AM5726BABCX

IC MPU SITARA 1.5GHZ 760FCBGA
Part Description

ARM® Cortex®-A15 Microprocessor IC Sitara™ 2 Core, 32-Bit 1.5GHz 760-FCBGA (23x23)

Quantity 373 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesSitara AM57xx
ManufacturerTexas Instruments
Manufacturing StatusActive
Manufacturer Standard Lead Time6 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPDSP, IPU, VPECore ProcessorARM® Cortex®-A15Device Package760-FCBGA (23x23)
ECCN5A992CEthernetGbEGradeCommercial
Graphics AccelerationNoHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width2 Core, 32-Bit
Operating Temperature0°C ~ 90°C (TJ)Package / Case760-BFBGA, FCBGARAM ControllersDDR3, SRAM
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSATASATA 3Gbps (1)
Speed1.5GHzSupplier Device Package760-FCBGA (23×23)USBUSB 2.0 (1), USB 3.0 (1)
Voltage – I/O1.8V, 3.3V

Overview of AM5726BABCX – IC MPU SITARA 1.5GHZ 760FCBGA

The AM5726BABCX is a Sitara AM57xx series microprocessor from Texas Instruments featuring dual ARM® Cortex®-A15 cores running at up to 1.5 GHz. It is a high-performance embedded MPU designed for applications that require DSP, imaging and video processing co-processors alongside general-purpose ARM processing.

Built with integrated memory controllers and a broad set of IO, the AM5726BABCX targets embedded and industrial designs that need a compact, surface-mount solution in a 760‑FCBGA (23×23) package while meeting commercial grade and AEC‑Q100 qualification requirements.

Key Features

  • Core & Architecture Dual ARM® Cortex®-A15 cores, 32‑bit, up to 1.5 GHz for high-throughput embedded processing.
  • Co-Processors On-chip DSP, IPU and VPE co-processors to accelerate digital signal, image and video processing tasks.
  • Memory Interfaces Integrated DDR3 and SRAM controllers to support external memory subsystems.
  • Storage & USB Single SATA 3 Gbps interface plus USB 3.0 (1) and USB 2.0 (1) ports for storage and high-speed peripheral connectivity.
  • Networking & Fieldbus Gigabit Ethernet (GbE) and CAN interface support for wired networking and control-bus integration.
  • Package & Mounting 760‑ball FCBGA package (760‑FCBGA, 23×23) supplied for surface-mount assembly in space-constrained designs.
  • Qualification & Compliance Commercial grade device with AEC‑Q100 qualification and RoHS compliance.
  • Operating Conditions Specified operating temperature range: 0 °C to 90 °C.
  • Graphics No dedicated graphics acceleration on this device.

Typical Applications

  • Embedded Systems Use in compact embedded platforms that require dual‑core ARM processing with DSP and video processing co‑engines.
  • Industrial Control Integrate into industrial controllers and instrumentation leveraging GbE, CAN and robust memory interfaces.
  • Automotive-Grade Designs Applicable to automotive-related designs that require AEC‑Q100 qualified components and commercial temperature operation.
  • Edge Storage & Connectivity Implementations requiring SATA 3 Gbps and USB 3.0 connectivity alongside high-speed Ethernet.

Unique Advantages

  • Dual high‑speed ARM cores: Enables concurrent general-purpose processing and real-time offload to co-processors for compute-intensive embedded tasks.
  • Integrated co‑processors (DSP, IPU, VPE): Reduces system-level complexity by providing dedicated engines for signal, image and video processing.
  • Comprehensive I/O suite: GbE, CAN, SATA and USB 3.0/2.0 interfaces simplify connectivity for networking, storage and peripheral integration.
  • Qualified and compliant: AEC‑Q100 qualification and RoHS compliance support deployment in regulated and reliability-focused designs.
  • Compact FCBGA package: 760‑ball surface-mount package offers a high-density solution for space-constrained boards.
  • Commercial temperature range: Rated 0 °C to 90 °C for use in a broad set of commercial and industrial environments.

Why Choose AM5726BABCX?

The AM5726BABCX combines a dual ARM® Cortex®‑A15 processor subsystem with specialized DSP, IPU and VPE co‑processors and a broad set of high-speed interfaces to deliver a versatile MPU for embedded and industrial designs. Its package density, integrated memory controllers and I/O options make it suitable for compact systems that require mixed compute and media capabilities.

As part of the Texas Instruments Sitara AM57xx series, this AEC‑Q100 qualified, RoHS‑compliant device is positioned for applications where performance, integration and predictable operating conditions (0 °C to 90 °C) are important selection criteria.

Request a quote or submit an inquiry to obtain pricing, lead time and availability for the AM5726BABCX.

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