AM5718BABCXQ1
| Part Description |
ARM® Cortex®-A15 Microprocessor IC Sitara™ 1 Core, 32-Bit 1.5GHz 760-FCBGA (23x23) |
|---|---|
| Quantity | 127 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | Sitara AM57xx |
| Manufacturer | Texas Instruments |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | ARM® Cortex®-M4, BB2D, C66x, GPU, IVA | Core Processor | ARM® Cortex®-A15 | Device Package | 760-FCBGA (23x23) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | HDMI, LCD | ECCN | N/A | Ethernet | 10/100/1000Mbps (1) | ||
| Grade | Automotive | Graphics Acceleration | Yes | HTS Code | N/A | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | Mounting Type | Surface Mount | ||
| Number of Cores/Bus Width | 1 Core, 32-Bit | Operating Temperature | -40°C ~ 125°C (TJ) | Package / Case | 760-BFBGA, FCBGA | ||
| Qualification | AEC-Q100 | RAM Controllers | DDR3, SRAM | REACH Compliance | REACH Unknown | ||
| RoHS Compliance | ROHS3 Compliant | SATA | SATA 3Gbps (1) | Security Features | 3DES, AES, ARM TZ, Boot Security, Cryptography, MD5, SHA-1/2, TRNG | ||
| Speed | 1.5GHz | Supplier Device Package | 760-FCBGA (23×23) | USB | USB 2.0 + PHY (2), USB 3.0 + PHY (2) | ||
| Voltage – I/O | 1.8V, 3.3V |
Overview of AM5718BABCXQ1 – IC MPU SITARA CORTEX-A15 760BGA
The AM5718BABCXQ1 is a Sitara™ ARM® Cortex®-A15 microprocessor designed for embedded systems. It features a single 32-bit Cortex-A15 core running at 1.5 GHz and integrates a broad set of multimedia, real-time and security subsystems for complex embedded applications.
Targeted for embedded and automotive markets, this device combines high-performance processing, extensive I/O and hardware security features with automotive-grade qualification to support robust designs across temperature and operational environments.
Key Features
- Core and Processing Single ARM® Cortex®-A15 32-bit core at 1.5 GHz; includes additional on-chip accelerators and co-processors such as ARM® Cortex®-M4, C66x DSP cores, BB2D accelerator and IVA video subsystem as listed in device documentation.
- Memory and On-chip RAM Supports external DDR3 through an EMIF and on-chip L3 RAM (up to 512 KB reported in product documentation); EMIF supports DDR3-1333 and up to 2 GB across a single chip select per datasheet content.
- Multimedia and Graphics Display subsystem with Full-HD (1920 × 1080p, 60 fps) support, HDMI/DVI encoder support, 2D/3D graphics acceleration (BB2D and optional PowerVR SGX544), and video processing including H.264 encode/decode capabilities as documented.
- Security Hardware cryptography and boot security features including AES, 3DES, MD5, SHA-1/2, TRNG and TrustZone-based Trusted Execution Environment (TEE) support for a hardware-enforced root of trust and secure debug options.
- High-speed Interfaces Rich I/O including PCIe (two 5-Gbps lanes or configurable lanes), USB 3.0 and USB 2.0 dual-role with PHY, SATA Gen2 (3 Gbps), Gigabit Ethernet (10/100/1000 Mbps), and multiple UART, I2C, McSPI, QSPI and MMC/SD interfaces.
- Industrial and Real-time Subsystems Dual PRU-ICSS subsystems for real-time and industrial communications, multiple timers, EDMA controller and extensive GPIO availability as documented for the AM571x family.
- Connectivity and Vehicle Networks On-chip CANbus support (DCAN modules, CAN 2.0B protocol) and two-port Gigabit Ethernet switch capability suitable for networking and gateway applications.
- Package, Mounting and Temperature 760-pin FCBGA package (760-FCBGA, 23 × 23 mm), surface-mount, rated for an operating temperature range of −40 °C to 125 °C and AEC‑Q100 qualification for automotive-grade applications.
- Compliance RoHS compliant as indicated in the product information.
Typical Applications
- Automotive Infotainment High-performance application processor combining display, multimedia encode/decode and audio interfaces for vehicle infotainment systems, leveraging AEC‑Q100 qualification and wide operating temperature range.
- Industrial Vision and Edge Video Video processing engine, IVA subsystem and high-speed I/O (PCIe, USB 3.0, SATA) support camera input, H.264 encode/decode and storage for machine vision or edge recording solutions.
- Networking and Gateway Devices Integrated Gigabit Ethernet switching, PCIe and multiple peripheral interfaces enable industrial routers, gateways and communication controllers.
- Storage and Media Appliances SATA Gen2 plus USB 3.0 support for storage-focused applications such as networked video recorders and media servers.
Unique Advantages
- Highly Integrated Subsystem: Combines a Cortex‑A15 application core with DSP, IVA, graphics and microcontroller-class co-processors to consolidate processing and reduce external components.
- Automotive‑Grade Qualification: AEC‑Q100 qualification and −40 °C to 125 °C operating range enable deployment in demanding automotive and industrial environments.
- Extensive I/O and Interfaces: Variety of high-speed and legacy interfaces (PCIe, USB 3.0/2.0, SATA, GigE, CAN, MIPI CSI-2, multiple serial ports) simplifies system-level integration for diverse applications.
- Hardware Security and Trusted Boot: On-chip cryptographic accelerators, TRNG and secure boot mechanisms provide a hardware-enforced root of trust and support secure system designs.
- Multimedia and Graphics Capability: Full-HD display support, HDMI encoder and both 2D/3D acceleration options enable rich user interfaces and video processing within a single device.
Why Choose AM5718BABCXQ1?
The AM5718BABCXQ1 delivers a balanced combination of application processing performance, multimedia acceleration, extensive peripheral integration and hardware security needed for complex embedded and automotive designs. Its single Cortex‑A15 core at 1.5 GHz, complemented by DSPs, IVA and graphics accelerators, supports demanding multimedia and real-time workloads while reducing overall system BOM.
As part of the Sitara AM57xx family with documented on-chip debug and a wide set of interfaces, this device is well‑suited for design teams building infotainment, industrial vision, networking and storage solutions that require long-term reliability and robust integration options.
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