AM5K2E02ABD4
| Part Description |
ARM® Cortex®-A15 Microprocessor IC Sitara™ 2 Core, 32-Bit 1.4GHz 1089-FCBGA (27x27) |
|---|---|
| Quantity | 157 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | KeyStone AM5K2 |
| Manufacturer | Texas Instruments |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Network | Core Processor | ARM® Cortex®-A15 | Device Package | 1089-FCBGA (27x27) | ||
|---|---|---|---|---|---|---|---|
| ECCN | 5A991B4 | Ethernet | 1GBE (8) | Grade | Commercial | ||
| Graphics Acceleration | No | HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 4 (72 Hours) | ||
| Mounting Method | Surface Mount | Mounting Type | Surface Mount | Number of Cores/Bus Width | 2 Core, 32-Bit | ||
| Operating Temperature | 0°C ~ 85°C (TC) | Package / Case | 1089-BFBGA, FCBGA | RAM Controllers | DDR3, SRAM | ||
| REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | Speed | 1.4GHz | ||
| Supplier Device Package | 1089-FCBGA (27×27) | USB | USB 3.0 (2) | Voltage – I/O | 1.35V, 1.5V, 1.8V, 3.3V |
Overview of AM5K2E02ABD4 – IC MPU SITARA 1.4GHZ 1089FCBGA
The AM5K2E02ABD4 is an ARM® Cortex®-A15 Sitara™ microprocessor featuring dual 32-bit cores running at 1.4 GHz in a 1089-FCBGA (27×27) package. Designed for embedded systems, this commercial-grade device integrates high‑speed I/O and memory controllers to address connectivity- and throughput‑oriented applications.
As a member of the KeyStone AM5K2 series from Texas Instruments, the AM5K2E02ABD4 combines processing performance with on-chip interfaces and memory support to simplify system design for networking and embedded platforms operating in 0 °C to 85 °C environments.
Key Features
- Core and Performance Dual ARM® Cortex®-A15 32‑bit cores clocked at 1.4 GHz, providing multicore processing capability for compute and control tasks.
- Memory Interfaces On-chip controllers for DDR3 and SRAM to support system memory and local buffering requirements.
- High‑Speed Connectivity Multiple 1GBE interfaces (listed as 1GBE (8)) and two USB 3.0 ports enable high-throughput networking and peripheral connectivity.
- Co‑processing Network DSP co-processor capability to offload and accelerate network-oriented processing.
- System Interfaces External bus interfaces including EBI/EMI for flexible system integration with peripherals and memory components.
- Package and Mounting 1089‑FCBGA package (supplier device package: 1089‑FCBGA (27×27)), surface-mountable for compact board designs.
- Commercial Temperature Grade Rated for operation from 0 °C to 85 °C for commercial embedded deployments.
- Compliance RoHS compliant to meet standard environmental requirements.
- Graphics No graphics acceleration; device is focused on processor and network-centric tasks.
Typical Applications
- Embedded Networking Equipment — Multi‑port 1GbE interfaces and a network DSP enable use in routers, switches, and network appliances requiring packet processing and throughput.
- Communications Infrastructure — Dual Cortex‑A15 cores and high‑speed I/O support control-plane processing and peripheral interfacing in communications systems.
- Industrial Control — DDR3/SRAM memory support and EBI/EMI interfaces facilitate real-time control, data acquisition, and interfacing with industrial peripherals.
- High‑Performance Peripherals — USB 3.0 connectivity and on‑chip memory controllers allow integration with storage, cameras, and other high-bandwidth peripherals.
Unique Advantages
- Balanced Dual‑Core Performance: Two Cortex‑A15 cores at 1.4 GHz provide parallel processing capacity for control and data-plane tasks.
- Integrated Memory Support: DDR3 and SRAM controllers reduce external interface complexity and support memory-intensive workloads.
- Extensive I/O for Connectivity: Multiple 1GbE ports and two USB 3.0 ports enable high-throughput designs with fewer external controllers.
- Network Offload Capability: Built-in network DSP functionality helps offload packet processing and reduce main‑CPU load.
- Compact Surface‑Mount Package: 1089‑FCBGA (27×27) package supports dense PCB layouts while providing required I/O density.
- Commercial Temperature Rating: 0 °C to 85 °C operation allows deployment in a wide range of commercial embedded environments.
Why Choose AM5K2E02ABD4?
The AM5K2E02ABD4 delivers a combination of dual‑core ARM Cortex‑A15 performance and integrated connectivity that simplifies system architecture for embedded networking and communications designs. Its DDR3/SRAM memory support, multiple 1GbE interfaces, USB 3.0 ports, and network DSP capabilities make it a practical choice for applications that require both compute and high‑speed I/O in a compact surface‑mount package.
As part of the Texas Instruments KeyStone AM5K2 series, this device is positioned for developers and system designers aiming to balance processing throughput, interface integration, and deployment in commercial temperature environments.
If you would like pricing or availability, request a quote or submit a procurement inquiry for the AM5K2E02ABD4 to begin the procurement process.

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