AM3352BZCE30R

IC MPU SITARA 300MHZ 298NFBGA
Part Description

ARM® Cortex®-A8 Microprocessor IC Sitara™ 1 Core, 32-Bit 300MHz 298-NFBGA (13x13)

Quantity 1,787 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesSitara AM335x
ManufacturerTexas Instruments
Manufacturing StatusActive
Manufacturer Standard Lead Time6 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A8Device Package298-NFBGA (13x13)
Display & Interface ControllersLCD, TouchscreenECCN5A992CEthernet10/100/1000Mbps (2)
GradeCommercialGraphics AccelerationYesHTS Code8542.31.0001
Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface MountMounting TypeSurface Mount
Number of Cores/Bus Width1 Core, 32-BitOperating Temperature0°C ~ 90°C (TJ)Package / Case298-LFBGA
RAM ControllersLPDDR, DDR2, DDR3, DDR3LREACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 Compliant
Security FeaturesCryptography, Random Number GeneratorSpeed300MHzSupplier Device Package298-NFBGA (13×13)
USBUSB 2.0 + PHY (2)Voltage – I/O1.8V, 3.3V

Overview of AM3352BZCE30R – IC MPU SITARA 300MHZ 298NFBGA

The AM3352BZCE30R is a Sitara AM335x family microprocessor from Texas Instruments featuring a single ARM® Cortex®-A8 core running at 300 MHz. Designed for embedded applications, it combines a 32-bit application processor with multimedia/NEON SIMD acceleration, integrated display and connectivity controllers, and hardware security features.

This commercial-grade device (0 °C to 90 °C) is offered in a 298‑NFBGA (13×13) surface-mount package and targets embedded systems that require integrated networking, display, and memory flexibility within a compact footprint.

Key Features

  • Core Architecture — Single ARM® Cortex®-A8 core, 32-bit at 300 MHz for application processing and control.
  • Multimedia and DSP — Multimedia co-processor support with NEON™ SIMD for enhanced signal and media processing.
  • Memory Controllers — Built-in controllers for LPDDR, DDR2, DDR3 and DDR3L providing flexible DRAM options for a range of system memory needs.
  • Display and Graphics — Integrated LCD and touchscreen display controllers plus graphics acceleration to support user interfaces and HMIs.
  • Ethernet and USB Connectivity — Dual 10/100/1000 Mbps Ethernet interfaces and two USB 2.0 ports with PHY for robust wired networking and peripheral connectivity.
  • Additional Interfaces — CAN interface available for vehicle or industrial network integration.
  • Security — On-chip cryptography and a random number generator to support secure boot, encryption and device authentication schemes.
  • Package and Mounting — 298‑NFBGA (13×13) supplier package, surface-mount for compact board integration.
  • Operating Grade — Commercial grade device rated for 0 °C to 90 °C operating temperature.

Typical Applications

  • Industrial HMI and Control Panels — Integrated LCD/touchscreen controllers and graphics acceleration enable responsive user interfaces and local control displays.
  • Embedded Networking Appliances — Dual Gigabit Ethernet ports support networked embedded systems and gateway devices.
  • Multimedia and Imaging Devices — NEON™ SIMD and multimedia support assist in media processing tasks and accelerated graphical rendering.
  • USB-Connected Peripherals — Two USB 2.0 + PHY interfaces support a variety of external peripherals and host/device use cases.
  • Communication and CAN-enabled Systems — On-chip CAN interface provides connectivity for industrial and communication equipment.

Unique Advantages

  • Integrated Connectivity: Dual Gigabit Ethernet and dual USB 2.0 with PHY reduce external controller requirements and simplify board design.
  • Flexible Memory Support: Native controllers for LPDDR, DDR2, DDR3 and DDR3L enable designers to choose memory types that match performance and cost targets.
  • Built-in Security Primitives: Cryptography and a random number generator provide hardware foundations for secure system design without requiring separate security ICs.
  • Compact BGA Package: 298‑NFBGA (13×13) package delivers a high pin-count solution in a compact footprint for space-constrained designs.
  • Commercial Temperature Range: Rated 0 °C to 90 °C for reliable operation across standard commercial environments.
  • Multimedia Acceleration: NEON™ SIMD and graphics acceleration offload media tasks from the CPU core, enabling smoother UI and media handling.

Why Choose AM3352BZCE30R?

The AM3352BZCE30R positions itself as a tightly integrated single-core embedded processor that balances performance, multimedia capability, connectivity and security in a compact, surface-mount BGA package. Its combination of memory controller flexibility, dual GigE, USB 2.0, display and cryptographic features make it suitable for developers building industrial HMIs, networked appliances, multimedia-enabled embedded products and CAN-connected systems.

Backed by the Sitara AM335x family and manufactured by Texas Instruments, this device offers a practical platform for designers seeking predictable 300 MHz Cortex‑A8 processing with on-chip peripherals that reduce external BOM and simplify system integration.

To request pricing, availability or to submit a quote for the AM3352BZCE30R, please request a quote or submit an inquiry through your usual procurement channel.

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