AM3352BZCZD60

IC MPU SITARA 600MHZ 324NFBGA
Part Description

ARM® Cortex®-A8 Microprocessor IC Sitara™ 1 Core, 32-Bit 600MHz 324-NFBGA (15x15)

Quantity 367 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesSitara AM335x
ManufacturerTexas Instruments
Manufacturing StatusActive
Manufacturer Standard Lead Time6 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A8Device Package324-NFBGA (15x15)
Display & Interface ControllersLCD, TouchscreenECCN5A992CEthernet10/100/1000Mbps (2)
GradeIndustrialGraphics AccelerationYesHTS Code8542.31.0001
Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface MountMounting TypeSurface Mount
Number of Cores/Bus Width1 Core, 32-BitOperating Temperature-40°C ~ 90°C (TJ)Package / Case324-LFBGA
RAM ControllersLPDDR, DDR2, DDR3, DDR3LREACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 Compliant
Security FeaturesCryptography, Random Number GeneratorSpeed600MHzSupplier Device Package324-NFBGA (15×15)
USBUSB 2.0 + PHY (2)Voltage – I/O1.8V, 3.3V

Overview of AM3352BZCZD60 – ARM® Cortex®‑A8 600 MHz Microprocessor

The AM3352BZCZD60 is an industrial-grade Sitara™ microprocessor featuring a single ARM® Cortex®‑A8 core running at 600 MHz. It targets embedded and industrial applications that require integrated connectivity, display support, multimedia acceleration and on-chip security.

With multiple memory controller options and a compact 324‑NFBGA (15×15) package, this device is designed for space-constrained boards that need robust networking, USB connectivity, and touchscreen/display support across an extended temperature range.

Key Features

  • Core  ARM® Cortex®‑A8 single 32‑bit core at 600 MHz providing general-purpose processing for embedded workloads.
  • Multimedia and DSP  On-chip multimedia co‑processors and NEON™ SIMD support for accelerated media and signal processing tasks.
  • Memory Interfaces  Integrated controllers for LPDDR, DDR2, DDR3 and DDR3L memory types to support a range of system memory configurations.
  • Graphics & Display  Graphics acceleration with display interface controllers for LCD and touchscreen integration suitable for HMI designs.
  • Connectivity  Dual Gigabit Ethernet (10/100/1000 Mbps), dual USB 2.0 with PHY, and CAN for common embedded networking and peripheral connectivity.
  • Security  Built‑in cryptography and a hardware random number generator to support device and data security functions.
  • Package & Mounting  324‑NFBGA (15×15) package, surface‑mount mounting type, enabling compact board layouts.
  • Industrial Temperature Range  Rated for operation from ‑40°C to 90°C for deployment in industrial environments.

Typical Applications

  • Industrial Control  Use in embedded controllers and automation equipment that require robust networking (Ethernet, CAN) and extended temperature operation.
  • Human‑Machine Interfaces (HMI)  Drives LCD and touchscreen displays with graphics acceleration and multimedia processing for intuitive operator interfaces.
  • Networked Embedded Systems  Ideal for Ethernet‑connected devices and gateways that need dual Gigabit ports and USB connectivity.
  • Multimedia and Signal Processing  Leverages NEON™ SIMD and multimedia co‑processors for media playback, encoding tasks, or sensor data processing.

Unique Advantages

  • Integrated Networking and I/O: Dual Gigabit Ethernet, dual USB 2.0 + PHY and CAN reduce external interfaces and simplify system design.
  • Flexible Memory Support: Native controllers for LPDDR, DDR2, DDR3 and DDR3L enable diverse memory choices to match cost and performance targets.
  • Media and Graphics Acceleration: Multimedia co‑processors and graphics acceleration offload CPU work for responsive user interfaces and media handling.
  • On‑chip Security Primitives: Built‑in cryptography and random number generation help implement secure boot and data protection mechanisms.
  • Industrial Reliability: Industrial grade rating and a −40°C to 90°C operating range support deployment in demanding environments.
  • Compact BGA Package: 324‑NFBGA (15×15) package enables dense PCB integration while maintaining high I/O count.

Why Choose AM3352BZCZD60?

The AM3352BZCZD60 combines a 600 MHz ARM® Cortex®‑A8 core with multimedia acceleration, comprehensive memory interface options, and broad connectivity in an industrial‑rated package. Its feature set addresses embedded designs that require networking, display/touch support, and on‑chip security while operating across a wide temperature range.

This part is well suited to engineers developing compact, connected embedded systems and industrial HMI or gateway products that prioritize integration, deterministic interfaces, and thermal robustness.

Request a quote or submit an inquiry to check availability and obtain pricing for the AM3352BZCZD60.

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