DRA716BHGCBDQ1

IC MPU DRA71X CORTEX-A15 538BGA
Part Description

ARM® Cortex®-A15 Microprocessor IC DRA71x 1 Core, 32-Bit 750MHz 538-FCBGA (17x17)

Quantity 787 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesJacinto DRA71x
ManufacturerTexas Instruments
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPARM® Cortex®-M4, BB2D, C66x, GPU, IVACore ProcessorARM® Cortex®-A15Device Package538-FCBGA (17x17)
Display & Interface ControllersHDMI, LCDECCNN/AEthernet10/100/1000Mbps (1), 1Gbps (2)
GradeAutomotiveGraphics AccelerationYesHTS CodeN/A
Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface MountMounting TypeSurface Mount
Number of Cores/Bus Width1 Core, 32-BitOperating Temperature-40°C ~ 125°C (TJ)Package / Case538-LFBGA, FCBGA
QualificationAEC-Q100RAM ControllersDDR3, DDR3LREACH ComplianceREACH Unknown
RoHS ComplianceROHS3 CompliantSecurity FeaturesCryptography, Debug Security, Device Identity, Isolation Firewalls, Secure Boot, Secure Storage, Software IP ProtectionSpeed750MHz
Supplier Device Package538-FCBGA (17×17)USBUSB 2.0 (2), USB 3.0 (1)Voltage – I/O1.35V, 1.5V, 1.8V, 3.3V

Overview of DRA716BHGCBDQ1 – IC MPU DRA71X CORTEX-A15 538BGA

The DRA716BHGCBDQ1 is an ARM® Cortex®-A15 based microprocessor from Texas Instruments' Jacinto DRA71x family. It implements a single 32-bit Cortex-A15 core running at 750 MHz in a 538‑FCBGA (17 × 17 mm) surface-mount package.

Designed for automotive infotainment and human‑machine interface applications, the device integrates high‑performance compute with multimedia, video and graphics subsystems, plus on-chip security and automotive qualification for harsh operating conditions.

Key Features

  • Core Single Arm® Cortex®‑A15 32‑bit core running at 750 MHz for general-purpose application processing.
  • Memory and On‑chip RAM DDR3/DDR3L memory interface supporting up to DDR‑1333 (667 MHz) and up to 2 GB across a single chip select, plus up to 512 KB of on‑chip L3 RAM.
  • Graphics and Video Full HD video support (1920 × 1080p, 60 fps), 2D/3D graphics acceleration with PowerVR™ SGX544 GPU and Vivante® GC320 BB2D, HDMI 1.4a encoder and configurable display pipelines.
  • DSP and Co‑processing Integrated DSP and image-processing resources including C66x floating‑point VLIW DSP, dual Cortex‑M4 image processing units (IPU) and IVA‑HD subsystem for offloading media and vision workloads.
  • High‑speed Interfaces USB 3.0 (SuperSpeed) dual‑role, USB 2.0 ports, PCI Express® 3.0 lanes, multiple Gigabit Ethernet ports, HDMI, MIPI CSI‑2, and a broad set of peripheral buses (I2C, UART, SPI, McASP, QSPI, MMC/SD/SDIO).
  • Security and System Integrity Hardware cryptography accelerators and DMA, secure boot, secure storage, device identity, isolation firewalls and debug security features.
  • Automotive Qualification and Reliability AEC‑Q100 qualification, automotive grade designation, and an extended operating temperature range of −40 °C to 125 °C.
  • Package and Process 538‑ball FCBGA (17 × 17 mm, 0.65 mm pitch) surface‑mount package built on 28‑nm CMOS technology.

Typical Applications

  • Human‑Machine Interface (HMI) Drives rich vehicle touch and graphical interfaces using integrated 2D/3D graphics, display controllers and multimedia processing.
  • In‑Vehicle Navigation Supports navigation systems with multimedia playback and multiple display outputs for maps and routing.
  • Automotive Multimedia and Radio Enables digital and analog radio, multimedia playback and infotainment features with onboard audio and video processing.
  • Digital Cluster and Display Audio Systems Targets instrument clusters and display audio systems that require full‑HD video, graphics acceleration and secure operation.

Unique Advantages

  • Automotive‑qualified processing: AEC‑Q100 qualification and −40 °C to 125 °C rating support deployment in automotive electronic systems.
  • Highly integrated multimedia subsystem: On‑chip GPU, VPE, IVA and display controllers reduce external component count for infotainment designs.
  • Flexible high‑bandwidth I/O: DDR3/DDR3L memory support, USB 3.0, PCIe 3.0 and multiple Gigabit Ethernet ports enable high throughput system architectures.
  • Built‑in security primitives: Hardware crypto, secure boot, secure storage and isolation firewalls help protect software IP and device identity.
  • Co‑processing for specialized tasks: Integrated C66x DSP and dual Cortex‑M4 IPUs allow offloading of signal, image and audio processing from the main CPU.
  • Compact automotive package: 17 × 17 mm 538‑FCBGA delivers a small board footprint while supporting extensive peripheral connectivity.

Why Choose DRA716BHGCBDQ1?

The DRA716BHGCBDQ1 combines a 750 MHz Cortex‑A15 application core with dedicated multimedia, DSP and graphics subsystems in a single automotive‑qualified package, offering a balanced solution for infotainment, HMI and cluster designs that require multimedia performance, robust security and extended temperature operation.

Its integrated memory interfaces, high‑speed I/O and on‑chip security primitives make it suitable for engineers designing production automotive systems who need a compact, validated processor platform with on‑chip debugging and proven silicon from Texas Instruments' DRA71x family.

Request a quote or submit a parts request to receive pricing and lead‑time information for DRA716BHGCBDQ1.

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