ATSAMA5D28C-LD2G-CU

The ATSAMA5D28C-LD2G-CU is a single‑core ARM® Cortex®-A5 32‑bit microprocessor running at 500 MHz, offered in a 289-LFBGA (14×14) surface-mount package. Designed for embedded and industrial applications, this SAMA5D2 family device combines processing performance with system integration and on-chip security features to address human‑machine interfaces, networked devices, and industrial control systems.

As described in the SAMA5D2 System‑in‑Package documentation, the platform integrates the Cortex‑A5 MPU with memory options in a compact package to simplify PCB routing, reduce area and assist signal‑integrity and EMI/ESD design considerations.

Key Features

• Core — ARM® Cortex®-A5 single core, 32‑bit operating at 500 MHz for general embedded processing workloads.
• Memory interface — On-chip controllers supporting LPDDR1, LPDDR2, LPDDR3, DDR2, DDR3, DDR3L and QSPI memory interfaces to accommodate a range of system memory configurations.
• System-in-Package integration — SAMA5D2 SIP approach combines MPU and SDRAM in-package to reduce PCB routing complexity, board area and layer count as noted in the product documentation.
• Multimedia and acceleration — Multimedia co‑processor support including NEON™ MPE and graphics acceleration for responsive GUIs and media tasks; display interface controllers include keyboard, LCD and touchscreen support.
• Connectivity — Integrated 10/100 Mbps Ethernet (1) and USB 2.0 with HSIC for wired networking and peripheral connectivity; additional interfaces include I2C.
• Security — Multiple security features including ARM TrustZone (TZ), boot security, cryptography, RTIC, secure fusebox, secure JTAG, secure memory and secure RTC to help protect code and data.
• Power and IO — 3.3 V I/O voltage for standard embedded interfacing.
• Package and mounting — 289‑LFBGA (14×14) supplier device package, surface mount.
• Operating range — Industrial temperature grade: −40 °C to 85 °C for use in extended ambient environments.
• Compliance — RoHS compliant.

Typical Applications

• Industrial HMI and control panels — LCD and touchscreen support plus graphics acceleration enable responsive user interfaces and local control in industrial environments.
• Embedded networking devices — 10/100 Mbps Ethernet and USB 2.0 with HSIC provide the connectivity needed for gateways, protocol converters and networked controllers.
• Multimedia-enabled embedded systems — NEON™ MPE and graphics acceleration support multimedia processing and UI rendering in compact embedded products.
• Secure embedded applications — Built‑in TrustZone and secure boot/cryptography features help protect firmware and data in connected devices.

Unique Advantages

• Highly integrated SIP design: System‑in‑Package integration of the MPU and SDRAM reduces PCB routing complexity, board area and layer count as documented for the SAMA5D2 SIP.
• Broad memory support: Native controllers for LPDDR1/2/3, DDR2/3/3L and QSPI provide flexibility in selecting memory architectures for performance or cost tradeoffs.
• Industrial temperature rating: −40 °C to 85 °C operation supports deployment in extended-temperature embedded and industrial environments.
• Comprehensive security stack: Multiple hardware and boot security features enable stronger platform protection for embedded applications.
• Standard I/O and connectivity: 3.3 V I/O, Ethernet, USB and I2C simplify integration with common peripherals and networks.
• Vendor backing: Part of the Microchip Technology SAMA5D2 family with documented system‑in‑package design guidance in the product documentation.

Why Choose ATSAMA5D28C-LD2G-CU?

The ATSAMA5D28C-LD2G-CU positions itself as a compact, industrial‑grade embedded MPU delivering single‑core Cortex‑A5 performance at 500 MHz with extensive memory and security features integrated into a 289‑LFBGA package. Its SIP heritage and supported memory interfaces simplify board design while retaining flexibility for a range of embedded use cases.

This device is suited to designers seeking a secure, connected and graphics‑capable MPU for industrial and embedded products where PCB area, signal integrity and extended temperature operation matter, and where manufacturer documentation for system‑in‑package integration is required.

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