AM5K2E04XABD25

IC MPU SITARA 1.25GHZ 1089FCBGA
Part Description

ARM® Cortex®-A15 Microprocessor IC Sitara™ 4 Core, 32-Bit 1.25GHz 1089-FCBGA (27x27)

Quantity 218 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesKeyStone AM5K2
ManufacturerTexas Instruments
Manufacturing StatusActive
Manufacturer Standard Lead Time6 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPNetworkCore ProcessorARM® Cortex®-A15Device Package1089-FCBGA (27x27)
ECCN5A002A1Ethernet1GBE (8), 10GBE (2)GradeCommercial
Graphics AccelerationNoHTS Code8542.31.0001Moisture Sensitivity Level4 (72 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width4 Core, 32-Bit
Operating Temperature0°C ~ 85°C (TC)Package / Case1089-BFBGA, FCBGARAM ControllersDDR3, SRAM
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSpeed1.25GHz
Supplier Device Package1089-FCBGA (27×27)USBUSB 3.0 (2)Voltage – I/O1.35V, 1.5V, 1.8V, 3.3V

Overview of AM5K2E04XABD25 – IC MPU SITARA 1.25GHZ 1089FCBGA

The AM5K2E04XABD25 is a Texas Instruments Sitara microprocessor IC from the KeyStone AM5K2 series. It integrates an ARM® Cortex®‑A15 quad‑core 32‑bit processor running at 1.25 GHz in a high‑density 1089‑FCBGA (27×27 mm) package for embedded applications.

Designed for embedded and networking-oriented systems, the device provides multiple high‑speed interfaces and memory controllers to support data‑intensive workloads and system integration at the board level. It is offered in a commercial grade device with surface‑mount packaging and RoHS compliance.

Key Features

  • Processor Core  Quad ARM® Cortex®‑A15 cores, 32‑bit architecture, operating at 1.25 GHz for multi‑threaded embedded processing.
  • Memory Controllers  Integrated DDR3 and SRAM memory controllers to support external system memory and fast on‑board storage.
  • Networking and DSP  Network DSP co‑processor resources and multiple Ethernet interfaces, including eight 1GbE and two 10GbE ports, for high‑throughput communications.
  • High‑speed USB  Two USB 3.0 ports for host or device connectivity supporting high‑bandwidth peripheral interfaces.
  • Additional Interfaces  EBI/EMI support for external bus expansion and peripheral interfacing to simplify system-level integration.
  • Package & Mounting  1089‑FCBGA supplier package (27×27 mm) with surface‑mount mounting for compact, board‑level deployment; also listed as 1089‑BFBGA/FCBGA package case.
  • Operating Range & Grade  Commercial grade device with an operating temperature range of 0 °C to 85 °C and RoHS compliance.
  • Graphics  No graphics acceleration — optimized for compute and networking tasks rather than GPU workloads.

Typical Applications

  • Networking & Communications  Multi‑port 1GbE and 10GbE capability and network DSP support make this device suitable for routers, switches, and line cards requiring embedded packet processing.
  • Embedded Compute Platforms  Quad‑core Cortex‑A15 performance with DDR3/SRAM controllers fits compact embedded systems that need multi‑threaded application processing.
  • High‑Bandwidth Peripheral Systems  Systems requiring USB 3.0 connectivity and external bus interfaces (EBI/EMI) can use this MPU to manage high‑speed peripherals and subsystems.
  • Industrial and Commercial Equipment  Commercial grade temperature range and surface‑mount BGA package support deployment in industrial control and commercial embedded solutions.

Unique Advantages

  • Quad‑core ARM® Cortex®‑A15 Processing  Four 32‑bit cores at 1.25 GHz provide concurrency for multitasking embedded workloads and protocol stacks.
  • Robust Networking Interfaces  Multiple 1GbE and 10GbE ports together with a network DSP enable high‑throughput data plane implementations and offload support.
  • Flexible Memory Connectivity  On‑chip DDR3 and SRAM controllers simplify memory subsystem design and enable responsive system performance.
  • High‑speed Peripheral Support  Dual USB 3.0 ports and EBI/EMI support provide direct connectivity to high‑bandwidth peripherals and external devices.
  • Compact, Surface‑Mount BGA  1089‑FCBGA (27×27 mm) packaging enables high‑density board designs while maintaining established surface‑mount assembly workflows.
  • Commercial Grade and RoHS‑Compliant  Ship‑ready commercial grading and RoHS compliance simplify regulatory and procurement considerations for non‑automotive embedded projects.

Why Choose AM5K2E04XABD25?

The AM5K2E04XABD25 positions performance and integration for embedded and networking applications requiring multi‑core processing and extensive I/O. Its combination of a quad‑core Cortex‑A15 core cluster, comprehensive memory controllers, numerous Ethernet ports, and USB 3.0 connectivity addresses system designs that need compute throughput alongside high‑bandwidth interfaces.

As part of the KeyStone AM5K2 series from Texas Instruments, this device is suited for designers building compact, surface‑mount embedded platforms that demand modular memory support, flexible bus interfaces, and commercial temperature operation. The device’s packaging and interface set provide a scalable foundation for systems where networked data processing and peripheral throughput are primary concerns.

Request pricing and availability or submit a quote to evaluate the AM5K2E04XABD25 for your next embedded or networking design.

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