AM3352BZCED30

IC MPU SITARA 300MHZ 298NFBGA
Part Description

ARM® Cortex®-A8 Microprocessor IC Sitara™ 1 Core, 32-Bit 300MHz 298-NFBGA (13x13)

Quantity 1,215 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesSitara AM335x
ManufacturerTexas Instruments
Manufacturing StatusActive
Manufacturer Standard Lead Time6 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A8Device Package298-NFBGA (13x13)
Display & Interface ControllersLCD, TouchscreenECCN5A992CEthernet10/100/1000Mbps (2)
GradeIndustrialGraphics AccelerationYesHTS Code8542.31.0001
Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface MountMounting TypeSurface Mount
Number of Cores/Bus Width1 Core, 32-BitOperating Temperature-40°C ~ 90°C (TJ)Package / Case298-LFBGA
RAM ControllersLPDDR, DDR2, DDR3, DDR3LREACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 Compliant
Security FeaturesCryptography, Random Number GeneratorSpeed300MHzSupplier Device Package298-NFBGA (13×13)
USBUSB 2.0 + PHY (2)Voltage – I/O1.8V, 3.3V

Overview of AM3352BZCED30 – IC MPU SITARA 300MHZ 298NFBGA

The AM3352BZCED30 is a Sitara AM335x series microprocessor from Texas Instruments featuring a single ARM® Cortex®-A8 32‑bit core running at 300 MHz. It is designed for embedded and industrial applications that require a compact, integrated processing solution with display, networking, USB and security capabilities.

With support for multiple memory types, dual Gigabit Ethernet ports, USB 2.0 with PHYs, and industrial temperature range, this device targets applications that need balanced processing performance, multimedia support and robust connectivity in a surface-mount BGA package.

Key Features

  • Core Single ARM® Cortex®-A8 32‑bit core at 300 MHz providing deterministic processing for embedded tasks.
  • Multimedia and SIMD Integrated multimedia and NEON™ SIMD co-processor capabilities to accelerate media and signal processing workloads.
  • Memory Controllers On-chip controllers for LPDDR, DDR2, DDR3 and DDR3L memory types to support flexible memory configurations.
  • Display and Graphics LCD and touchscreen display interface controllers plus graphics acceleration for human-machine interfaces and graphical displays.
  • Ethernet and Networking Two 10/100/1000 Mbps Ethernet ports for high-throughput wired network connectivity.
  • USB Two USB 2.0 ports with integrated PHYs for peripheral connectivity and data transfer.
  • Additional Interfaces CAN interface for vehicle and industrial control networks and other serial connectivity needs.
  • Security Features On-chip cryptography functions and a random number generator to support secure communications and system integrity.
  • Package and Mounting 298‑lead NFBGA 13×13 surface-mount package (298‑LFBGA / 298‑NFBGA) for compact board integration.
  • Industrial Grade and Temperature Rated for industrial operation with an operating temperature range of −40 °C to 90 °C and RoHS compliance.

Typical Applications

  • Industrial Automation — Control and monitoring nodes that require Ethernet connectivity, CAN interfaces and industrial temperature operation.
  • Human‑Machine Interfaces (HMI) — Touchscreen displays and graphical user interfaces using the LCD/touch controllers and graphics acceleration.
  • Networking and Communication Appliances — Edge devices and embedded routers that benefit from dual Gigabit Ethernet ports and USB connectivity.
  • Embedded Multimedia Devices — Low-to-mid performance multimedia and display-centric systems leveraging NEON™ SIMD and integrated graphics acceleration.

Unique Advantages

  • Single-chip integration: Combines CPU, multimedia co-processor, display controllers, memory controllers and multiple interfaces to reduce BOM and simplify board design.
  • Flexible memory support: Native controllers for LPDDR, DDR2, DDR3 and DDR3L enable designers to select memory technology that matches cost, density and power requirements.
  • Robust connectivity: Dual Gigabit Ethernet, dual USB 2.0 with PHY and CAN provide a broad set of wired I/O options for networked embedded systems.
  • Industrial readiness: Industrial-grade temperature range (−40 °C to 90 °C) and RoHS compliance support deployment in harsh environments.
  • Security primitives on-chip: Built-in cryptography and a random number generator help implement foundational security functions without external accelerators.
  • Compact BGA package: 298‑lead NFBGA (13×13) enables high-density PCB layouts while maintaining surface-mount manufacturability.

Why Choose AM3352BZCED30?

The AM3352BZCED30 positions itself as an industrial-grade Sitara AM335x microprocessor that balances processing capability with integrated multimedia, networking and security features. Its single ARM® Cortex®-A8 core at 300 MHz and NEON™ SIMD support make it suitable for embedded designs that require display handling, wired networking and secure connectivity within a compact package.

Backed by Texas Instruments' Sitara family pedigree and RoHS compliance, this part is appropriate for designers seeking a reliable, integrated MPU for industrial HMI, networking appliances, and other embedded systems that operate across a wide temperature range.

Request a quote or submit an inquiry for AM3352BZCED30 to receive pricing and availability information tailored to your design and volume requirements.

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