AM3352BZCE30

IC MPU SITARA 300MHZ 298NFBGA
Part Description

ARM® Cortex®-A8 Microprocessor IC Sitara™ 1 Core, 32-Bit 300MHz 298-NFBGA (13x13)

Quantity 546 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesSitara AM335x
ManufacturerTexas Instruments
Manufacturing StatusActive
Manufacturer Standard Lead Time6 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A8Device Package298-NFBGA (13x13)
Display & Interface ControllersLCD, TouchscreenECCN5A992CEthernet10/100/1000Mbps (2)
GradeCommercialGraphics AccelerationYesHTS Code8542.31.0001
Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface MountMounting TypeSurface Mount
Number of Cores/Bus Width1 Core, 32-BitOperating Temperature0°C ~ 90°C (TJ)Package / Case298-LFBGA
RAM ControllersLPDDR, DDR2, DDR3, DDR3LREACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 Compliant
Security FeaturesCryptography, Random Number GeneratorSpeed300MHzSupplier Device Package298-NFBGA (13×13)
USBUSB 2.0 + PHY (2)Voltage – I/O1.8V, 3.3V

Overview of AM3352BZCE30 – IC MPU SITARA 300MHZ 298NFBGA

The AM3352BZCE30 is an embedded microprocessor in the Sitara AM335x family featuring a single ARM® Cortex®‑A8 32‑bit core running at 300 MHz. Designed for embedded applications, the device integrates multiple connectivity and multimedia interfaces alongside security features to address designs that require on‑board display, networking, and peripheral support.

As a commercial‑grade, surface‑mount MPU in a 298‑NFBGA (13×13) package, the AM3352BZCE30 provides a compact, integration‑focused solution for embedded systems that need Ethernet, USB, display, and memory controller support within a single device footprint.

Key Features

  • Core — ARM® Cortex®‑A8 single core, 32‑bit architecture running at 300 MHz for general embedded processing tasks.
  • Multimedia Acceleration — Includes multimedia co‑processor support and NEON™ SIMD for improved media and signal processing throughput.
  • Memory Support — Integrated controllers for LPDDR, DDR2, DDR3 and DDR3L memory types to support a range of system memory configurations.
  • Display and UI — Built‑in LCD and touchscreen display interface controllers with graphics acceleration for human‑machine interfaces and graphical displays.
  • Wired Networking — Dual Ethernet interfaces supporting 10/100/1000 Mbps to enable high‑bandwidth network connectivity.
  • USB Connectivity — Two USB 2.0 ports with PHY for peripheral and host connectivity.
  • Additional Interfaces — On‑chip CAN interface for vehicle‑style or industrial fieldbus communications and other peripheral I/O.
  • Security — Integrated cryptography and a random number generator to support secure communications and data protection functions.
  • Package and Mounting — 298‑NFBGA (13×13) / 298‑LFBGA package options, surface mount; compact footprint for space‑constrained designs.
  • Operating Range — Commercial operating temperature range from 0 °C to 90 °C.
  • Compliance — RoHS compliant.

Typical Applications

  • Human‑Machine Interfaces (HMI) — Integrated LCD and touchscreen controllers plus graphics acceleration support responsive user interfaces and display rendering.
  • Industrial Networked Devices — Dual 10/100/1000 Mbps Ethernet ports provide the throughput needed for industrial gateways, controllers, and networked instrumentation.
  • Connectivity Hubs and Peripherals — Multiple USB 2.0 ports with PHY and CAN interface enable connection to a wide range of peripherals and field devices.
  • Embedded Multimedia Systems — NEON™ SIMD and multimedia co‑processor support enable audio/video and signal processing tasks in compact embedded platforms.

Unique Advantages

  • Integrated Connectivity: Dual gigabit Ethernet, dual USB 2.0 with PHY, and CAN on a single device reduce external components and simplify board design.
  • Flexible memory options: On‑chip controllers for LPDDR, DDR2, DDR3 and DDR3L allow designers to choose memory types that match performance and cost targets.
  • Security primitives on‑chip: Built‑in cryptography and a random number generator help implement secure communication and data protection without additional hardware.
  • Display and graphics support: LCD/touchscreen controllers with graphics acceleration enable compact HMIs without discrete graphics processors.
  • Compact, surface‑mount package: 298‑NFBGA (13×13) packaging provides a small footprint suitable for space‑constrained embedded systems.
  • Commercial grade reliability: Specified for 0 °C to 90 °C operation and RoHS compliant for standard commercial deployments.

Why Choose AM3352BZCE30?

The AM3352BZCE30 combines a 300 MHz ARM® Cortex®‑A8 core with a breadth of integrated interfaces—networking, USB, CAN, display controllers, and flexible memory support—making it well suited for embedded designs that require a balance of processing, connectivity, and multimedia capability in a compact package. As a member of the Sitara AM335x series from Texas Instruments, it offers a focused integration profile for commercial embedded systems requiring onboard display, secure communications, and multiple wired interfaces.

Choose the AM3352BZCE30 when your design demands a single‑chip microprocessor solution that consolidates connectivity and multimedia features while maintaining a small surface‑mount footprint and commercial temperature operation.

Request a quote or submit an inquiry for pricing and availability of the AM3352BZCE30 to begin integrating this Sitara AM335x microprocessor into your next embedded design.

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