AM5718BABCXEAS

The AM5718BABCXEAS is a Sitara AM57xx series microprocessor from Texas Instruments featuring a single ARM® Cortex®-A15 core running at 1.5 GHz. Designed for embedded and industrial applications, it combines high-performance processing with integrated multimedia, real-time subsystems, and extensive connectivity to support complex human-machine interfaces, vision, and communications gateways.

As an industrial-grade device with AEC-Q100 qualification and an operating range from −40°C to 105°C, the AM5718BABCXEAS delivers a compact, highly integrated platform for designs that require performance, security, and broad peripheral integration in a 760-pin FCBGA package.

Key Features

• Core and Processing  Single ARM® Cortex®-A15 32-bit microprocessor core at 1.5 GHz for application-level compute. Includes on-chip coprocessor subsystems listed in the product data for real-time and DSP acceleration.
• Heterogeneous Coprocessors  Integrated coprocessors include ARM® Cortex®-M4, C66x DSP cores, IVA (video/audio) and BB2D accelerators, and an available single-core PowerVR® SGX544 3D GPU for graphics acceleration and media processing.
• Memory and Caching  DDR3/DDR3L external memory interface supporting up to DDR3-1333 and up to 2 GB across a single chip select, plus up to 512 KB of on-chip L3 RAM and general SRAM controllers.
• Video, Imaging and Display  Display subsystem with HDMI/DVI encoder, LCD support, video processing engine (VPE), IVA-HD for H.264 4K @ 15 fps encode/decode and multiple pipeline support for Full-HD (1080p60) video and imaging workflows.
• Storage and Connectivity  Integrated interfaces include SATA Gen2, SuperSpeed USB 3.0 dual-role, USB 2.0 with PHY, PCIe® revision 3.0 lanes, 2-port Gigabit Ethernet switch, CAN, MIPI CSI-2 camera input, and multiple MMC/SD/SDIO and serial interfaces.
• Real-Time and I/O Subsystems  2× dual-core Programmable Real-Time Units and Industrial Communication Subsystems (PRU-ICSS), enhanced DMA (EDMA), general-purpose timers, and abundant GPIO for deterministic control and industrial communications.
• Security and Boot  Hardware-enforced secure boot, ARM TrustZone® based Trusted Execution Environment (TEE) support, cryptographic acceleration (AES, 3DES, MD5, SHA-1/2), true random number generator (TRNG), and secure debug controls.
• Package and Environmental  760-pin FCBGA (23 × 23 mm) surface-mount package, industrial grade, AEC-Q100 qualification, RoHS compliant, and operating temperature −40°C to 105°C.

Typical Applications

• Industrial Automation  Real-time control and communications where deterministic PRU subsystems and wide temperature range are required.
• Human‑Machine Interfaces (HMI)  Graphical user interfaces and display controllers leveraging the integrated GPU and display subsystems for Full‑HD content.
• Vision and Imaging  Camera input (MIPI CSI-2), IVA and VPE subsystems for video capture, encode/decode and pre-processing in vision systems.
• Networking and Gateways  Multi-protocol connectivity with Gigabit Ethernet, USB 3.0, PCIe and SATA for industrial gateways, routers, and edge devices.
• Secure Embedded Platforms  Systems requiring hardware root-of-trust, secure boot and cryptographic accelerators for protected firmware and data.

Unique Advantages

• High-performance single-core processing: 1.5 GHz ARM® Cortex®-A15 core provides application-level compute while offloading real-time and DSP tasks to integrated coprocessors.
• Broad multimedia and graphics integration: IVA-HD, VPE, and an available PowerVR® SGX544 GPU enable video encode/decode, display pipelines and 2D/3D acceleration with fewer external components.
• Comprehensive connectivity suite: Native support for Gigabit Ethernet, USB 3.0, PCIe, SATA, CAN and multiple serial interfaces reduces BOM and simplifies system design.
• Hardware security and trusted boot: On-chip cryptographic accelerators, TRNG, and secure boot features provide a hardware-enforced root-of-trust for secure embedded designs.
• Industrial-grade qualification: AEC-Q100 qualification, RoHS compliance and −40°C to 105°C operation support reliable deployment in demanding environments.
• Compact, high-density package: 760-FCBGA (23 × 23 mm) surface-mount package concentrates functionality in a space-efficient footprint suitable for compact embedded systems.

Why Choose AM5718BABCXEAS?

The AM5718BABCXEAS positions itself as a highly integrated, industrial-grade microprocessor for embedded designs that demand balanced application performance, multimedia capability and robust connectivity. Its mix of an ARM® Cortex®-A15 core, heterogeneous accelerators, secure boot and a rich set of interfaces makes it suitable for systems that consolidate application processing, vision, HMI and industrial communications.

Engineers targeting long-lived industrial and embedded products will find the AM5718BABCXEAS appropriate for designs requiring industrial temperature operation, AEC-Q100 qualification, and extensive on-chip peripherals to reduce component count and simplify system integration.

Request a quote or contact sales to discuss availability, pricing and how AM5718BABCXEAS can fit into your next embedded or industrial design.