DRA716BHGCBDQ1
| Part Description |
ARM® Cortex®-A15 Microprocessor IC DRA71x 1 Core, 32-Bit 750MHz 538-FCBGA (17x17) |
|---|---|
| Quantity | 787 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | Jacinto DRA71x |
| Manufacturer | Texas Instruments |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | ARM® Cortex®-M4, BB2D, C66x, GPU, IVA | Core Processor | ARM® Cortex®-A15 | Device Package | 538-FCBGA (17x17) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | HDMI, LCD | ECCN | N/A | Ethernet | 10/100/1000Mbps (1), 1Gbps (2) | ||
| Grade | Automotive | Graphics Acceleration | Yes | HTS Code | N/A | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | Mounting Type | Surface Mount | ||
| Number of Cores/Bus Width | 1 Core, 32-Bit | Operating Temperature | -40°C ~ 125°C (TJ) | Package / Case | 538-LFBGA, FCBGA | ||
| Qualification | AEC-Q100 | RAM Controllers | DDR3, DDR3L | REACH Compliance | REACH Unknown | ||
| RoHS Compliance | ROHS3 Compliant | Security Features | Cryptography, Debug Security, Device Identity, Isolation Firewalls, Secure Boot, Secure Storage, Software IP Protection | Speed | 750MHz | ||
| Supplier Device Package | 538-FCBGA (17×17) | USB | USB 2.0 (2), USB 3.0 (1) | Voltage – I/O | 1.35V, 1.5V, 1.8V, 3.3V |
Overview of DRA716BHGCBDQ1 – IC MPU DRA71X CORTEX-A15 538BGA
The DRA716BHGCBDQ1 is an ARM® Cortex®-A15 based microprocessor from Texas Instruments' Jacinto DRA71x family. It implements a single 32-bit Cortex-A15 core running at 750 MHz in a 538‑FCBGA (17 × 17 mm) surface-mount package.
Designed for automotive infotainment and human‑machine interface applications, the device integrates high‑performance compute with multimedia, video and graphics subsystems, plus on-chip security and automotive qualification for harsh operating conditions.
Key Features
- Core Single Arm® Cortex®‑A15 32‑bit core running at 750 MHz for general-purpose application processing.
- Memory and On‑chip RAM DDR3/DDR3L memory interface supporting up to DDR‑1333 (667 MHz) and up to 2 GB across a single chip select, plus up to 512 KB of on‑chip L3 RAM.
- Graphics and Video Full HD video support (1920 × 1080p, 60 fps), 2D/3D graphics acceleration with PowerVR™ SGX544 GPU and Vivante® GC320 BB2D, HDMI 1.4a encoder and configurable display pipelines.
- DSP and Co‑processing Integrated DSP and image-processing resources including C66x floating‑point VLIW DSP, dual Cortex‑M4 image processing units (IPU) and IVA‑HD subsystem for offloading media and vision workloads.
- High‑speed Interfaces USB 3.0 (SuperSpeed) dual‑role, USB 2.0 ports, PCI Express® 3.0 lanes, multiple Gigabit Ethernet ports, HDMI, MIPI CSI‑2, and a broad set of peripheral buses (I2C, UART, SPI, McASP, QSPI, MMC/SD/SDIO).
- Security and System Integrity Hardware cryptography accelerators and DMA, secure boot, secure storage, device identity, isolation firewalls and debug security features.
- Automotive Qualification and Reliability AEC‑Q100 qualification, automotive grade designation, and an extended operating temperature range of −40 °C to 125 °C.
- Package and Process 538‑ball FCBGA (17 × 17 mm, 0.65 mm pitch) surface‑mount package built on 28‑nm CMOS technology.
Typical Applications
- Human‑Machine Interface (HMI) Drives rich vehicle touch and graphical interfaces using integrated 2D/3D graphics, display controllers and multimedia processing.
- In‑Vehicle Navigation Supports navigation systems with multimedia playback and multiple display outputs for maps and routing.
- Automotive Multimedia and Radio Enables digital and analog radio, multimedia playback and infotainment features with onboard audio and video processing.
- Digital Cluster and Display Audio Systems Targets instrument clusters and display audio systems that require full‑HD video, graphics acceleration and secure operation.
Unique Advantages
- Automotive‑qualified processing: AEC‑Q100 qualification and −40 °C to 125 °C rating support deployment in automotive electronic systems.
- Highly integrated multimedia subsystem: On‑chip GPU, VPE, IVA and display controllers reduce external component count for infotainment designs.
- Flexible high‑bandwidth I/O: DDR3/DDR3L memory support, USB 3.0, PCIe 3.0 and multiple Gigabit Ethernet ports enable high throughput system architectures.
- Built‑in security primitives: Hardware crypto, secure boot, secure storage and isolation firewalls help protect software IP and device identity.
- Co‑processing for specialized tasks: Integrated C66x DSP and dual Cortex‑M4 IPUs allow offloading of signal, image and audio processing from the main CPU.
- Compact automotive package: 17 × 17 mm 538‑FCBGA delivers a small board footprint while supporting extensive peripheral connectivity.
Why Choose DRA716BHGCBDQ1?
The DRA716BHGCBDQ1 combines a 750 MHz Cortex‑A15 application core with dedicated multimedia, DSP and graphics subsystems in a single automotive‑qualified package, offering a balanced solution for infotainment, HMI and cluster designs that require multimedia performance, robust security and extended temperature operation.
Its integrated memory interfaces, high‑speed I/O and on‑chip security primitives make it suitable for engineers designing production automotive systems who need a compact, validated processor platform with on‑chip debugging and proven silicon from Texas Instruments' DRA71x family.
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