AM5726BABCXEA
| Part Description |
ARM® Cortex®-A15 Microprocessor IC Sitara™ 2 Core, 32-Bit 1.5GHz 760-FCBGA (23x23) |
|---|---|
| Quantity | 709 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | Sitara AM57xx |
| Manufacturer | Texas Instruments |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 6 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | DSP, IPU, VPE | Core Processor | ARM® Cortex®-A15 | Device Package | 760-FCBGA (23x23) | ||
|---|---|---|---|---|---|---|---|
| ECCN | 5A992C | Ethernet | GbE | Grade | Industrial | ||
| Graphics Acceleration | No | HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | ||
| Mounting Method | Surface Mount | Mounting Type | Surface Mount | Number of Cores/Bus Width | 2 Core, 32-Bit | ||
| Operating Temperature | -40°C ~ 105°C (TJ) | Package / Case | 760-BFBGA, FCBGA | RAM Controllers | DDR3, SRAM | ||
| REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | SATA | SATA 3Gbps (1) | ||
| Speed | 1.5GHz | Supplier Device Package | 760-FCBGA (23×23) | USB | USB 2.0 (1), USB 3.0 (1) | ||
| Voltage – I/O | 1.8V, 3.3V |
Overview of AM5726BABCXEA – IC MPU SITARA 1.5GHZ 760FCBGA
The AM5726BABCXEA is a Texas Instruments Sitara AM57xx series microprocessor IC featuring two ARM® Cortex®-A15 32‑bit cores clocked at 1.5 GHz. It targets embedded and industrial applications that require multi‑threaded processing alongside integrated memory controllers and a broad set of peripherals.
With integrated DDR3 and SRAM controllers, GbE, SATA and USB interfaces, plus dedicated DSP, IPU and VPE co‑processors, this industrial‑grade device combines processing performance and system integration for space‑constrained, surface‑mount designs. Qualification to AEC‑Q100 and an operating range of −40°C to 105°C support deployments in demanding environments.
Key Features
- Core and Performance Two ARM® Cortex®‑A15 32‑bit cores operating at 1.5 GHz to support multi‑tasking embedded workloads.
- Co‑processors for Media and Signal Processing Integrated DSP, IPU and VPE co‑processors provide dedicated hardware acceleration for signal and image processing tasks.
- Memory Controllers On‑chip controllers for DDR3 and SRAM enable high‑bandwidth system memory interfacing.
- High‑speed Connectivity Built‑in GbE for networking, one SATA 3 Gbps port for storage connectivity, and support for USB 2.0 and USB 3.0 peripherals.
- Package and Mounting 760‑ball FCBGA package (760‑FCBGA, 23×23) / 760‑BFBGA package options; surface‑mount mounting type for compact board designs.
- Industrial Temperature and Qualification Grade: Industrial with an operating temperature range of −40°C to 105°C and AEC‑Q100 qualification for elevated reliability requirements.
- Regulatory Compliance RoHS compliant to meet environmental requirements.
Typical Applications
- Industrial Embedded Systems Designed for embedded controllers and automation systems that require industrial temperature operation and AEC‑Q100 qualification.
- Networking Equipment GbE connectivity and dual‑core processing make it suitable for networked devices and edge routers.
- Storage and Gateway Appliances SATA 3 Gbps and USB 3.0 enable use in storage controllers, media gateways and appliance I/O hubs.
- HMI and Vision Subsystems DSP, IPU and VPE co‑processors support image and signal processing tasks in human‑machine interface and vision applications.
Unique Advantages
- High‑performance dual‑core CPU: 1.5 GHz ARM® Cortex®‑A15 dual cores provide deterministic processing headroom for compute‑intensive embedded workloads.
- Integrated peripheral set: On‑chip GbE, SATA and USB interfaces reduce external components and simplify board design.
- Dedicated media and signal engines: DSP, IPU and VPE offload specialized tasks from the main CPU cores to improve system efficiency.
- Industrial and AEC‑Q100 qualification: Industrial grade and AEC‑Q100 qualification support deployment in harsh and reliability‑sensitive environments.
- Compact FCBGA packaging: 760‑ball FCBGA (760‑FCBGA, 23×23) surface‑mount package enables high I/O density in compact form factors.
- RoHS compliance: Meets environmental compliance requirements for modern electronics production.
Why Choose AM5726BABCXEA?
The AM5726BABCXEA positions itself as a high‑integration microprocessor for embedded and industrial designs that need multi‑core Cortex‑A15 processing, dedicated media/signal co‑processors, and a broad peripheral set including GbE, SATA and USB. Its industrial temperature range and AEC‑Q100 qualification make it appropriate for applications that demand reliability across harsh operating conditions.
As part of the Sitara AM57xx family, this device offers a combination of performance, connectivity and system‑level integration that helps reduce board complexity and BOM count for compact, surface‑mount designs.
Request a quote or submit a procurement inquiry to begin specifying the AM5726BABCXEA for your next embedded or industrial design.

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