AM6234ATCGHAALW
| Part Description |
ARM® Cortex®-A53 Microprocessor IC Sitara™ 4 Core, 64-Bit 1.4GHz 425-FCCSP (13x13) |
|---|---|
| Quantity | 818 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | Sitara AM62x |
| Manufacturer | Texas Instruments |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | ARM® Cortex®-M4F | Core Processor | ARM® Cortex®-A53 | Device Package | 425-FCCSP (13x13) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | LVDS, MIPI/CSI, MIPI-DPI, OLDI | ECCN | 5A992C | Ethernet | 10/100/1000Mbps (2) | ||
| Grade | Industrial | Graphics Acceleration | Yes | HTS Code | 8542.31.0001 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | Mounting Type | Surface Mount | ||
| Number of Cores/Bus Width | 4 Core, 64-Bit | Operating Temperature | -40°C ~ 105°C (TJ) | Package / Case | 425-VFBGA, FCCSPBGA | ||
| RAM Controllers | DDR4, LPDDR4 | REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | ||
| Security Features | AES, ARM TZ, Cryptography, DRBG, ECC, MD5, PKA, Random Number Generator, RSA, Secure Boot, SHA2, SMS | Speed | 1.4GHz | Supplier Device Package | 425-FCCSP (13×13) | ||
| USB | USB 2.0 (2) | Voltage – I/O | 1.1V, 1.2V, 1.8V, 3.3V |
Overview of AM6234ATCGHAALW – ARM® Cortex®-A53 Sitara™ 4‑Core 64‑Bit 1.4GHz Microprocessor
The AM6234ATCGHAALW is a Sitara AM62x series microprocessor featuring a quad ARM® Cortex®-A53 cluster running up to 1.4 GHz, combined with a single-core ARM® Cortex®-M4F subsystem. It targets Internet of Things (IoT) and gateway applications with integrated multimedia, security, and connectivity building blocks.
Designed for industrial-grade deployments and AEC‑Q100 qualification across the series, the device delivers a balance of compute, graphics/camera support, and hardware-enforced security suited for edge compute, display, and safety-focused embedded systems.
Key Features
- CPU & MCU Quad ARM® Cortex®-A53 64‑bit cluster up to 1.4 GHz with 512 KB L2 shared cache; includes a single-core ARM® Cortex®-M4F MCU up to 400 MHz for real-time tasks.
- Memory Subsystem DDR subsystem supports DDR4 and LPDDR4 memory types with inline ECC; on-chip RAM totaling up to hundreds of KB with SECDED ECC across multiple SRAM banks.
- Graphics & Display Integrated 3D GPU supporting OpenGL ES 3.1 and Vulkan 1.2 with support for Full HD output (up to 1920×1080 @60fps per display) and multiple display interfaces including OLDI, LVDS, MIPI DPI.
- Camera & Multimedia MIPI CSI-2 camera interface (up to 4 lanes, 1.5 Gbps per lane) with DMA streaming to DDR and ECC/CRC verification for image integrity.
- Security Hardware-enforced Root-of-Trust, Trusted Execution Environment (Arm TrustZone®), dedicated security controller with HSM core, cryptographic accelerators (AES, RSA, SHA2, DRBG, PKA, ECC), secure boot and secure storage features.
- Connectivity Dual Gigabit Ethernet ports (10/100/1000 Mbps) and two USB 2.0 ports for peripheral and network interfacing.
- Reliability & Functional Safety Series targets functional safety with documentation to aid ISO 26262 system design and planned ISO 26262 certification; hardware integrity and systematic capability targeted for safety levels indicated in the series documentation.
- Industrial Grade & Temperature Industrial-grade device with operating temperature range of -40 °C to 105 °C and AEC‑Q100 qualification listed for the series.
- Package & Mounting 425‑FCCSP (13×13) surface mount package (425‑VFBGA / FCCSPBGA family).
Typical Applications
- IoT Gateways & Edge Compute Use the quad Cortex‑A53 cluster and Cortex‑M4F to run cloud‑connected edge software while handling local real‑time tasks and secure boot/crypto operations.
- Automotive Infotainment & Safety Systems Display and camera subsystems combined with targeted functional safety capabilities make this device suitable for infotainment, driver information, and safety‑assisted designs aligned with series safety documentation.
- Industrial HMI & Vision High‑performance graphics, dual display support, and MIPI camera input support rich human‑machine interfaces and machine vision applications in industrial environments.
- Secure Embedded Gateways On‑chip security controller, cryptographic accelerators, and secure storage support protected communication and device identity in critical deployments.
Unique Advantages
- Heterogeneous Processing Model: Combination of quad Cortex‑A53 application cores and a Cortex‑M4F real‑time core lets designers partition high‑level OS workloads and deterministic tasks efficiently.
- Integrated Multimedia & Vision: Native support for Full HD displays, 3D GPU acceleration, and MIPI CSI camera input reduces external component count for video and vision systems.
- Comprehensive Security Building Blocks: Hardware Root‑of‑Trust, programmable HSM, cryptographic engines, and secure boot simplify implementation of secure devices and protected update paths.
- Memory Integrity: SECDED ECC for caches and on‑chip RAM plus inline ECC for external DDR improves system data integrity for safety and reliability targets.
- Industrial & Automotive Qualification: Industrial temperature range and series AEC‑Q100 qualification support deployment in harsh and safety‑conscious environments.
- Connectivity and I/O Density: Dual gigabit Ethernet, USB 2.0 ports, multiple display interfaces, and DMA reduce external bridging and simplify board design.
Why Choose AM6234ATCGHAALW?
The AM6234ATCGHAALW brings a balanced, integrated platform for embedded designs that require application‑level processing, real‑time control, multimedia capabilities, and hardware‑rooted security. Its combination of quad Cortex‑A53 cores, a Cortex‑M4F MCU, GPU acceleration, camera/display interfaces, and ECC‑protected memory addresses the needs of IoT gateways, industrial HMIs, and safety‑oriented systems.
This device is positioned for developers seeking a robust, scalable SoC platform with series support for functional safety design and industrial qualification. The on‑chip security and multimedia features reduce BOM and design complexity while the memory and package options support production‑grade deployments in demanding temperature ranges.
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