ATSAMA5D21B-CUR
| Part Description |
ARM® Cortex®-A5 Microprocessor IC SAMA5D2 1 Core, 32-Bit 500MHz 196-TFBGA (11x11) |
|---|---|
| Quantity | 754 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | SAMA5D2 |
| Manufacturer | Microchip Technology |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Multimedia; NEON™ MPE | Core Processor | ARM® Cortex®-A5 | Device Package | 196-TFBGA (11x11) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | Keyboard, LCD, Touchscreen | ECCN | 5A992C | Ethernet | 10/100Mbps (1) | ||
| Grade | Industrial | Graphics Acceleration | Yes | HTS Code | 8542.31.0001 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | Mounting Type | Surface Mount | ||
| Number of Cores/Bus Width | 1 Core, 32-Bit | Operating Temperature | -40°C ~ 85°C (TA) | Package / Case | 196-TFBGA, CSBGA | ||
| RAM Controllers | LPDDR1, LPDDR2, LPDDR3, DDR2, DDR3, DDR3L, QSPI | REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | ||
| Security Features | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC | Speed | 500MHz | Supplier Device Package | 196-TFBGA (11×11) | ||
| USB | USB 2.0 + HSIC | Voltage – I/O | 3.3V |
Overview of ATSAMA5D21B-CUR – IC MPU SAMA5D2 500MHZ 196TFBGA
The ATSAMA5D21B-CUR is an ARM® Cortex®-A5 microprocessor IC from Microchip Technology, featuring a single 32‑bit core running at 500 MHz in a 196‑TFBGA (11×11) package. It targets embedded applications that require industrial-grade operation, integrated connectivity and display interfaces, and on‑chip security capabilities.
Key Features
- Core and Acceleration ARM® Cortex®‑A5 single core, 32‑bit at 500 MHz with multimedia co‑processor support and NEON™ MPE for enhanced media processing.
- Memory and Storage Interfaces Multiple RAM controller support including LPDDR1/LPDDR2/LPDDR3, DDR2, DDR3, DDR3L and QSPI for flexible memory subsystem design.
- Display and User Interface Integrated controllers for keyboard, LCD and touchscreen interfaces and on‑chip graphics acceleration to support HMI implementations.
- Connectivity Single 10/100 Mbps Ethernet interface and USB 2.0 with HSIC support for common wired networking and peripheral connectivity.
- Security and Safe Boot Comprehensive security features including ARM TrustZone (TZ), boot security, cryptography, real-time internal controller (RTIC), secure fusebox, secure JTAG, secure memory and secure RTC.
- Power and I/O 3.3 V I/O voltage specification for straightforward interfacing with standard embedded peripherals.
- Package and Mounting 196‑TFBGA (11×11) CSBGA package, surface mount, suitable for compact board designs.
- Industrial Temperature Range Rated for operation from −40 °C to 85 °C, supporting industrial deployment requirements.
- Additional Interfaces I2C available for common sensor and peripheral interfacing.
Typical Applications
- Industrial Control Single‑core processing with Ethernet and robust I/O options for embedded controllers and automation systems operating in industrial temperature ranges.
- Human‑Machine Interfaces (HMI) LCD, touchscreen controllers and graphics acceleration make this device suited for operator panels and touchscreen displays.
- Secure Embedded Systems On‑chip TrustZone, secure boot and cryptography enable deployment in systems that require hardware‑rooted security.
- Connectivity Gateways USB 2.0 and 10/100 Ethernet support edge devices and gateways that bridge peripherals and networks.
Unique Advantages
- Integrated Multimedia Acceleration: NEON™ MPE and multimedia co‑processor support reduce external processing requirements for media and signal tasks.
- Flexible Memory Support: Wide range of supported RAM types (LPDDR1/2/3, DDR2/3/3L, QSPI) simplifies migration across memory technologies.
- Comprehensive On‑Chip Security: Multiple hardware security mechanisms (ARM TZ, secure JTAG, secure fusebox, secure memory, secure RTC) help protect boot and runtime integrity.
- Industrial‑Grade Operation: −40 °C to 85 °C rating and surface‑mount 196‑TFBGA package enable deployment in harsh environments and compact designs.
- Integrated UI and Connectivity: On‑chip display controllers, graphics acceleration, Ethernet and USB reduce board‑level complexity for connected HMIs and gateways.
Why Choose ATSAMA5D21B-CUR?
The ATSAMA5D21B-CUR combines a 500 MHz ARM® Cortex®‑A5 core with multimedia acceleration, extensive memory interface support and a broad set of connectivity and display interfaces, delivering a highly integrated solution for industrial embedded designs. Its comprehensive hardware security features and industrial temperature rating make it suitable for applications that require secure operation and reliable performance.
Backed by Microchip Technology and provided in a compact 196‑TFBGA package with 3.3 V I/O, this device is appropriate for developers seeking a single‑chip MPU platform that balances performance, integration and ruggedness for long‑lifecycle embedded products.
Request a quote or submit an inquiry for pricing and availability of ATSAMA5D21B-CUR to evaluate it for your next embedded design.

Date Founded: 1989
Headquarters: Chandler, Arizona, USA
Employees: 22,000+
Revenue: $8.349 Billion
Certifications and Memberships: ISO9001:2015, IATF16949:2016, AS 9100D