AM5718BABCXEQ1

The AM5718BABCXEQ1 is a Sitara™ ARM® Cortex®-A15 microprocessor IC offering a single 32-bit core running at 1.5 GHz in a 760-pin FCBGA package (23 × 23 mm). Designed for embedded systems, this device integrates high-performance processing with extensive multimedia, I/O and security subsystems to serve demanding applications across industrial, networking, and multimedia markets.

With integrated coprocessors, display and video engines, and a broad set of interfaces, the AM5718BABCXEQ1 delivers a balanced platform for designs that require compute performance, connectivity and system-level integration in a robust, AEC‑Q100 qualified package.

Key Features

• Core and Performance Single Arm® Cortex®‑A15 core at 1.5 GHz providing primary application processing for real‑time and high‑level tasks.
• Coprocessors & Accelerators Integrated coprocessors including Arm® Cortex®‑M4, C66x DSP cores, IVA and accelerator (BB2D) subsystems plus an available PowerVR® SGX544 3D GPU and Vivante® GC320 for graphics and video offload.
• Memory and Cache On‑chip L3 memory and support for DDR3/DDR3L external memory (EMIF) and SRAM controllers to address high bandwidth application needs.
• Display and Video Display subsystem supporting Full‑HD (1920 × 1080p, 60 fps), HDMI encoder (HDMI 1.4a/DVI 1.0 compliant), Video Processing Engine (VPE) and multiple video inputs/outputs for rich HMI and multimedia systems.
• High‑Speed Interfaces Rich peripheral set including Gigabit Ethernet (10/100/1000 Mbps), SATA Gen2 (3 Gbps), SuperSpeed USB 3.0 and USB 2.0 with PHYs, PCIe revision 3.0 lanes, MMC/SD/SDIO, QSPI and multiple UART/I2C/SPI ports.
• Automotive Qualification & Temperature Range Grade: Automotive with AEC‑Q100 qualification; operating temperature range from −40 °C to 125 °C for deployment in demanding environments.
• Security Hardware security features including AES, 3DES, MD5, SHA‑1/2, ARM TrustZone® support, secure boot with hardware root‑of‑trust and a true random number generator (TRNG) for cryptographic operations.
• Connectivity & Real‑time Integrated CANbus, dual controller area network modules, 2‑port Gigabit Ethernet switch and PRU‑ICSS real‑time subsystems for deterministic control and industrial communications.
• Package & Mounting 760‑pin FCBGA package (760‑FCBGA, 23 × 23 mm) intended for surface‑mount assembly in space‑constrained embedded designs.

Typical Applications

• Infotainment and HMI: Multimedia and display subsystems with HDMI, VPE and GPU support enable high‑resolution user interfaces and video playback.
• Industrial Automation: Real‑time PRU‑ICSS, deterministic interfaces and wide operating temperature range support industrial control and factory automation systems.
• Networking and Communications: Integrated Gigabit Ethernet, PCIe lanes and USB 3.0 make it suitable for networked devices and gateway/controllers requiring high throughput.
• Storage and Peripheral Controllers: On‑chip SATA Gen2, multiple USB controllers and extensive peripheral I/O simplify design of storage and peripheral aggregation devices.

Unique Advantages

• Highly integrated multimedia capability: Combined VPE, display controller, HDMI encoder and optional 3D GPU reduce external processor requirements for rich media applications.
• Comprehensive security foundation: Secure boot, cryptographic accelerators and ARM TrustZone® support enable hardware‑enforced root‑of‑trust and secure system architectures.
• Robust connectivity: Multiple high‑speed interfaces including Gigabit Ethernet, PCIe, USB 3.0 and SATA provide flexibility for networking and I/O‑intensive designs.
• Automotive‑grade reliability: AEC‑Q100 qualification and −40 °C to 125 °C operating range support deployment in harsh and temperature‑sensitive environments.
• Real‑time and DSP offload: PRU‑ICSS and C66x DSP cores enable deterministic control and heavy signal processing without burdening the host CPU.

Why Choose AM5718BABCXEQ1?

The AM5718BABCXEQ1 positions itself as a versatile embedded application processor that balances single‑core Cortex‑A15 performance with extensive on‑chip accelerators, security features and a broad set of I/O. Its integration of multimedia, real‑time subsystems and high‑speed connectivity makes it suited for designs that require both application processing and specialist offload capabilities.

Ideal for engineering teams building industrial, networking, infotainment or storage systems, this AEC‑Q100 qualified device delivers long‑term platform value through integrated features, scalable external memory support and robust security primitives, simplifying system architecture while supporting demanding environmental requirements.

Request a quote or submit a pricing inquiry for AM5718BABCXEQ1 to evaluate suitability for your next embedded design project.