AM5K2E02ABDA25
| Part Description |
ARM® Cortex®-A15 Microprocessor IC Sitara™ 2 Core, 32-Bit 1.25GHz 1089-FCBGA (27x27) |
|---|---|
| Quantity | 549 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | KeyStone AM5K2 |
| Manufacturer | Texas Instruments |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 6 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Network | Core Processor | ARM® Cortex®-A15 | Device Package | 1089-FCBGA (27x27) | ||
|---|---|---|---|---|---|---|---|
| ECCN | 5A991B4 | Ethernet | 1GBE (8) | Grade | Industrial | ||
| Graphics Acceleration | No | HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 4 (72 Hours) | ||
| Mounting Method | Surface Mount | Mounting Type | Surface Mount | Number of Cores/Bus Width | 2 Core, 32-Bit | ||
| Operating Temperature | -40°C ~ 100°C (TC) | Package / Case | 1089-BFBGA, FCBGA | RAM Controllers | DDR3, SRAM | ||
| REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | Speed | 1.25GHz | ||
| Supplier Device Package | 1089-FCBGA (27×27) | USB | USB 3.0 (2) | Voltage – I/O | 1.35V, 1.5V, 1.8V, 3.3V |
Overview of AM5K2E02ABDA25 – IC MPU SITARA 1.25GHZ 1089FCBGA
The AM5K2E02ABDA25 is a Sitara™ series microprocessor from Texas Instruments featuring a dual-core ARM® Cortex®-A15 architecture running at 1.25 GHz. Built on the KeyStone AM5K2 series, it targets industrial embedded systems that require multi-port networking, high-bandwidth I/O, and robust temperature operation.
Key value propositions include dual-core 32-bit processing, integrated memory controllers for DDR3 and SRAM, multiple 1GbE interfaces and USB 3.0 connectivity, all in a 1089-FCBGA (27×27) surface-mount package rated for industrial temperature ranges.
Key Features
- Core Dual ARM® Cortex®-A15 cores at 1.25 GHz providing 32-bit processing for embedded control and packet processing workloads.
- Memory Integrated controllers for DDR3 and SRAM to support system memory and fast on-chip/off-chip data buffering.
- Networking and DSP Network-focused co-processors (DSP) plus Ethernet capability listed as 1GBE (8), enabling multi-port 1 Gigabit Ethernet connectivity.
- High-speed I/O Two USB 3.0 interfaces for high-bandwidth peripheral and storage connectivity.
- Package and Mounting 1089-FCBGA (27×27) package, surface-mount mounting type suitable for compact board designs.
- Industrial Grade and Temperature Industrial-grade device rated for operation from -40 °C to 100 °C.
- System Interfaces External Bus Interface/External Memory Interface (EBI/EMI) for flexible system integration.
- Graphics No graphics acceleration included—focused on compute and networking tasks.
- Compliance RoHS compliant.
Typical Applications
- Industrial Networking Leverage multiple 1GbE interfaces and network co-processors for switches, gateways, and protocol aggregation.
- Edge and Communication Gateways Dual-core processing with DDR3 and SRAM support for protocol translation, local aggregation, and data buffering at the edge.
- High-Bandwidth I/O Systems USB 3.0 connectivity enables high-speed peripheral and storage interfaces for data acquisition and logging.
- Rugged Embedded Control Industrial temperature rating and surface-mount FCBGA packaging make it suitable for ruggedized embedded platforms.
Unique Advantages
- Balanced Dual-Core Performance: ARM® Cortex®-A15 dual cores at 1.25 GHz provide parallel processing capacity for control and data-plane tasks.
- Multi-Port Networking Capability: Ethernet specification (1GBE (8)) combined with network DSP co-processors supports designs that require dense Ethernet connectivity and packet processing.
- High-Speed Peripheral Support: Two USB 3.0 interfaces enable high-throughput connections for storage, cameras, or other peripherals.
- Flexible Memory Options: DDR3 and SRAM controllers allow designers to select memory topologies that match latency and capacity needs.
- Industrial Reliability: Industrial-grade classification and -40 °C to 100 °C operating range support deployment in harsh environments.
- Compact, Surface-Mount Package: 1089-FCBGA (27×27) package supports dense PCB layouts while providing the I/O needed for complex embedded systems.
Why Choose AM5K2E02ABDA25?
The AM5K2E02ABDA25 combines dual ARM® Cortex®-A15 cores, extensive networking and I/O capabilities, and industrial temperature robustness in a compact 1089-FCBGA package. It is positioned for embedded designs that require deterministic processing, multi-port Ethernet connectivity, and high-speed peripheral interfaces without integrated graphics acceleration.
This part is well suited to system designers developing industrial networking equipment, edge gateways, and high-throughput embedded platforms that value integration, supported memory interfaces, and operating-range reliability backed by Texas Instruments' Sitara KeyStone series pedigree.
Request a quote or submit an inquiry to obtain pricing, availability, and lead-time information for the AM5K2E02ABDA25.

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