AM5718ABCXE

IC MPU SITARA 1.5GHZ 760FCBGA
Part Description

ARM® Cortex®-A15 Microprocessor IC Sitara™ 1 Core, 32-Bit 1.5GHz 760-FCBGA (23x23)

Quantity 1,000 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesSitara AM57xx
ManufacturerTexas Instruments
Manufacturing StatusActive
Manufacturer Standard Lead Time28 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; GPU, IPU, VFPCore ProcessorARM® Cortex®-A15Device Package760-FCBGA (23x23)
ECCNPENDING ECCNEthernet10/100Mbps (1)GradeCommercial
Graphics AccelerationYesHTS Code0000.00.0000Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-Bit
Operating Temperature0°C ~ 90°C (TJ)Package / Case760-BFBGA, FCBGARAM ControllersDDR3, SRAM
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSATASATA 3Gbps (1)
Speed1.5GHzSupplier Device Package760-FCBGA (23×23)USBUSB 2.0 (1), USB 3.0 (1)
Voltage – I/O1.8V, 3.3V

Overview of AM5718ABCXE – IC MPU SITARA 1.5GHZ 760FCBGA

The AM5718ABCXE is an ARM® Cortex®-A15 Sitara™ microprocessor IC operating at 1.5 GHz in a 760-pin FCBGA (23 × 23 mm) package. It combines a high-performance 32-bit Cortex‑A15 core with a rich set of integrated multimedia, DSP and peripheral subsystems for embedded designs.

Targeted applications include industrial communication, human‑machine interfaces (HMI), automation and other high‑performance embedded systems where integrated video, storage and high‑speed I/O are required. The device offers a highly integrated mixed‑processor solution to simplify system design and reduce component count.

Key Features

  • Core  Single ARM® Cortex®‑A15 32‑bit core running at 1.5 GHz with Neon extensions.
  • DSP and Coprocessors  Includes a TI C66x VLIW floating‑point DSP and dual ARM® Cortex‑M4 coprocessors for offloading real‑time and signal processing tasks.
  • Memory Subsystem  DDR3/DDR3L memory interface (EMIF) supporting up to DDR3‑1333 and up to 2 GB across a single chip select; on‑chip L3 RAM and support for SRAM.
  • Multimedia and Graphics  Integrated IVA‑HD subsystem, video processing engine (VPE), Video Input Port (VIP) and available PowerVR® SGX544 3D GPU plus 2D/3D graphics support and display controller with HDMI encoder (HDMI 1.4a/DVI 1.0 compliant).
  • Storage and I/O  SATA Gen2 (3 Gbps), SuperSpeed USB 3.0 dual‑role and USB 2.0 high‑speed dual‑role support, PCI Express® 3.0 subsystems, and Quad SPI.
  • Networking and Comms  Ethernet subsystem (10/100 Mbps), dual CAN controllers (CAN 2.0B), multiple UARTs, SPI, I2C and McASP audio interfaces.
  • Real‑Time and Accelerators  PRU‑ICSS (programmable real‑time units), BB2D accelerator subsystem and Vivante™ GC320 core for specialized processing and offload.
  • Package and Operating Range  760‑pin FCBGA, 23 × 23 mm, 0.8 mm pitch; commercial grade with operating temperature range of 0 °C to 90 °C.
  • Qualification and Compliance  AEC‑Q100 qualification and RoHS compliant.

Typical Applications

  • Industrial Communication  Ideal for protocol bridging, gateway and industrial Ethernet applications that require integrated networking and real‑time processing.
  • Human‑Machine Interface (HMI)  Full‑HD video support, display controller and GPU options enable responsive graphical interfaces and multimedia playback for operator panels.
  • Automation and Control  On‑chip DSP, PRU real‑time units and multiple I/O interfaces support sensor fusion, motor control and embedded control tasks.
  • High‑Performance Embedded Systems  Combines a high‑speed application core, DSP acceleration and high‑speed I/O (USB 3.0, PCIe, SATA) for compute‑intensive applications requiring integrated peripherals.

Unique Advantages

  • Highly integrated multimedia subsystem: Combines IVA‑HD, VPE, VIP and optional 3D GPU to consolidate video capture, processing and display on a single device.
  • Heterogeneous processing mix: Cortex‑A15 application core plus C66x DSP and dual Cortex‑M4 coprocessors enable workload partitioning for control, signal processing and user‑space tasks.
  • Extensive high‑speed I/O: Built‑in USB 3.0, USB 2.0, SATA Gen2 and PCIe 3.0 interfaces simplify high‑bandwidth storage and peripheral integration.
  • Robust memory support: DDR3/DDR3L EMIF with support up to DDR3‑1333 and up to 2 GB single chip‑select simplifies system memory design.
  • Automotive‑grade qualification: AEC‑Q100 qualification and RoHS compliance provide an added level of component reliability and supply consistency for demanding environments.
  • Compact BGA package: 760‑pin FCBGA (23 × 23 mm, 0.8 mm pitch) enables dense integration in space‑constrained embedded boards.

Why Choose AM5718ABCXE?

The AM5718ABCXE delivers a balanced combination of application‑level performance and integrated multimedia and I/O subsystems, making it well suited for embedded designs that require video processing, real‑time control and high‑speed connectivity. Its heterogeneous architecture lets designers partition workloads—offloading DSP or real‑time tasks while keeping application logic on the Cortex‑A15 core.

With extensive peripheral support, AEC‑Q100 qualification, and a compact 760‑pin FCBGA package, the AM5718ABCXE is positioned for projects that demand integration, long‑term availability and ecosystem support for development of industrial, HMI and automated systems.

Request a quote or submit an inquiry to obtain pricing, lead times and availability for the AM5718ABCXE. Our team can provide volume pricing and supply information to support your design and procurement needs.

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