parallel Memory Interface  Standard parallel SDRAM interface suitable for parallel memory system designs.
  • Power  Operating supply voltage range of 3.0 V to 3.6 V.
  • Package  54‑TFBGA package (8×8) for compact board-level integration.
  • Temperature Range  Specified operating ambient temperature: 0°C to 70°C (TA).

Unique Advantages

  • Compact BGA footprint: The 54‑TFBGA (8×8) package enables dense PCB placement while providing the pinout required for parallel SDRAM implementations.
  • High-frequency capability: Compliance to the -6 speed grade supports 166 MHz operation, enabling higher bandwidth memory transfers where required.
  • Standard SDRAM feature set: Built-in support for burst read/write, auto-precharge, self-refresh and power-down simplifies memory controller integration and common memory management tasks.
  • Mid-range density: 128 Mbit capacity in a single device supports moderate memory density requirements without multi-device complexity.
  • Wide supply tolerance: 3.0 V to 3.6 V supply range accommodates designs using standard 3.3 V systems.

Why Choose W9812G6JB-6 TR?

The W9812G6JB-6 TR provides a compact 128 Mbit SDRAM solution with a parallel interface and standard SDRAM feature set, making it suitable for designs that require synchronous burst transfers, self-refresh capability and standard command-based memory control. Its 166 MHz-rated speed grade and 5 ns access metric align it with applications needing moderate throughput in a small BGA package.

With a defined operating voltage range (3.0 V–3.6 V) and ambient temperature window (0°C–70°C), this device fits system designs that match those electrical and thermal envelopes and where the 54‑TFBGA mounting is desired for board-level integration.

If you would like pricing, availability or technical clarification, request a quote or contact sales to discuss lead times and ordering options.

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