DRA714BFGCBDRQ1

The DRA714BFGCBDRQ1 is an ARM® Cortex®-A15 microprocessor IC from the Jacinto DRA71x family, delivering a single 32‑bit Cortex‑A15 core at 750 MHz in a 538‑FCBGA (17 × 17 mm) package. The device is designed for multimedia‑focused embedded systems with integrated video, image, and graphics processing capabilities.

Targeted use cases include automotive infotainment and human‑machine interface applications where integration, security features, and extended temperature operation are required. The device combines processing, DSP/image subsystems, rich I/O and security features to simplify system design in demanding environments.

Key Features

• Core and Performance Single ARM® Cortex®‑A15 core running at 750 MHz for application processing in embedded multimedia systems.
• Co‑processors and Accelerators Integrated co‑processors including ARM® Cortex®‑M4 image processing units, BB2D 2D graphics accelerator (Vivante® GC320), C66x DSP, IVA and a single‑core PowerVR™ SGX544 3D GPU to offload media workloads.
• Memory and Storage DDR3/DDR3L memory controller supporting DDR‑1333 (667 MHz) and up to 2 GB across a single chip select, plus up to 512 KB on‑chip L3 RAM for low‑latency buffering.
• Graphics and Video Full‑HD video support (1920 × 1080p, 60 fps), display controller with DMA and up to three pipelines, HDMI and LCD display interfaces, and a Video Processing Engine (VPE) for robust multimedia handling.
• Connectivity and Peripherals Extensive I/O including USB 3.0 (SuperSpeed) and USB 2.0, dual Ethernet ports (10/100 and 10/100/1000), PCIe 3.0 subsystems (two 5‑Gbps lanes), MIPI CSI‑2, multiple UART/I2C/SPI interfaces, MMC/SD/SDIO, CAN (DCAN), and HDQ/1‑Wire®.
• Security and System Integrity Hardware cryptography accelerators and DMA, secure boot and secure storage, device identity, isolation firewalls, JTAG lock and software IP protection for secure system deployment.
• Package and Thermal 538‑ball FCBGA package (17 × 17 mm, 0.65 mm pitch) with surface mount mounting and an operating temperature range of −40 °C to 125 °C.
• Automotive Qualification Grade: Automotive with AEC‑Q100 qualification for designs requiring automotive‑grade component qualification.
• On‑chip Debug and Integration On‑chip debug with CTools technology and a broad set of peripherals and memory interfaces to accelerate system integration and bring‑up.

Typical Applications

• Infotainment and Multimedia Systems — Full‑HD video, GPU and dedicated video engines enable multimedia playback and advanced user interfaces in in‑vehicle infotainment units.
• Human‑Machine Interface (HMI) — Display controller, graphics acceleration and multiple touch/display interfaces support modern automotive HMI and center stack applications.
• Navigation Systems — High‑performance application core and rich connectivity (Ethernet, USB, PCIe, SDIO) support navigation data processing and map handling.
• Digital Cluster and Instrumentation — Graphics acceleration and secure storage features support digital instrument clusters and instrument panels with protected firmware and content.

Unique Advantages

• Highly integrated multimedia platform: On‑chip GPU, 2D accelerator, VPE and IVA subsystems reduce external component count for video and graphics applications.
• Automotive‑grade qualification: AEC‑Q100 qualification plus −40 °C to 125 °C operating range supports deployment in automotive environments.
• Flexible memory and display support: DDR3/DDR3L interface with up to DDR‑1333 support and multiple display pipelines simplify performance scaling and UI designs.
• Extensive connectivity portfolio: USB 3.0, USB 2.0, dual Ethernet, PCIe 3.0, CAN, MIPI CSI‑2 and numerous serial interfaces provide broad system integration options.
• Built‑in security primitives: Hardware crypto, secure boot, isolation firewalls and secure storage enable secure system architectures and IP protection.
• Compact, production‑ready package: 538‑FCBGA (17 × 17 mm) form factor balances pin‑count and PCB area for automotive embedded modules.

Why Choose DRA714BFGCBDRQ1?

The DRA714BFGCBDRQ1 positions itself as a focused, multimedia‑capable microprocessor for embedded and automotive infotainment applications that require media acceleration, broad I/O and robust security. Its combination of an ARM® Cortex®‑A15 application core, multiple media accelerators and a wide set of interfaces delivers integration that simplifies system BOM and design complexity.

For designs demanding automotive qualification, extended temperature operation and comprehensive security features, this device provides a scalable platform for HMI, navigation, digital clusters and multimedia systems, helping enable long‑lived, robust embedded products.

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