ATSAMA5D225C-D1M-CUR

IC MPU SAMA5D2 500MHZ 196TFBGA
Part Description

ARM® Cortex®-A5 Microprocessor IC SAMA5D2 1 Core, 32-Bit 500MHz 196-TFBGA (11x11)

Quantity 561 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesSAMA5D2
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time4 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ MPECore ProcessorARM® Cortex®-A5Device Package196-TFBGA (11x11)
Display & Interface ControllersKeyboard, LCD, TouchscreenECCN5A992CEthernet10/100Mbps (1)
GradeIndustrialGraphics AccelerationYesHTS Code8542.31.0001
Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface MountMounting TypeSurface Mount
Number of Cores/Bus Width1 Core, 32-BitOperating Temperature-40°C ~ 85°C (TA)Package / Case196-TFBGA, CSBGA
RAM ControllersLPDDR1, LPDDR2, LPDDR3, DDR2, DDR3, DDR3L, QSPIREACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 Compliant
Security FeaturesARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTCSpeed500MHzSupplier Device Package196-TFBGA (11×11)
USBUSB 2.0 + HSICVoltage – I/O3.3V

Overview of ATSAMA5D225C-D1M-CUR – IC MPU SAMA5D2 500MHZ 196TFBGA

The ATSAMA5D225C-D1M-CUR is a single-core ARM® Cortex®-A5 microprocessor IC running at 500 MHz in a 196-TFBGA (11×11) package. It targets embedded and industrial applications requiring a compact, industrial-grade MPU with integrated interfaces, security features, and multimedia acceleration.

Designed for embedded system designers, this SAMA5D2-series device combines a 32-bit Cortex‑A5 core with a broad set of memory controller support, connectivity options and hardware security to simplify design and support robust operation from -40 °C to 85 °C.

Key Features

  • Core – ARM® Cortex®-A5 single core, 32‑bit, running at 500 MHz for deterministic embedded performance.
  • Memory controllers – Integrated controllers supporting LPDDR1, LPDDR2, LPDDR3, DDR2, DDR3, DDR3L and QSPI to match a range of external memory configurations.
  • Security – Hardware security features including ARM TrustZone (TZ), boot security, cryptography, RTIC, Secure Fusebox, Secure JTAG, secure memory and secure RTC for protected boot and data handling.
  • Connectivity & peripherals – On‑chip 10/100 Mbps Ethernet, USB 2.0 with HSIC, I²C and display interface controllers for keyboard, LCD and touchscreen support.
  • Multimedia & graphics – Multimedia co-processor support with NEON™ MPE and graphics acceleration for GUI and multimedia tasks.
  • Power & I/O – 3.3 V I/O voltage; surface-mount 196-TFBGA package simplifies board-level integration.
  • Package & temperature – 196‑TFBGA (11×11) package, surface mount, industrial operating temperature range of -40 °C to 85 °C.

Typical Applications

  • Human‑Machine Interfaces (HMI) – Drives LCD and touchscreen interfaces and offloads graphics with hardware acceleration for responsive user interfaces.
  • Industrial control – Industrial-grade temperature rating and Ethernet connectivity make it suitable for controllers and instrumentation in harsh environments.
  • Secure embedded gateways – On-chip security features (TrustZone, secure boot, cryptography) enable protected communications and device authentication.
  • Multimedia endpoints – NEON MPE and graphics acceleration support audio/video processing and display applications in embedded devices.
  • Peripheral hubs and USB devices – USB 2.0 + HSIC and multiple peripheral interfaces support host and device connectivity roles in compact designs.

Unique Advantages

  • Comprehensive interface set: Ethernet, USB, I²C and display controllers reduce the need for external bridge chips and simplify BOM.
  • Broad memory support: Built‑in controllers for DDR/LPDDR and QSPI allow designers to choose memory technologies that match performance and cost targets.
  • Industry‑grade reliability: Rated for -40 °C to 85 °C and supplied in a robust surface‑mount TFBGA package for industrial deployments.
  • Built‑in security primitives: Multiple hardware security features support secure boot, cryptography and protected debug to harden designs against tampering.
  • Multimedia acceleration: NEON™ MPE and graphics acceleration enable richer UIs and media handling while offloading the main core.
  • Compact integration: TFBGA package and integrated peripheral set help minimize PCB area and simplify routing for compact embedded boards.

Why Choose ATSAMA5D225C-D1M-CUR?

The ATSAMA5D225C-D1M-CUR provides a balanced combination of a 500 MHz Cortex‑A5 core, extensive memory controller support, hardware security and multimedia capabilities in an industrial-grade 196‑TFBGA package. It is suited to embedded engineers who need a compact MPU platform that addresses connectivity, security and user‑interface demands without adding unnecessary external components.

Built by Microchip Technology as part of the SAMA5D2 series, this part is appropriate for designs that require predictable single‑core performance, a wide selection of RAM interface options, and on‑chip security functions for long‑term, reliable operation in industrial environments.

Request a quote or submit an inquiry to check pricing and availability for ATSAMA5D225C-D1M-CUR and to discuss how it can fit into your next embedded design.

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