AM3352BZCZ60

IC MPU SITARA 600MHZ 324NFBGA
Part Description

ARM® Cortex®-A8 Microprocessor IC Sitara™ 1 Core, 32-Bit 600MHz 324-NFBGA (15x15)

Quantity 807 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesSitara AM335x
ManufacturerTexas Instruments
Manufacturing StatusActive
Manufacturer Standard Lead Time6 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A8Device Package324-NFBGA (15x15)
Display & Interface ControllersLCD, TouchscreenECCN5A992CEthernet10/100/1000Mbps (2)
GradeCommercialGraphics AccelerationYesHTS Code8542.31.0001
Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface MountMounting TypeSurface Mount
Number of Cores/Bus Width1 Core, 32-BitOperating Temperature0°C ~ 90°C (TJ)Package / Case324-LFBGA
RAM ControllersLPDDR, DDR2, DDR3, DDR3LREACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 Compliant
Security FeaturesCryptography, Random Number GeneratorSpeed600MHzSupplier Device Package324-NFBGA (15×15)
USBUSB 2.0 + PHY (2)Voltage – I/O1.8V, 3.3V

Overview of AM3352BZCZ60 – IC MPU SITARA 600MHZ 324NFBGA

The AM3352BZCZ60 is a Sitara™ microprocessor IC featuring a single ARM® Cortex®-A8 core running at 600 MHz in a 324‑NFBGA (15×15) surface‑mount package. Designed for embedded systems, it combines a 32‑bit application core with multimedia and SIMD acceleration and a broad set of on‑chip interfaces for display, networking, USB, and CAN connectivity.

Its integration of memory controllers, security primitives, graphics acceleration and multiple high‑speed interfaces makes it suitable for designs that require compact packaging, robust connectivity and on‑device multimedia processing within a commercial temperature range.

Key Features

  • Core — ARM® Cortex®‑A8 single 32‑bit core at 600 MHz for general‑purpose embedded processing.
  • Multimedia Acceleration — On‑chip multimedia co‑processors including NEON™ SIMD to accelerate media and signal processing workloads.
  • Memory Controllers — Supports LPDDR, DDR2, DDR3 and DDR3L memory interfaces to match a range of system memory requirements.
  • Display and Touch — Integrated LCD and touchscreen display interface controllers for human‑machine interface implementations.
  • Ethernet — Two 10/100/1000 Mbps Ethernet controllers for high‑speed wired networking and gateway applications.
  • USB — Two USB 2.0 controllers with PHY to support host and device peripheral connectivity.
  • CAN — CAN interface for robust serial networking in distributed embedded systems.
  • Security — Built‑in cryptography engines and a hardware random number generator to support secure communications and data protection.
  • Graphics — Graphics acceleration to offload display rendering tasks from the CPU.
  • Package & Mounting — 324‑NFBGA (15×15) package, surface‑mount mounting for compact board layouts; supplier package also listed as 324‑LFBGA.
  • Operating Range — Commercial grade operation from 0 °C to 90 °C.
  • RoHS Compliance — Device is RoHS compliant.

Typical Applications

  • Human‑Machine Interfaces (HMI) — Integrated LCD and touchscreen controllers plus graphics acceleration support responsive operator displays and control panels.
  • Embedded Gateways & Networked Devices — Dual Gigabit Ethernet and multiple USB ports enable networked embedded devices, protocol gateways and edge routers.
  • Multimedia and Signal Processing — NEON™ SIMD and multimedia co‑processors accelerate audio, video and image processing tasks in compact embedded platforms.
  • CAN‑Connected Systems — On‑chip CAN interface provides a communication option for distributed control networks and sensor/actuator connectivity.

Unique Advantages

  • Balanced Performance and Integration: A 600 MHz ARM® Cortex®‑A8 core combined with multimedia accelerators delivers usable application throughput while integrating key peripherals on‑chip to reduce external components.
  • Flexible Memory Support: Support for LPDDR, DDR2, DDR3 and DDR3L memory types lets designers choose memory technology based on power, cost or performance targets.
  • Rich Connectivity: Dual Gigabit Ethernet, dual USB 2.0 with PHY and CAN provide broad wired connectivity options without extensive external controllers.
  • Security Building Blocks: Hardware cryptography and a random number generator enable implementation of secure communication and storage features with on‑chip primitives.
  • Compact Surface‑Mount Package: 324‑NFBGA (15×15) packaging supports dense board layouts while maintaining a high pin count for rich I/O.
  • Commercial Temperature Range: Operation from 0 °C to 90 °C suits a wide range of commercial embedded applications.

Why Choose AM3352BZCZ60?

The AM3352BZCZ60 positions itself as a compact, integrated solution for embedded designs that need a balance of CPU performance, multimedia acceleration and extensive I/O in a single device. Backed by the Sitara AM335x series from Texas Instruments, it addresses use cases where display control, network connectivity and on‑chip security are required without a large external BOM.

This device is well suited for engineers and designers building commercial‑grade embedded systems that benefit from flexible memory options, multiple high‑speed interfaces and hardware security primitives, offering a platform that scales across a range of connected multimedia and control applications.

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