W9825G6KB-6I

IC DRAM 256MBIT LVTTL 54TFBGA
Part Description

IC DRAM 256MBIT LVTTL 54TFBGA

Quantity 1,778 Available (as of May 6, 2026)
Product CategoryMemory
ManufacturerWinbond Electronics
Manufacturing StatusActive
Manufacturer Standard Lead Time24 Weeks
Datasheet

Specifications & Environmental

Device Package54-TFBGA (8x8)Memory FormatDRAMTechnologySDRAM
Memory Size256 MbitAccess Time5 nsGradeIndustrial
Clock Frequency166 MHzVoltage3V ~ 3.6VMemory TypeVolatile
Operating Temperature-40°C ~ 85°C (TC)Write Cycle Time Word PageN/APackaging54-TFBGA
Mounting MethodVolatileMemory InterfaceLVTTLMemory Organization16M x 16
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS CompliantREACH ComplianceREACH Unknown
QualificationN/AECCNEAR99HTS Code8542.32.0024

Overview of W9825G6KB-6I – IC DRAM 256MBIT LVTTL 54TFBGA

The W9825G6KB-6I from Winbond Electronics is a 256 Mbit high-speed synchronous DRAM (SDRAM) device organized as 4M × 4 banks × 16 bits. It is offered in a 54-TFBGA (8×8) package and uses an LVTTL memory interface.

Designed for systems requiring standard SDRAM functionality, the device supports operation to 166 MHz (166M words per second) with a 5 ns access time and the -6I grade provides an industrial case temperature range of −40°C to 85°C.

Key Features

  • Core and architecture — 4M × 4 banks × 16 bits organization yielding 256 Mbit total SDRAM capacity (16M × 16 memory organization).
  • Performance — Clock frequency up to 166 MHz and 5 ns access time; parts are sorted to the 166MHz/CL3 timing grade.
  • Interface — LVTTL memory interface for standard SDRAM signaling.
  • Power — Supply voltage range 3.0 V to 3.6 V.
  • Temperature range — Industrial-grade -6I supports −40°C to 85°C (TCASE).
  • Package — 54-TFBGA (8×8) supplier device package for compact board integration.
  • SDRAM functionality — Supports standard SDRAM commands and modes including power-up and initialization, mode register programming, bank activate, burst read/write, auto-precharge, self-refresh and power-down.

Typical Applications

  • PC-class memory subsystems — Suited to designs that follow the personal computer industrial timing standards at 166 MHz/CL3.
  • Industrial and embedded systems — Industrial temperature rating (−40°C to 85°C for the -6I grade) for extended-environment use.
  • Compact module designs — 54-TFBGA (8×8) package supports space-constrained PCBs requiring 256 Mbit SDRAM.

Unique Advantages

  • High-speed SDRAM operation: 166 MHz clock capability with 5 ns access time for predictable data throughput.
  • Complete SDRAM feature set: Native support for burst operations, auto-precharge and self-refresh to match standard memory controller flows.
  • Industrial temperature support: −40°C to 85°C (TCASE) on the -6I grade for broader operating conditions.
  • Compact BGA footprint: 54-TFBGA (8×8) package minimizes board area for high-density designs.
  • Standard 3 V power domain: 3.0–3.6 V supply range compatible with typical 3 V SDRAM rails.

Why Choose W9825G6KB-6I?

The W9825G6KB-6I provides a commercial SDRAM option with a 256 Mbit density, a 4M × 4 banks × 16-bit architecture and standard SDRAM command support. Its 166 MHz operation and 5 ns access time address designs that require established SDRAM timing and burst access modes.

Packaged in a 54-TFBGA (8×8) and rated for a 3.0–3.6 V supply, with the -6I industrial temperature range of −40°C to 85°C, the device is appropriate for PC-class and industrial embedded designs where known SDRAM performance, a compact footprint, and industrial temperature capability are required.

Request a quote or submit a request for pricing and availability for the W9825G6KB-6I to receive lead-time and ordering information.

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