AM6234ATCGGAALW
| Part Description |
ARM® Cortex®-A53 Microprocessor IC Sitara™ 4 Core, 64-Bit 1.4GHz 425-FCCSP (13x13) |
|---|---|
| Quantity | 305 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | Sitara AM62x |
| Manufacturer | Texas Instruments |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | ARM® Cortex®-M4F | Core Processor | ARM® Cortex®-A53 | Device Package | 425-FCCSP (13x13) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | LVDS | ECCN | 5A992C | Ethernet | 10/100 Mbps (2), 10/100/1000 Mbps (2) | ||
| Grade | Industrial | Graphics Acceleration | Yes | HTS Code | 8542.31.0001 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | Mounting Type | Surface Mount | ||
| Number of Cores/Bus Width | 4 Core, 64-Bit | Operating Temperature | -40°C ~ 105°C (TJ) | Package / Case | 425-VFBGA, FCCSPBGA | ||
| RAM Controllers | DDR4, LPDDR4 | REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | ||
| Security Features | AES, ARM TZ, Cryptography, DRBG, ECC, MD5, PKA, Random Number Generator, RSA, Secure Boot, SHA2, SMS | Speed | 1.4GHz | Supplier Device Package | 425-FCCSP (13×13) | ||
| USB | USB 2.0 (2) | Voltage – I/O | 1.1V, 1.2V, 1.8V, 3.3V |
Overview of AM6234ATCGGAALW – ARM Cortex-A53 4‑Core 1.4 GHz Sitara Microprocessor
The AM6234ATCGGAALW is a Sitara AM62x family microprocessor from Texas Instruments featuring a quad Arm® Cortex®‑A53 application cluster running up to 1.4 GHz and an integrated Arm® Cortex®‑M4F coprocessor. It combines high‑performance application processing, real‑time MCU capability, advanced multimedia and graphics, and extensive security to address embedded and industrial designs.
Targeted for industrial and safety‑focused embedded systems, this device delivers display and camera subsystems, multiple high‑speed network interfaces, and memory subsystem support for DDR4 and LPDDR4—packaged in a 425‑pin FCCSP and rated for operation from ‑40 °C to 105 °C.
Key Features
- Processor core Quad 64‑bit Arm® Cortex®‑A53 cluster up to 1.4 GHz with shared 512 KB L2 cache (SECDED ECC), plus a single‑core Arm® Cortex®‑M4F microcontroller for real‑time tasks.
- On‑chip memory Up to 816 KB of on‑chip RAM across multiple protected banks (including 256 KB for the M4F) with SECDED ECC where specified for integrity.
- DDR memory subsystem Supports DDR4 and LPDDR4 memory types with a 16‑bit data bus, inline ECC and support for speeds up to 1600 MT/s; addressable ranges per datasheet.
- Multimedia & graphics Dual display support capable of 1920×1080 @60 fps per display, OLDI (4‑lane LVDS) and 24‑bit DPI output; integrated 3D GPU with OpenGL ES 3.1 and Vulkan 1.2 support and high fillrate/texel throughput.
- Camera and DMA MIPI® CSI‑2 receiver (1×, up to 4 lanes, D‑PHY) with DMA path to DDR for camera streaming and ECC/CRC checks on incoming data.
- Interfaces & connectivity Dual 10/100 Mbps Ethernet ports and dual 10/100/1000 Mbps Ethernet ports, plus two USB 2.0 controllers and additional DMA for high‑throughput I/O.
- Security Comprehensive security capabilities including hardware‑enforced root‑of‑trust, secure boot, Arm® TrustZone®, cryptographic acceleration (AES, RSA, SHA2, ECC, PKA), DRBG, RNG, and secure storage/RPMB support.
- Functional safety & qualification Developed with functional safety in mind: targeted support for ISO 26262 system design, systematic capability up to ASIL D targeted and hardware integrity up to ASIL B targeted; device family AEC‑Q100 qualified.
- Package, mounting & environmental 425‑pin FCCSP (13×13 mm) surface‑mount package, industrial grade operation from ‑40 °C to 105 °C, and RoHS compliant.
Typical Applications
- Industrial control & automation Deterministic M4F real‑time control plus A53 application processing, industrial temperature rating, and multiple Ethernet interfaces for factory networks.
- Human‑machine interfaces (HMIs) & displays Dual 1080p display support and GPU acceleration enable rich graphical user interfaces and multi‑layer composition for operator panels and kiosks.
- Vision & camera processing MIPI CSI‑2 receiver with DMA to DDR and ECC/CRC verification supports camera ingestion and preprocessing for machine vision and imaging tasks.
- Safety‑focused embedded systems Functional‑safety design targets, hardware integrity features, and extensive security blocks make the device suitable for designs requiring documented safety considerations.
Unique Advantages
- Balanced application and real‑time processing: Quad Cortex‑A53 cores for applications and a Cortex‑M4F for deterministic control reduce the need for separate MCUs.
- Integrated multimedia and graphics: Dual display pipelines, 3D GPU and camera interface simplify HMI and vision subsystems and reduce external component count.
- Built‑in security and root‑of‑trust: Hardware secure boot, TrustZone and cryptographic accelerators enable secure device provisioning, firmware protection and data protection.
- Memory and IO flexibility: DDR4/LPDDR4 support with inline ECC, multiple Ethernet ports and USB controllers accommodate high‑bandwidth, networked embedded designs.
- Industrial and safety credentials: AEC‑Q100 qualification for the device family, functional safety targeting and extended temperature operation support robust deployment in demanding environments.
Why Choose AM6234ATCGGAALW?
The AM6234ATCGGAALW is positioned for embedded and industrial systems that require a combination of application performance, deterministic control and integrated multimedia/security subsystems. With a quad‑core Cortex‑A53 cluster, an M4F coprocessor, comprehensive memory and IO options, and explicit functional‑safety and security features, it helps reduce BOM complexity while addressing performance and integrity requirements.
This device is well suited for engineers building industrial HMIs, vision systems, safety‑oriented products and networked embedded platforms that demand industrial temperature range, RoHS compliance and a 425‑pin FCCSP package for compact high‑density designs.
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